01/30/2018 SiFive, a provider of commercial RISC-V processor IP, today announced Shafy Eltoukhy as vice president of operations. Eltoukhy, a veteran of Microsemi and Intel, will lead SiFive's DesignShare activities and ensure the smooth rollout of new Core IP, SoCs and services.
01/30/2018 Kateeva, a developer of inkjet deposition equipment solutions for OLED display manufacturing, today announced that the company has expanded its executive team by appointing Marc Haugen as chief operating officer (COO).
01/30/2018 Alpha and Omega Semiconductor Limited (AOS) (Nasdaq:AOSL), a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today introduced AONE36132, a 25V N-Channel MOSFET in a dual DFN 3.3x3.3 package which is ideal for synchronous buck converters.
01/30/2018 Leti, a research institute at CEA Tech, has invented a lens-free microscope technology that provides point-of-care diagnosis for spinal meningitis. Outlined in a paper presented at Photonics West, the new technology provides immediate results and eliminates errors in counting white blood cells (leukocytes) in cerebrospinal fluid, which is required to diagnose the infection.
01/30/2018 efabless corporation, the world's first crowd sourcing platform for electronics solutions, today announced Mike Noonen joined its advisory board.
01/29/2018 Worldwide shipments of devices -- PCs, tablets and mobile phones -- totaled 2.28 billion units in 2017, according to Gartner, Inc. Shipments are on course to reach 2.32 billion units in 2018, an increase of 2.1 percent.
01/29/2018 Advanced Micro-Fabrication Equipment Inc. today announced that the Patent Re-examination Board (PRB) of the State Intellectual Property Office (SIPO) in China, ruled on Jan. 23 that all patent claims relating to patent number ZL 01822507.1 held by Veeco Instruments Inc. are invalid.
01/29/2018 The research team that announced the first optical rectenna in 2015 is now reporting a two-fold efficiency improvement in the devices — and a switch to air-stable diode materials. The improvements could allow the rectennas – which convert electromagnetic fields at optical frequencies directly to electrical current – to operate low-power devices such as temperature sensor
01/29/2018 SEMI, the global industry association representing the electronics manufacturing supply chain, today announced an urgent call to action to overcome the pressing semiconductor industry challenge of recruiting new talent.
01/26/2018 The worldwide race to create more, better and reliable quantum processors is progressing fast, as a team of TU Delft scientists led by Professor Vandersypen has realised yet again. In a neck-and-neck race with their competitors, they showed that quantum information of an electron spin can be transported to a photon, in a silicon quantum chip.
01/26/2018 Researchers have identified a mechanism that triggers shape-memory phenomena in organic crystals used in plastic electronics. Shape-shifting structural materials are made with metal alloys, but the new generation of economical printable plastic electronics is poised to benefit from this phenomenon, too. Shape-memory materials science and plastic electronics technology, when merged, could open the door to advancements in low-power electronics, medical electronics devices and multifunctional shape-memory materials.
01/26/2018 TU Wien has developed a sensor for measuring the strength of electric fields, which is much smaller, simpler and less prone to distortion than comparable devices.
01/25/2018 Imec today announced that it will demonstrate its very first shortwave infrared (SWIR) range hyperspectral imaging camera at next weekÂ’s SPIE Photonics West in San Francisco.
01/25/2018 Samsung Electronics and Apple remained the top two semiconductor chip buyers in 2017, representing 19.5 percent of the total worldwide market, according to Gartner, Inc.
