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Silicon photonics industry is at the very beginning of a massive deployment

03/13/2018  Silicon photonics is today one of the most valuable answers to high data rate/low cost for distances beyond VCSEL's reach.

Micron appoints Raj Talluri as senior vice president and general manager of Mobile Business Unit

03/13/2018  Micron Technology Inc. announced today that the company has appointed Raj Talluri as senior vice president and general manager of the Mobile Business Unit.

SEMI-THERM to take place March 19-23

03/13/2018  The 34th annual conference and exhibition will bring together leading industry experts to San Jose, CA to share ideas that will shape future technologies.

Flat gallium joins roster of new 2-D materials

03/12/2018  Scientists at Rice University and the Indian Institute of Science, Bangalore, have discovered a method to make atomically flat gallium that shows promise for nanoscale electronics.

Breakthrough in circuit design makes electronics more resistant to damage and defects

03/12/2018  A newly published paper in Nature Electronics details how researchers at the Advanced Science Research Center, GC/CUNY, used an array of nonlinear resonators to overcome signal disruption when electronic circuits are broken or damaged.

New insights could pave the way for self-powered low energy devices

03/09/2018  Researchers have discovered more details about the way certain materials hold a charge even after two surfaces separate, information that could help improve devices that leverage such energy as a power source.

Immersion files lawsuits against Samsung in U.S. and China

03/09/2018  The complaint seeks to stop further infringement by Samsung and to recover damages.

SCREEN Semiconductor Solutions and Axcelis Technologies announce distribution and support agreement

03/09/2018  Agreement brings Purion ion implant platform to Japan market.

Qualcomm Board names Jeffrey Henderson Non-Executive Chairman

03/09/2018  The Board has discontinued the role of Executive Chairman, which was established in 2014 as part of a leadership transition plan, based on its belief that an independent Chairman is now more appropriate for Qualcomm. The Board has named Jeffrey W. Henderson, an independent Qualcomm director since 2016, to serve as Non-Executive Chairman.

Scientists develop new tool for imprinting biochips

03/09/2018  The new technology could allow researchers to fit more biochemical probes onto a single biochip and reduce the cost of screening and analyzing changes associated with disease development, detecting bioterrorism agents, and other areas of research.

UCLA researchers develop a new class of two-dimensional materials

03/09/2018  New kinds of 'superlattices' could lead to improvements in electronics, from transistors to LEDs.

A universally profitable renewable energy business model

03/08/2018  The solar energy sector shined in a global renewable energy market that maintained steady growth last year despite the United StatesÂ’ shocking withdrawal from the Paris Agreement. Solar panel costs dropped to an all-time low, driving global demand that surpassed the 100GW mark for the first time on the strength of standout annual 26 percent growth.

Samsung enhances chip-scale LED package lineup with industryÂ’s highest luminous efficacies

03/08/2018  Samsung Electronics Co., Ltd. today announced that it has achieved the industryÂ’s highest light efficacies for its fillet-enhanced chip-scale package (FEC) LED lineup.

Synopsys collaborates with Samsung Foundry to develop DesignWare IP for Samsung 8nm finFET process

03/08/2018  Synopsys, Inc. today announced a collaboration with Samsung Foundry to develop DesignWare Foundation IP for Samsung's 8nm Low Power Plus (8LPP) FinFET process technology.

New approach to measuring stickiness could aid micro-device design

03/08/2018  Brown University engineers have devised a new method of measuring the stickiness of micro-scale surfaces. The technique, described in Proceedings of the Royal Society A, could be useful in designing and building micro-electro-mechanical systems (MEMS), devices with microscopic moving parts.

Simulation and experiment help TU Dresden researchers study next-generation semiconductors

03/08/2018  Theoretical physicists and experimentalists collaborate to identify dopants capable of enabling new designs of semiconducting materials.

KLA-Tencor receives Intel's Preferred Quality Supplier award

03/08/2018  KLA-Tencor Corporation has been recognized by Intel as a recipient of a 2017 Preferred Quality Supplier (PQS) award.

Linde LienHwa announces investment commitment in China and additional new special gas production in Taiwan

03/07/2018  Linde LienHwa, a key supplier of gases and chemicals to the electronics industry, continues to invest with its customers in Mainland China and Taiwan.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.