02/15/2018 A silicon-based quantum computing device could be closer than ever due to a new experimental device that demonstrates the potential to use light as a messenger to connect quantum bits of information -- known as qubits -- that are not immediately adjacent to each other. The feat is a step toward making quantum computing devices from silicon, the same material used in today's smartphones and computers.
02/15/2018 Universal Display Corporation today announced the signing of long-term OLED material supply and license agreements with Samsung Display Co., Ltd., a global display manufacturer.
02/15/2018 The latest market research report by Technavio on the global semiconductor IP market predicts a CAGR of close to 10% during the period 2018-2022.
02/15/2018 SiFive, the provider of commercial RISC-V processor IP, continues to grow its executive staff with the appointment of Shiva Natarajan as chief financial officer.
02/14/2018 Yawning differences between cultures, economic systems and rules of law stand as barriers for many China- and US-based technology companies to do business on each otherÂ’s soil, making it imperative for both countries to work together to bridge the gaps that make it harder for tech businesses in each country to find partners and open markets in the other, SEMI China president Lung Chu said at a recent conference.
02/14/2018 Orbotech Ltd. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has received approximately $37M in orders for multiple etch and deposition systems from two GaAs foundry customers.
02/14/2018 STMicroelectronics today announced it has signed an agreement on LDMOS RF power technology from Innogration Technologies, a fabless semiconductor company headquartered in Suzhou, China.
02/13/2018 Park Systems, a manufacturer of atomic force microscopes celebrated the grand opening of their European Headquarters on February 6, 2018 in Mannheim, Germany.
02/13/2018 CEA-Leti's chief scientist today issued a forward-looking call to action for the microelectronics industry to create a radically new, digital-communication architecture for the Internet of Things in which "a great deal of analytics processing occurs at the edge and at the end devices instead of in the Cloud".
02/13/2018 SEMI today announced the appointment of Frank A. Shemansky, Jr., Ph.D., as executive director and chief technology officer (CTO) of the MEMS & Sensors Industry Group (SEMI-MSIG).
02/12/2018 Total shipments of mobile phone displays, including thin-film transistor liquid crystal display (TFT LCD) and active matrix organic light-emitting diode (AMOLED) panels, reached 2.01 billion units in 2017, up 3 percent from 2016.
02/12/2018 MagnaChip Semiconductor Corporation announced today it now offers the 2nd generation of 0.13 micron BCD process technology integrated with high-density embedded Flash memory.
02/12/2018 NUST MISIS scientists jointly with an international group of scientists have managed to develop a composite material that has the best piezoelectric properties today. The research results were published in Scientific Reports journal.
