08/07/2008 August 7, 2008 -- Researchers at the U. of Illinois/Urbana-Champaign and Northwestern U. say they have create a hemispherical "eye" camera using an array of single-crystalline silicon detectors and electronics in a stretchable, interconnected mesh, an achievement they say points the way toward advanced camera designs.
08/07/2008 Researchers created a hemispherical "eye" camera using an array of single-crystalline silicon detectors and electronics in a stretchable, interconnected mesh, an achievement they say points the way toward advanced camera designs.
08/07/2008 Japan's Elpida Memory is moving ahead with a 300mm DRAM joint venture in China with a local venture capital group, a move that one analyst and Japanese paper seem to admire.
08/07/2008 Big established players in Japan, led by Mitsubishi Chemical and Sanyo Electric, are putting significant money into major new efforts to move thin-film solar technologies into volume production in the next few years.
08/07/2008 STMicroelectronics, STATS ChipPAC, and Infineon Technologies AG have signed an agreement to jointly develop the next-generation of embedded wafer-level ball grid array (eWLB) technology, based on Infineon's first-generation technology, for use in manufacturing future-generation semiconductor packages.
08/06/2008 MEMS technology is gaining popularity in security and defense applications, but selling technology to the military takes commitment, flexibility and the ability to ramp-up production before you make the sale.
08/06/2008 In a post-SEMICON West interview, Edward Charrier, VP/GM of KLA-Tencor's process control information division, described the latest improvements in Prolith, the company's venerable litho simulation tool.
08/06/2008 August 6, 2008 -- Industrial Nanotech, Inc., a nanotechnology-based coatings company, announced that its patented Nansulate PT thermal insulation and corrosion resistance coating has been incorporated into the first display home of a LandCorp alternative housing project in Seville Grove, Western Australia.
08/06/2008 August 6, 2008 -- NanoSight Limited a, nanoparticle characterization company, has opened offices in the USA to provide local sales, applications and service support to its growing family of users.
08/06/2008 August 6, 2008 -- Carl Zeiss SMT made several new product announcements at the recent Microscopy and Microanalysis Meeting and Exhibition in Albuquerque, New Mexico. Among them are a new class of SEM, and an additional Argon ion beam column in its NVison 40 CrossBeam workstation.
08/06/2008 August 5, 2008 -- The University of Illinois Urbana Champaign has developed a novel testing device for understanding the tensile properties of single nanofibers. In addition to the ability to test a single nanofiber, the technology allows for testing at virtually any loading rate and temperature.
08/06/2008 August 5, 2008 -- FEI Company and Max Planck Institute (MPI) of Biochemistry are collaborating on a correlative microscopy solution that enables scientists to quickly and easily acquire high-resolution transmission electron microscope (TEM) images of molecular entities found using optical microscopy techniques. Initial shipments are expected in the fourth quarter of 2008.
08/06/2008 August 5, 2008 -- Congressman Dan Lipinski (D-IL) , Vice Chairman of the House Science and Technology Committee, and Congressman Todd Akin (R-MO), have introduced H.R. 6661, the Nanotechnology Innovation and Prize Competition Act, which establishes an X-Prize competition for nanotechnology.
08/06/2008 August 5, 2008 -- Royston based microfluidic company, Dolomite has succeeded in the development and fabrication of large-scale multi-layer microfluidic devices also known as 'lab on a chip.'
08/05/2008 Despite a mild recovery in 2Q08, global DRAM makers are once again building inventories and pulling the rug out from prices, and the buildup will likely push out a full market recovery until the end of next year, according to a new warning by iSuppli.
08/05/2008 Amid suggestions from top foundry TSMC that macroeconomic factors are weighing on customer demand, one analyst firm is lowering its expectations for a weaker-than-seasonal second half of the year. And the plan to hike ASPs? Forget it, at least for now.
08/05/2008 Shifting away from focus on 3D IC and TSV processes, this year's Advanced Packaging Conference at SEMICON Europa, titled "Technologies, Manufacturing and Supply Chain", will focus on more immediate issues facing the back-end sector of the semiconductor industry. Eef Bagerman, general manager operations, back-end innovation, NXP Semiconductors offered some insight about how the program was selected, and what technologies will be most likely to spark discussion.
08/04/2008 A look at the top four global foundries' latest financials and outlooks suggests the market outlook for foundries heading into 2H08 and early 2009 is starting to weaken due to uncertainties and fluctuation concerning demand.
08/04/2008 The AVIA 355-28, from Coherent extends the company's family of micromachining lasers to deliver] 28 Watts of output at 355 nm (at 110 kHz). This high power and repetition rate is said to increase throughput for micromachining applications in semiconductor fabrication and packaging. Target applications include dicing and scribing of silicon wafers and low-k semiconductors, and via-hole drilling in PCBs and flip chips.
08/04/2008 A line of fast-setting, one-component conductive adhesives designed for connecting passive components and bare die on lead frames and PCB substrates has been introduced by the Contact Materials Division (CMD) of Heraeus. Intended uses for these materials include smart cards and flexible circuits found in camera phones and automotive or semiconductor applications.
