03/01/2018 Researchers have, for the first time, integrated two technologies widely used in applications such as optical communications, bio-imaging and Light Detection and Ranging (LIDAR) systems that scan the surroundings of self-driving cars and trucks.
03/01/2018 There are big changes on the horizon for semiconductor mask manufacturing, including the imminent first production use of multi-beam mask writers, and the preparation of all phases of semiconductor manufacturing for the introduction of extreme ultra-violet (EUV) lithography within the next few years.
02/28/2018 A new progress in the scaling of semiconductor quantum dot based qubit has been achieved at Key Laboratory of Quantum Information and Synergetic Innovation Center of Quantum Information & Quantum Physics of USTC.
02/28/2018 Since 2010, 474 companies have poured $51 billion into developing products enabled by artificial intelligence (AI), with the bulk of these investments targeting autonomous driving and in-vehicle experiences, according to the McKinsey reports.
02/27/2018 Researchers have developed an imaging technique that uses a tiny, super sharp needle to nudge a single nanoparticle into different orientations and capture 2-D images to help reconstruct a 3-D picture. The method demonstrates imaging of individual nanoparticles at different orientations while in a laser-induced excited state.
02/27/2018 Brewer Science, Inc., today from SPIE Advanced Lithography 2018 introduced its OptiLign commercial-quality directed self-assembly (DSA) material set developed in collaboration with Arkema.
02/27/2018 ClassOne Equipment, Atlanta-based provider of refurbished name-brand semiconductor processing equipment, has announced the sale of multiple systems to a major global components manufacturer as part of a significant upgrade to their UK fab.
02/26/2018 Researchers at North Carolina State University have developed a new technique that allows them to print circuits on flexible, stretchable substrates using silver nanowires. The advance makes it possible to integrate the material into a wide array of electronic devices.
02/26/2018 Cree, Inc. announces that it signed a strategic long-term agreement to produce and supply its Wolfspeed silicon carbide (SiC) wafers to Infineon Technologies AG.
02/26/2018 STMicroelectronics and Sigfox have announced a collaboration agreement to support and accelerate the growing demand for connected devices for a broad range of applications, including supply-chain management, building and equipment maintenance, water and gas metering, security, transportation, agriculture, mining and home automation.
02/23/2018 Microsemi Corporation (Nasdaq: MSCC), a provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the ZL70123, a new radio frequency (RF) base station module for implantable devices utilizing the Medical Implant Communication Service (MICS) RF band.
07/10/2014 Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.
