05/09/2008 May 9, 2008 -- The Institute of Bioengineering and Nanotechnology (IBN) in Singapore has developed an "extreme," nanotechnology-enabled lab-on-a-chip capable of sample prep and PCR in just 17 minutes. The microsystem uses magnetic nanoparticles to speed and simplify DNA testing.
05/09/2008 The U.S. Department of Defense has awarded Endicott Interconnect Technologies, Inc.(EI) a $148.6M contract modification for the continuation of the current program to produce card frame assemblies including HyperBGA organic semiconductor packaging, multi-chip module assemblies, printed circuit boards, functionally-tested circuit board assemblies and engineering services in support of a high reliability, high performance computing application.
05/09/2008 Mentor Graphics Corp. has aligned its integrated circuit (IC) implementation product lines under the design-to-silicon division to better address the design and manufacturing challenges of 45nm and smaller process nodes.
05/08/2008 May 6, 2008 -- /PRNewswire/ HONG KONG -- DuPont today announced it will soon begin construction on a research center in Hong Kong and a manufacturing facility in Shenzhen to support the rapidly growing photovoltaic (PV) solar energy industry.
05/08/2008 May 7, 2008 -- /PRNewswire/ LYNDHURST, NJ -- With its second acquisition in North America this year, Sika has added another long-respected player into its industrial flooring business in this region.
05/08/2008 May 7, 2008 -- KANSAS CITY, MO -- Multivac completed the full market introduction of all models of its new thermoform machine generation at Europe's Interpack trade exhibition.
05/08/2008 May 8, 2008 - Hynix Semiconductor and ProMOS Technologies have agreed to a partnership that will allow access to the Korean chipmaker's 50nm-node DRAM stack process technology, and give Hynix access to more 300mm capacity and an 8%-10% ownership stake in the Taiwan memory firm.
05/08/2008 May 8, 2008 - Qualcomm's MEMS subsidiary and Cheng Uei Precision Industry Co. Ltd. (dba "Foxlink") say they are opening a new dedicated fab in Taoyuan, Taiwan, to make Qualcomm's "mirasol" displays. The plant is slated to become fully operational in 2009.
05/08/2008 May 8, 2008 -- Agilent Technologies has released its Multi-wavelength Laser Combiner for microscopy applications in micro and nano R&D -- a modular unit that gives new fluorescence microscopy options to OEMs and end users.
05/07/2008 by Ed Korczynski, Senior Technical Editor, Solid State Technology
May 7, 2008 - Applied Materials product manager Paul Miller tells WaferNEWS about the inner workings of the company's new Inflexion edge polishing system that uses mechanical abrasion for removing defects on the wafer edge, touting 2× faster throughput than "competing" tools and an inherently "green" process.
05/07/2008 May 7, 2008 - Worldwide silicon wafer area shipments were roughly the same in 1Q as they were in 4Q, reflecting the industry's overall conservative environment, according to data from SEMI.
05/07/2008 Advance Nanotech, Inc., developer of nanotechnology-based chemical detection systems, has confirmed the appointment of Bret Bader as its incoming Chief Executive Officer. Mr. Bader is currently CEO of Owlstone Nanotech, Inc., Advance Nanotech's majority owned subsidiary.
05/07/2008 May 7, 2008 -- VT International Corp. says it has completed its acquisition of Nanotailor Inc., which last year licensed the rights to a NASA-developed manufacturing process for creating single-walled carbon nanotubes.
05/07/2008 Radiation Shield Technologies (RST) says it has been granted a new Australian patent for its nanotechnology-enabled Demron fabric, which it calls "the world's first nuclear radiation-blocking, anti-chemical and biological-protection material."
05/07/2008 May 7, 2008 -- Qualcomm MEMS Technologies and Taiwan-based Cheng Uei Precision Industry Co. ("Foxlink") are collaborating to open a MEMS fabrication plant that will enable increased volume, reduced time to market for MEMS-based mirasol displays.
05/07/2008 by Dick James, Senior Technology Advisor, Chipworks
May 12, 2008 - After the 45nm hype of the last few months, let's go to the other end of the CMOS scale and examine some interesting MEMS devices that are leading the penetration into new markets like consumer electronics -- and would not have been manufacturable without the deep etching processes that have evolved over the last few years.
05/06/2008 Last week's 3D/SiP Symposium hosted by SMTA, and co-sponsored by Advanced Packaging magazine, turned out to be an intimate gathering of approximately 55 attendees representing not only the U.S., but Canada, France, Japan, Taiwan, United Kingdom, Austria and the Republic of Korea.
05/06/2008 Centipede Systems has developed an optical socket suitable for testing the current and next-generation wave of chips used in wafer-level camera modules. The initial optical socket entry, part of Centipede's Centurion product line, is offered in a clamshell configuration for an individual integrated circuit. Currently, Centipede's optical sockets with a grid pitch as small as 0.4mm are available.
May 9, 2008 -- The Institute of Bioengineering and Nanotechnology (IBN) in Singapore has developed an "extreme," nanotechnology-enabled lab-on-a-chip capable of sample prep and PCR in just 17 minutes. The microsystem uses magnetic nanoparticles to speed and simplify DNA testing.