Featured Content




Expecting the unexpected: 5 takeaways from FLEX Japan and MEMS & Sensors Forum Japan 2018

05/08/2018  Peel-and-stick simplicity isnÂ’t just for adhesive bandages any more. IoT and flexible hybrid electronics (FHE) are bound to change hardware business models. And flexible displays will breathe life into any surface.

Semtech announces acquisition of IC Interconnect

05/07/2018  Semtech Corporation, a supplier of high performance analog, mixed-signal semiconductors and advanced algorithms, today announced it has acquired substantially all the assets of IC Interconnect, Inc.

Global semiconductor packaging materials market tops $16B

05/07/2018  The global semiconductor packaging materials market reached $16.7 billion in 2017. While slower growth of smartphones and personal computers -- the industryÂ’s traditional drivers -- is reducing material consumption, the slowdown was offset by strong unit growth in the cryptocurrency market in 2017 and early 2018.

RF power semiconductors near $1.5B for 2017 with GaN driving the way

05/07/2018  Gallium Nitride (GaN) has the promise of gaining market share in 2018 and is forecast to be a significant force over the next few years.

Analog Devices names four Fellows for outstanding technical achievement and leadership

05/07/2018  Analog Devices, Inc. awarded Bob Reay, Leonard Shtargot, Jesper Steensgaard, and Sam Zhang the title of Analog Devices Fellow.

Hematene joins parade of new 2D materials

05/07/2018  Hematene joins parade of new 2D materials Rice University-led team extracts 3-atom-thick sheets from common iron oxide.

Design for magnetoelectric device may improve your memory

05/04/2018  A switching element made of Cr2O3 may yield smaller, more energy-efficient memory for computers and flash drives.

2018 CMC Conference highlights materials solutions

05/04/2018  The 2018 Critical Materials Council (CMC) Conference -- held April 26-27 at the Hilton Chandler in Arizona -- was a great gathering with presentations from Everspin, Intel, GlobalFoundries, and NXP discussing current fab challenges, and the relationships to near-term materials solutions.

Imec demonstrates direct optical reading of single-molecule DNA bases in modified nanopores

05/04/2018  Results on unique combination of surface enhanced Raman spectroscopy and nanopore fluidics published in Nature Communications.

Osram strengthens portfolio for security applications via acquisition

05/03/2018  Osram has added to its expertise in semiconductor-based optical security technology by acquiring US-based Vixar Inc.

Leti and Cellmic LLC join forces to accelerate market adoption of lens-free diagnostics and biomedical sensing

05/03/2018  Leti, a research institute at CEA Tech, and Cellmic LLC, a company dedicated to improving patient healthcare with smartphones and biophotonics, today announced that they joined forces to accelerate the market adoption of lens-free imaging and sensing techniques by growing LetiÂ’s patent portfolio with a core patent from Cellmic.

Custom silicon microparticles dynamically reconfigure on demand

05/03/2018  First demonstration of self-assembling and self-disassembling silicon microparticles could form the basis for designing artificial muscles and reconfigurable computer systems.

Controlling the crystal structure of gallium oxide

05/03/2018  A simple method that uses hydrogen chloride can better control the crystal structure of a common semiconductor and shows promise for novel high-powered electronic applications.

Making automotive smart: Key takeaways from SEMI Taiwan Member Forum

05/03/2018  Emboldened by advances in self-driving and Internet of Vehicles (IoV) technologies, TaiwanÂ’s microelectronics sector is investing heavily in manufacturing processes and equipment as engines of innovation and growth for autonomous driving, the worldÂ’s next market goldmine. But breaking into the self-driving vehicle industry can be an uphill struggle.

ALLVIA adds capabilities for through-quartz vias

05/02/2018  To meet growing market demand for high-density 2.5D and 3D stacked semiconductor solutions, Silicon Valley-based ALLVIA, Inc. has expanded its in-house capabilities to include the formation of through-quartz vias (TQV) ranging from 15 microns in diameter and 100 microns deep to 50 microns in diameter and 250 microns deep.

One-dimensional material packs a powerful punch for next generation electronics

05/02/2018  The new technology has applications in nanometer-scale transistors and circuits.

EV Group begins construction of new Manufacturing III building

05/02/2018  EV Group today announced that it has started construction work for the next expansion phase of its corporate headquarters.

TowerJazz announces release of advanced 300mm 65nm BCD power management platform

05/02/2018  TowerJazz today announced the release of its 300mm 65nm BCD (Bipolar-CMOS-DMOS) process, the most advanced power management platform for up to 16V operation and 24V maximum voltage.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.