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SiFive welcomes former Intel corporate VP to executive team

01/24/2018  SiFive, the provider of commercial RISC-V processor IP, today announced the appointment of Sunil Shenoy as vice president of hardware engineering.

Scientists reveal the fundamental limitation in the key material for solid-state lighting

01/24/2018  For the first time an international research group has revealed the core mechanism that limits the indium (In) content in indium gallium nitride ((In, Ga)N) thin films - the key material for blue light emitting diodes (LED).

North American semiconductor equipment industry posts December 2017 billings

01/24/2018  The billings figure is 16.3 percent higher than the final November 2017 level of $2.05 billion, and is 27.7 percent higher than the December 2016 billings level of $1.87 billion.

Growth of IoT to drive the global reset IC market

01/23/2018  Technavio market research analysts forecast the global reset IC market to grow at a CAGR of close to 12% during the forecast period, according to their latest report.

Researchers use sound waves to advance optical communication

01/23/2018  Illinois researchers have demonstrated that sound waves can be used to produce ultraminiature optical diodes that are tiny enough to fit onto a computer chip.

Micron launches industry's first enterprise SATA solid state drives built on 64-layer 3D NAND technology

01/23/2018  Micron Technology, Inc. today launched the Micron 5200 series of SATA solid state drives.

Applied Materials appoints Scott McGregor to Board of Directors

01/23/2018  Applied Materials, Inc. today announced the appointment of Scott A. McGregor to serve on its Board of Directors.

Intermolecular and SITRI expand alliance to accelerate development of advanced memory technologies for the China market

01/23/2018  The two companies will work together with an end goal of producing a working memory device that their joint customers can use to drive future memories and IoT innovations forward.

New metal-semiconductor interface for brain-inspired computing

01/22/2018  One of the big challenges in computer architecture is integrating storage, memory and processing in one unit. This would make computers faster and more energy efficient. University of Groningen physicists have taken a big step towards this goal by combining a niobium doped strontium titanate (SrTiO3) semiconductor with ferromagnetic cobalt.

3D-Micromac, TDMDA, and MOS Technology host International Laser and Coating Symposium 2018

01/22/2018  Experts in the field of display fabrication to meet in Hsinchu, Taiwan on February 1 to discuss business opportunities and new manufacturing trends for advanced displays.

ISS Europe to spotlight key chip industry issue of workforce development 

01/22/2018  Qualified workers key to Europe's competitive advantage in global supply chain.

Entegris acquires Particle Sizing Systems, LLC

01/22/2018  Technology enables customers to perform particle size analysis in real time.

Qualcomm receives authorization from the European Commission and Korea Fair Trade Commission for NXP Semiconductors acquisition

01/19/2018  Qualcomm Incorporated today announced that the European Commission and the Korea Fair Trade Commission authorized the acquisition by Qualcomm River Holdings B.V. of NXP Semiconductors N.V.

2-D tin (stanene) without buckling: A possible topological insulator

01/19/2018  Nagoya University-led researchers produce 2D sheets of tin atoms predicted to have exotic uses in electronics.

Method uses DNA, nanoparticles and lithography to make optically active structures

01/19/2018  Technique could lead to new classes of materials that can bend light, such as for those used in cloaking devices.

Silicon photonics has reached its tipping point

01/19/2018  Silicon photonics is still a small market today, with sales at die level estimated to be US$30 million in 2016. However, it has big promise, with a 2025 market value of US$560 million at chip level and almost US$4 billion at transceiver level.

LCD TV panel demand expected to go through a correction in first quarter of 2018

01/18/2018  Demand for liquid crystal display (LCD) panels from South Korean and Chinese TV makers was strong in the fourth quarter of 2017, but implementation of their panel purchasing strategies for the first quarter of 2018 may result in a correction as demand expectations change.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors