07/01/2008 In one of the most beautiful areas imaginable in the Pacific Northwest amidst flowers and greenery, two companies do leading-edge research and development work that affects how electronics work.
07/01/2008 I’m not hearing nearly enough about it in the general news, and maybe it’s because the contamination control industry reaches into so many industries that the pattern seems so clear to me.
07/01/2008 As a first-time attendee at an Institute for Environmental Science and Technology (IEST) Working Group session, one probably doesn’t expect an animated crowd of participants sticking neon Post-It® notes on the walls.
07/01/2008 Following the path of electronics evolution, many technological concepts such as system-in-package (SiP), system-on-chip (SoC), and stacked chip packaging have drawn exploration roadmaps for higher system integration.
07/01/2008 ORLANDO, FL —Everything about the Freescale Technology Forum Americas conference, held June 16 & 17, at the JW Marriott and Ritz Carlton Conference Center in Orlando, provided the attendee an opportunity to interact with the Freescale community.
07/01/2008 Electromechanical Coating Processes eG ViaCoat enables the metallization of TSVs, until now a process that was holding back adoption of 3D packaging.
07/01/2008 Riding on recent advances in nano-fabrication technology, thin-film thermoelectric coolers (TF-TEC) have been developed with active material as thin as 10-20
07/01/2008 Demands to reduce the dimensions of even the most highly miniaturized semiconductor packages are placing pressure on IC vendors and packaging specialists to develop faster and more productive package-assembly processes.
07/01/2008 Challenges of high-end FCSiP include routability with acceptable signal and power integrity, package thermo-mechanical behaviors, and long term reliability performance.
06/30/2008 Rudolph Technologies, Inc. has received a follow-on order from Micronas for both NSX Inspection System and Discover in-line defect analysis and data management software. The purchase will reportedly allow Micronas — supplier of integrated circuits (ICs) and sensor system solutions for consumer and automotive electronics — to provide additional inspection capacity demanded by the 100% inspection requirements customers in the automotive market.
06/30/2008 June 30, 2008 - Worldwide semiconductor sales rose a few percentage points in May -- a historically strong month, as the build-up to prepare for back-to-school and holiday seasons begin -- to $21.83B, up 2.8% from April and 7.5% from May 2007.
06/30/2008 Nextreme Thermal Solutions, manufacturer of microscale thermal and power management products for the electronics industry, has been awarded a grant from the North Carolina Green Business Fund to enhance the efficiency of thin-film thermoelectrics used to convert waste heat into electricity.
06/30/2008 (June 30, 2008) Gail Flower, editor_in_chief of Advanced Packaging, offers her perspective in a lead-free debate initiated by Rick Short of Indium, in response to a segment of The Riley Report, "The $38 Billion Blunder" penned by AP's columnist, George A. Riley, Ph.D.
06/30/2008 (June 30, 2008) It was a month for names in the news as acquisitions and evolving business strategies inspired executive appointments and reorganization; industry organizations added members and directors, and books got published. Company announcements came in from JP Sercel Associates, TRUMPF, Dage Precision Industries, ECD, Jordan Valley, Rogers Corp., Formfactor, Unisem Group, Mentor Graphics, and Alchimer.
