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New technique reveals 3D shape of nanostructure's polariton interaction

05/21/2018  New method improves upon common spectroscopic imaging technique: scattering-type scanning near-field optical microscopy (s-SNOM), makes it possible to obtain polaritonic, mechanical and electrical information simultaneously with one measurement.

Global semiconductor glass wafer market to witness growth through 2022 owing to the proliferation of IoT

05/18/2018  Technavio projects the global semiconductor glass wafer market to post a CAGR of more than 6% during the forecast period. The emergence of advanced and compact consumer electronic devices is a key driver, which is expected to impact market growth.

Keep the light off: A material with improved mechanical performance in the dark

05/18/2018  Researchers at Nagoya University find an inorganic semiconductor is brittle when exposed to light, but flexible in the dark.

SEMI opposes trade tariffs against China, cites damaging impact to chip industry in U.S. government testimony

05/18/2018  Testifying before a U.S. interagency panel weighing trade tariffs against China, a representative from the semiconductor manufacturing industry yesterday called for the removal of more than 100 products from the list of proposed tariffs, stressing that an escalation of the U.S.-Sino dispute could trigger a full-blown trade war and hasten deep, unintended damage including higher consumer prices, an expanded U.S. trade deficit, and a slowdown in U.S. economic growth.

Plasma-Therm earns multiple 'RANKED 1st' awards in industry survey

05/17/2018  For the 20th year, a worldwide survey of semiconductor manufacturers has resulted in Plasma-Therm winning multiple awards for its systems and superior customer service.

SiTime opens new Center of Excellence in Michigan

05/17/2018  SiTime Corporation announced it has expanded its global footprint to support its rapid growth with the opening of a new Center of Excellence in Michigan.

3D-Micromac receives order for new microMIRA excimer laser lift-off system from dpiX

05/17/2018  More than 400 laser systems from 3D-Micromac installed worldwide; dozens of excimer laser systems used for display and microelectronics manufacturing.

Molex announces acquisition of BittWare

05/17/2018  New Hampshire company specializes in high-end FPGA computing platforms designed to improve performance and time-to-revenue for OEMs.

Advanced materials: processing glass like a polymer

05/17/2018  KIT materials scientists develop new forming technology -- publication in advanced materials.

SEMI position on EC's proposed framework for screening foreign direct investments in the European Union

05/17/2018  In response to the European CommissionÂ’s (EC) proposed framework for screening foreign direct investments (FDI), SEMI, representing the global electronics manufacturing supply chain, offers three recommendations for consideration by EU policymakers.

Crossbar announces licensing relationship agreement with Microsemi

05/16/2018  Companies announce strategic collaboration to integrate ReRAM technology in Microsemi products.

New device could increase battery life of electronics by a hundred-fold

05/16/2018  Researchers developed the device and are working on commercializing it.

Researchers control the properties of graphene transistors using pressure

05/16/2018  A Columbia University-led international team of researchers has developed a technique to manipulate the electrical conductivity of graphene with compression, bringing the material one step closer to being a viable semiconductor for use in today's electronic devices.

Synopsys IC Validator certified by GLOBALFOUNDRIES for signoff physical verification

05/15/2018  Synopsys, Inc. today announced that GLOBALFOUNDRIES (GF) has certified the Synopsys IC Validator tool for physical signoff on the GF 14LPP process technology.

Sciaky receives order for multiple Electron Beam Additive Manufacturing systems

05/15/2018  Sciaky, Inc. announced today that it has received an order for multiple Electron Beam Additive Manufacturing systems to bolster the nation's defense and power generation programs.

Analysis of causality principle for the conductivity of graphene

05/15/2018  A paper by Kazan University and Russian Academy of Sciences appeared in Physical Review D.

EV Group secures lithography order from VTT Technical Research Centre

05/15/2018  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has received an order for its EVG120 automated resist processing system from VTT Technical Research Centre of Finland (VTT).

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors