05/08/2018 Peel-and-stick simplicity isnÂ’t just for adhesive bandages any more. IoT and flexible hybrid electronics (FHE) are bound to change hardware business models. And flexible displays will breathe life into any surface.
05/07/2018 Semtech Corporation, a supplier of high performance analog, mixed-signal semiconductors and advanced algorithms, today announced it has acquired substantially all the assets of IC Interconnect, Inc.
05/07/2018 The global semiconductor packaging materials market reached $16.7 billion in 2017. While slower growth of smartphones and personal computers -- the industryÂ’s traditional drivers -- is reducing material consumption, the slowdown was offset by strong unit growth in the cryptocurrency market in 2017 and early 2018.
05/04/2018 The 2018 Critical Materials Council (CMC) Conference -- held April 26-27 at the Hilton Chandler in Arizona -- was a great gathering with presentations from Everspin, Intel, GlobalFoundries, and NXP discussing current fab challenges, and the relationships to near-term materials solutions.
05/03/2018 Leti, a research institute at CEA Tech, and Cellmic LLC, a company dedicated to improving patient healthcare with smartphones and biophotonics, today announced that they joined forces to accelerate the market adoption of lens-free imaging and sensing techniques by growing LetiÂ’s patent portfolio with a core patent from Cellmic.
05/03/2018 First demonstration of self-assembling and self-disassembling silicon microparticles could form the basis for designing artificial muscles and reconfigurable computer systems.
05/03/2018 A simple method that uses hydrogen chloride can better control the crystal structure of a common semiconductor and shows promise for novel high-powered electronic applications.
05/03/2018 Emboldened by advances in self-driving and Internet of Vehicles (IoV) technologies, TaiwanÂ’s microelectronics sector is investing heavily in manufacturing processes and equipment as engines of innovation and growth for autonomous driving, the worldÂ’s next market goldmine. But breaking into the self-driving vehicle industry can be an uphill struggle.
05/02/2018 To meet growing market demand for high-density 2.5D and 3D stacked semiconductor solutions, Silicon Valley-based ALLVIA, Inc. has expanded its in-house capabilities to include the formation of through-quartz vias (TQV) ranging from 15 microns in diameter and 100 microns deep to 50 microns in diameter and 250 microns deep.
05/02/2018 TowerJazz today announced the release of its 300mm 65nm BCD (Bipolar-CMOS-DMOS) process, the most advanced power management platform for up to 16V operation and 24V maximum voltage.
07/10/2014 Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.