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05/01/2018  Mentor, a Siemens business, has announced that several tools in its Calibre nmPlatform and Analog FastSPICE (AFS) Platform have been certified by TSMC for the latest versions of TSMC's 5nm FinFET and 7nm FinFET Plus processes.

05/01/2018  Cadence Design Systems, Inc. today announced its continued collaboration with TSMC to further 5nm and 7nm+ FinFET design innovation for mobile and high-performance computing (HPC) platforms.

05/01/2018  Study finds that light polarization properties of candidate material offer additional computing degrees of freedom.

04/30/2018  Cyient Limited today announced that its step down subsidiary Cyient Europe Ltd. has acquired AnSem N.V.

04/30/2018  Synopsys, Inc. today announced certification of the Synopsys Design Platform with TSMC's latest Design Rule Manual (DRM) for advanced 7nm FinFET Plus process technology.

04/30/2018  Spin Transfer Technologies, Inc. announced results of its unique Precessional Spin Current (PSC) structure.

04/30/2018  Algorithm take months, not years, to find material for improved energy conversion.

04/27/2018  Intel today announced that Jim Keller will join Intel as a senior vice president. He will lead the company's silicon engineering, which encompasses system-on-chip (SoC) development and integration.

04/27/2018  According to Technavio market research analysts, the CAGR for the global lithography systems market is projected to be over 5% during the forecast period.

04/27/2018  Lehigh research team demonstrates terahertz semiconductor laser with record-high output power.

04/26/2018  The latest LPDDR4X features high performance and energy efficiency while significantly raising the thermal endurance level for automotive applications that often need to operate in extreme environments.

04/26/2018  Analog Devices, Inc. has unveiled its new India headquarters for the approximately 600 Bengaluru-based staff who make up ADI India.

04/26/2018  Siemens Corporation today announced that Barbara Humpton has been appointed CEO for the United States, effective June 1, 2018.

04/26/2018  Tuning the graphene embedded in a photonic crystal by varying the external temperature can transform it into a light-sensitive sensor.

04/26/2018  Japanese researchers have developed a new method to build large areas of semiconductive material that is just two molecules thick and a total of 4.4 nanometers tall.

04/26/2018  STMicroelectronics and Jorjin Technologies Inc. announced the certification of the dual-radio modules that combine Sigfox wireless-network technology with Bluetooth low energy (BLE).

04/26/2018  Arbe Robotics' proprietary chipset leverages GF's 22FDX technology to deliver industry's first real-time 4D imaging radar for level 4 and 5 autonomous driving.

04/25/2018  Cheap, flexible and sustainable plastic semiconductors will soon be a reality thanks to a breakthrough by chemists at the University of Waterloo.

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.