06/25/2008 June 25, 2008 - SVTC Technologies has officially opened its Silicon Valley Photovoltaic Development Center in San Jose, with a new solar-cell manufacturing line, solar-module certification equipment, and a major silicon-wafer solar cell customer.
06/25/2008 June 25, 2008 - TSMC's 2Q08 revenue should be at the high end of guidance (roughly US$2.86-$2.92B, 0-2% vs. 1Q08), and 3Q is looking brighter, but for now the upswing isn't enough to increase profitability, according to an analysts from FBR Research.
06/25/2008 June 24, 2008 - The photoresist market managed to grow for the sixth straight year in 2007, driven by demand for 193nm deep ultraviolet and consumption in Asia, according to recent data from Gartner.
06/24/2008 Towa Corp., manufacturer of molding systems for semiconductor devices, anounced the development of a novel compression molding system that uses reportedly 60% thinner gold wires. The traditional transfer molding process, in which the resin is poured across the substrate, require gold wires to be at least 25 µm in diameter to withstand the resin's drag force without breaking. With Towa's new process, the gold wires can be made as thin as 16 µm.
06/24/2008 Semiconductor test company, Verigy, announced that STATS ChipPAC Ltd., provider of semiconductor assembly and test services, has purchased its Port Scale RF systems for testing highly integrated wireless RF devices. In addition, Verigy was recently recognized by STATS ChipPAC with an Outstanding Overall Service Award for exemplary performance and service.
06/24/2008 June 24, 2008 -- Laser Focus World, the leading photonics-industry trade publication, and the Optoelectronics Industry Development Association (OIDA), a not-for-profit association that serves as the nexus for vision, transformation, and growth of the photonics and optoelectronics industry, recently announced a new conference and exhibition, OPTOmism: Photonics for the Green Revolution, to be held at the Santa Clara Convention Center in Santa Clara, California May 18-20, 2009.
06/24/2008 June 24, 2008 -- Kebaili Corporation, a high-tech MEMS and nanotechnology company, has released the KMHP-100 Series, the industry's first commercially available off-the-shelf MEMS microhotplates for researchers and scientists in innovative chemical sensor research and development applications.
06/24/2008 June 24, 2008 -- Gaining momentum from recent orders and installations, sp3 Diamond Technologies, Inc. (sp3), a supplier of diamond film products, equipment and services, has received two new orders for its Model 650 hot filament chemical vapor deposition (HFCVD) diamond reactor
06/24/2008 June 24, 2008 -- Cypress Semiconductor Corp. (www.cypress.com) has introduced the TrueTouch touchscreen solution based on the PSoC programmable system-on-chip architecture.
06/24/2008 June 24, 2008 -- AIXTRON AG (www.aixtron.com) announced that Visual Photonics Epitaxy Co. Ltd. (VPEC), a manufacturer of microelectronic and optoelectronic epiwafers, has placed another order for multiple AIX 2600G3 IC systems.
06/24/2008 by Debra Vogler, Senior Technology Editor, Solid State Technology
June 24, 2008 - Dow Corning Electronics aims to support development efforts toward high-volume manufacturing using e-beam lithography technology with its new XR-1541 spin-on resists, which it says are capable of defining features as small as 6nm.
06/23/2008 June 23, 2008 - Automated test equipment providers Credence and LTX say they have agreed to merge their companies in a deal that they project will save them ~$25M. While bullish on their combined prospects, investors seem to think otherwise.
06/23/2008 June 23, 2008 -- Debiotech and STMicroelectronics introduced first evaluation prototypes of a unique miniaturized insulin-delivery pump. The device can be mounted on a disposable skin patch to provide continuous insulin infusion.
06/23/2008 June 23, 2008 -- FEI Company, a provider of high-resolution imaging and analysis systems, has released the Titan 80-300 environmental transmission electron microscope (ETEM), a solution for chemical research at the atomic scale.
06/23/2008 June 23, 2008 -- The U.S. Department of Energy (DOE) Argonne National Laboratory has received $1.4 million in funding from The Defense Advanced Research Projects Agency (DARPA) to a Phase III research project to develop high-performance integrated diamond microelectro-mechanical system (MEMS) and complementary metal-oxide-semiconductors devices (CMOS) for radar and mobile communications using an Argonne-developed Ulananocrystalline Diamond (UNCD) film technology.
06/23/2008 June 23, 2008 -- L-3 Communications Avionics Systems has received Technical Standard Order (TSO) authorization and Supplemental Type Certification (STC) from the Federal Aviation Administration (FAA) for its SmartDeck Integrated Flight Controls and Display System, which uses the TP3100 high-performance transducers from MEMSCAP.
06/23/2008 June 23, 2008 -- NEI Corporation, a provider of engineered nanomaterials, has been awarded eight Phase I Small Business Innovation Research (SBIR) awards by the U.S. Department of Energy.
06/23/2008 Toshiba and IBM say they have developed a higher-performance CMOS FET by increasing device-channel hole mobility through a modification of direct silicon bonding (DSB), a hybrid of (100) and (110) substrates, rather than new materials such as high-k and metal gates and new structures.
06/21/2008 June 20, 2008 - Chip equipment firm Ferrotec is one of many companies seeking to diversify into new growth opportunities, and its move into solar cells seems to have met with applause from investors and market players, notes the Nikkei daily.
06/20/2008 Rick Short, marketing communications director for Indium Corp. doesn't quite see eye to eye with recent commentary on the cost of lead-free compliance in the electronics industry in a recent segment of The Riley Report, George Riley's monthly column in AP Semi-monthly. In this editorial, Short offers his perspective on this controversial topic
