04/06/2018 The GaN power business was worth about US$12 million in 2016, but at Yole, analysts project that the market will reach US$460 million by 2022, with an impressive 79% CAGR.
04/06/2018 Technavio market research analysts forecast the global carbon nanotubes market to grow at a CAGR of more than 20% during the period 2018-2022, according to their latest report.
04/06/2018 Although many months past due, Congress on March 23 finalized the federal spending for the remainder of fiscal year (FY) 2018, only hours before a what would have been the third government shutdown of the year.
04/05/2018 Plasma-Therm today announced that it has acquired KOBUS, a plasma deposition company, which enables F.A.S.T, a valuable alternative to ALD where thick and conformal films are required.
04/05/2018 Leti, a research institute of CEA Tech, today announced Leti's silicon photonics process design kit (PDK) for photonic circuits is available in the Synopsys PhoeniX OptoDesigner suite.
04/05/2018 SEMI today reported that worldwide sales of semiconductor manufacturing equipment totaled $56.6 billion in 2017, a year-over-year increase of 37 percent from 2016 sales of $41.24 billion.
04/04/2018 AKHAN Semiconductor, a technology company specializing in the fabrication and application of lab-grown, electronics-grade diamonds, announced today that it has obtained official notifications from both the United States Patent and Trademark Office (USPTO) and Taiwan Intellectual Property Office (TIPO) for the Miraj Diamond trademark registration and patent allowance.
04/03/2018 Technology companies Osram and Continental have successfully completed negotiations on their joint venture, which is expected to begin operations in the second half of calendar year 2018.
04/02/2018 Nobuaki Kurumatani today took office as the first Chairman and CEO of Toshiba Corporation to be appointed from outside the company in over 50 years.
04/02/2018 SiFive, a provider of commercial RISC-V processor IP, today announced it raised $50.6 million in a Series C round led by existing investors.
04/02/2018 Fueled by heavy government investment, IC packaging and testing in China generated $29 billion in revenue in 2017, making China the world's largest consumer of packaging equipment and materials.
Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/IntelÂ’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, weÂ’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.
07/10/2014 Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.
