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Ontario breaks ground on $160 million nanotech research center

06/16/2008  June 16, 2008 -- The University of Waterloo, in Ontario, Canada, has broken ground on the $160-million Mike and Ophelia Lazaridis Quantum-Nano Centre designed to propel the university and the country to the forefront of the nanotechnology research.

Class completes first year of NanoHigh program in Albany, NY

06/16/2008  Twenty Albany High School (AHS) students have just completed the first year of the "NanoHigh" program, developed jointly by the City School District of Albany, New York (CSDA) and the University at Albany's College of Nanoscale Science and Engineering (CNSE). The NanaoHigh program, believed to be the first initiative of its kind at a public school anywhere in the country, was designed by CSDA and CNSE to help students take advantage of new nanotechnology-related careers.

Entorian Introduces Novel Package-on-Package Technology

06/16/2008  Offered as an alternative to dual-die package stacking, Entorian Technologies, provider of advanced electronic technologies and solutions for enterprise, consumer and other high-growth markets, has introduced RC Stakpak, a low-cost, package-on-package (PoP) stacking technology for DRAM memory.

Unisem Licenses FlipChip International's WLP Technologies

06/16/2008  Unisem Berhad and its subsidiary, Unisem-Advantpack Technologies (UAT) have entered into an agreement with FlipChip International (FCI) to license FCI's wafer bumping and wafer-level packaging (WLP) technologies. The agreement will reportedly include FCI's core technologies. In return, FCI will become a shareholder in UAT.

Asymtek Celebrates 25 Years in Business

06/16/2008  Asymtek, a Nordson company, provider of dispense, coating, and jetting technologies, recently celebrated the company's 25th anniversary. Asymtek's systems are known for innovative technology in dispensing, closed-loop process controls, and patented processes in jetting and coating. SMT Magazine talked to founder, Alec Babiarz about the company's history.

Novelx's mySEM boasts high performance, compact size

06/13/2008  June 13, 2008 -- Novelx calls its mySEM "the only high-performance, compact, field-emission scanning electron microscope." And, the company says, it delivers capabilities available only in high-end field emission SEMs, at a fraction of the cost.

Process integration drives the IC industry

06/13/2008  by Ed Korczynski, Senior Technical Editor, Solid State Technology
The next 10 years will witness more changes in mainstream IC manufacturing technology than in the last 40 years combined. With rapidly escalating costs projected for ≤32nm-node digital CMOS manufacturing, IC companies are turning to analog, packaging, and heterogeneous integration to add greater value for lower cost and risk. In short: unique process integration challenges at each fab will drive everything.

SMT/Hybrid/Packaging 2008: Exhibitor Offerings Span Electronics Supply Chain

06/13/2008  Bigger and more international than ever, exhibitors at SMT/Hybrid Packaging, June 2-4, Nuremberg, Germany, focused their product showcases around the theme of automotive electronics, or used the venue for the European launch of new products.

OAI wins order for Nano Imprint Module from Trinity College

06/13/2008  June 13, 2008 -- OAI, a manufacturer of UV exposure equipment for semiconductor, microfluidics, and nanotechnology, has won the bid from Trinity College, in Ireland, for its Nano Imprint Module, which will be integrated with OAI's Model 800 optical front and backside mask aligner. Trinity College purchased the Nano Imprint Module for both its R & D and teaching facilities.

Toppan touts first 32nm-capable photomask process

06/13/2008  June 12, 2008 - Toppan Printing Co. Ltd. says it has developed the first 32nm-generation photomask manufacturing process, for 193nm immersion (water) lithography, targeting volume production by June of this year. But how did the company overcome known problems with double patterning? And how compatible is it with non water-based immersion?

Vitex touts flexible CIGS lifetime achievement

06/12/2008  June 12, 2008 - Vitex Systems says it has achieved a "key breakthrough" in protecting flexible copper indium gallium selenide (CIGS) solar cells with its "Flexible Glass," achieving 1100 hrs of testing in high-temperature and humidity conditions with stable efficiency.

SVTC chooses Tegal for time-to-market advantage, MEMS etch collaboration

06/12/2008  June 12, 2008 -- Tegal Corp., provider of systems used in the production of MEMS and nanotechnology, has received an order for its 6500 HRe plasma etch tool from R&D fab SVTC Technologies, which serves markets including MEMS/MOEMS, photovoltaics, biotechnology, and image sensors. Further, Tegal and SVTC are collaborating on process recipe development.

Calando launches nanoparticle drug trial for lymphoma

06/12/2008  June 12, 2008 -- Calando Pharmaceuticals is collaborating with City of Hope in Duarte, CA to initiate a clinical trial using Calando's nanoparticle drug candidate, IT-101, in patients with lymphoma. "This is a very important and exciting trial to determine the efficacy and tolerability of a rationally designed and novel nanotechnology based drug delivery system," said Stephen Forman, M.D., adding that he's seen "impressive preclinical activity."

NanoViricides shows rapid response of animals to nanodrug candidate

06/12/2008  June 12, 2008 -- NanoViricides, Inc., a development-stage company creating special purpose nanomaterials for viral therapy, says the results of a recent study demonstrate the rapid response of animals to treatment using the company's nanoviricide drug candidate against Epidemic Kerato-Conjunctivitis (EKC).

Elpida, Qimonda finalize DRAM JV

06/11/2008  June 11, 2008 - Elpida Memory and Qimonda AG have put the finishing touches on their proposed DRAM JV (first disclosed in April) to develop memory chips with '4F2' cell sizes utilizing 40nm process technologies (ready by 2010) and later moving to 30nm, utilizing Qimonda's buried wordline technology and Elpida's stack capacitor technology.

Replisaurus decloaks with "middle of the line" metallization tech

06/11/2008  by Françoise von Trapp, managing editor, Advanced Packaging
June 11, 2008 -- Replisaurus has maintained a low profile since announcing their first round of funding in August 2006, but there's been a lot going on for the start-up company. With last week's announcement of the company's acquisition of Smart Equipment Technologies (SET), the company is ready show the world what it's been up to.

New High Power Ultrasonic Processors

06/11/2008  Sonics & Materials, Inc. (Newtown, CT) introducesd two new Vibra-Cell high power ultrasonic processors, a 500 and a 750 Watt model, capable of controlling the amount of energy delivered to a sample as well as controlling the temperature of the sample.

SIA lowers chip growth forecast, but industry resilient against macro challenges

06/11/2008  by James Montgomery, News Editor, Solid State Technology
June 11, 2008 - In its midyear forecast update/Webcast, the SIA has lowered its growth expectations for worldwide semiconductor sales to 4.3% (almost half the 7.7% it said six months ago), but SIA president George Scalise said the industry is actually doing quite well outside of the memory segment and is still showing immunity to broader US macroeconomic concerns.

Knutti, Allen launch Acuity Inc. for high-performance MEMS pressure sensors

06/11/2008  June 11, 2008 -- MEMS industry veterans Jim Knutti and Henry Allen have formed Acuity Inc., which they say will bring to market a line of high-performance, MEMS-based pressure sensors. The new company has a production agreement with MEMS foundry Semefab, where first product wafers are already in process.

Replisaurus Unveils "Middle-end-of-Line" Metallization Technology

06/10/2008  Just because Replisaurus, Inc. has maintained a low profile since announcing their first round of funding in August 2006, it doesn't mean there hasn't been a lot going on for the start-up company. In fact, just the opposite is true. With last week's announcement of the company's acquisition of Smart Equipment Technologies (SET), the company is ready show the world what it's been up to.