09/17/2008 September 17, 2008: In a finding that could speed the use of sensors or barcodes at the nanoscale, North Carolina State U. engineers have shown that certain types of tiny organic particles, when heated to the proper temperature, bob to the surface of a layer of a thin polymer film and then can reversibly recede below the surface when heated a second time.
09/17/2008 September 17, 2008:By discovering the physical mechanism behind the rapid transport of water in carbon nanotubes, scientists at the U. of Illinois have moved a step closer to ultra-efficient, next-generation nanofluidic devices for drug delivery, water purification, and nano-manufacturing.
09/17/2008 RO3000 and RO4000 laminates, from Roger's Corp. are antenna-grade materials that feature low passive intermodulation (PIM), low loss, and are suited for use in antennas for 3G, WiMAX and LTE cellular base stations, satellite earth stations, GPS systems, and RFID readers.
09/16/2008 September 16, 2008: Veeco Instruments Inc. has become a charter member in the CPV Consortium, a global industry organization that supports the development and long-term success of the concentrator photovoltaics industry, with the goal of providing a low-cost, reliable source of renewable energy.
09/16/2008 September 16, 2008: Nano-C, Inc., developer of nanostructured carbon materials, has been issued US Patent Nos. 7,335,344 and 7,396,520 by the Department of Commerce's United States Patent and Trademark Office. These newly issued patents cover the manufacture of Nano-C's core products, carbon nanotubes and fullerenes.
09/16/2008 September 16, 2008: El-Mul Technologies'E-Beam On-a-Chip platform, which demands precision placement and step repeatability of vertically-aligned carbon nanotubes (CNTs), will be produced using Aixtron's Black Magic system, a fully automatic deposition system capable of thermal and plasma-enhanced chemical vapor deposition (PECVD) of CNTs.
09/16/2008 KLA-Tencor exec Rahul Bammi tells SST about the company's latest version of its Surfscan SP2XP defect inspection tool, and two of its key features: custom polarizers to enhance sensitivity, and a well-known image-capture technology borrowed from microscope manufacturers.
09/16/2008 RelMax, from Kulicke & Soffa Industries, is a 2N gold ball bonding wire developed in response to market demand for increased interconnect (IC) reliability, process robustness and reduced costs.
09/16/2008 SCHOTT Electronic Packaging offers a hermetic transistor outline (TO) for fiber channel applications of 17 gigabits/second and beyond. The TO PLUS Line reportedly overcomes the normal limitations of a TO by combining glass and packaging design aspects. Up to 6 pins, including higher frequency and DC (electrical) ports, most of the necessary electronics can be packaged into a regular TO footprint, rather than resorting bulky complex hybrid packages.
09/16/2008 Indium9.32 Die-attach Solder Paste is a halogen-free, no-clean, die-attach solder paste used in high-volume manufacturing for lead-free die-attach applications. Formulated to leave a benign, invisible residue, it is designed for reflow in forming gas.
09/16/2008 Using 2D and 3D X-ray techniques to find and confirm manufacturing defects in flip-chip devices By Evstatin Krastev, Ph.D. Dage Precision Industries, a Nordson Company
While flip chip design eliminates excessive packaging, high-density flip chip devices place a greater burden upon device inspection. The combination of 2D x-ray and CT analysis offers powerful analytical capabilities need for the complete inspection of flip-chip devices and stacked packages.
09/16/2008 In response to market needs for 300mm process equipment capabilities to demonstrate 3D processes, SUSS MicroTec has introduced The XBC300. The XBC300 is designed for 3D integration and 3D packaging with through silicon vias (TSVs) and is ideal for the CMOS image sensor (CIS) early adopter market.
09/16/2008 Georgia Institute of Technology
There is a need for miniaturization at the IC, module, and system levels. There is stil research and development required to bring this hetero-integration technology to cost-effective implementation with required reliability and performance needs. In addition to the module level, we must focus on performance, form factor, cost, and reliability of the entire system.
09/15/2008 September 15,2008: Researchers at Lawrence Livermore National Laboratory claim to have achieved a milestone in materials science and electron microscopy by taking a high-resolution snapshot of the transformation of nanoscale structures.
09/15/2008 September 15, 2008: QualSec" has moved operations from North Logan, Utah to Chapel Hill, North Carolina. The company's flagship product is the NanoNose, an electronic nose technology that instantaneously analyzes and quantifies airborne particles for the homeland security, health care, environmental, petrochemical, and food industries.
09/15/2008 September 15, 2008: Nanobiosym says that Ratan Tata, chairman of multibillion-dollar global conglomerate Tata Group, has joined the firm's global advisory board.
09/15/2008 September 15, 2008: STMicroelectronics says its new ultra-compact MEMS gyroscope provides design flexibility and system partitioning by providing a choice of analog or digital absolute angular-rate outputs.
09/12/2008 By Peter Salmon, Salmon Technologies
A particularly versatile form of wafer bumping is stud bumping, using either gold or copper wire. The equipment required is an adaptation of a traditional wire bonder. A ball bond is made at a first contact pad using heat and ultrasonic energy. The wire is extended in a precise direction and a flying lead is created by terminating the wire, for example using electronic flame-off (EFO).
