Featured Content




New Products

05/01/2008  Compiled by Jason Andrukaitis

Send in the offense for food defense

05/01/2008  Military software has been retrained for deployment in protecting the United States’ food supply against terrorist attack, helping those in the food business how to think like terrorists might.

Extending Leadframe Application Opportunities

05/01/2008  Leadframe-based packages accounted for over 70% of the 147 billion IC packages produced in 2007.

FDA takes next step in establishing overseas presence

05/01/2008  FDA has received approval from the U.S. State Department to establish eight full-time permanent FDA positions at U.S. diplomatic posts in the People’s Republic of China, pending authorization from the Chinese government.

Why CAPA still matters

05/01/2008  A properly implemented CAPA system will ensure that root causes of contamination are found and dealt with in a timely manner.

White Knight turns adversity into advancement

05/01/2008  Pre-planning and coordinated response to disaster helps garment manufacturer speed return to productivity.

Mergers and acquisitions may go slow

05/01/2008  In one sense, the recent purchase by Entegris (Chaska, MN) of a stake in privately held Integrated Materials, Inc.

The Trouble with News

05/01/2008  You would think that because I’m a National Public Radio junkie, news would be of vital importance to me – any type of news.

Who’s Who at BiTS, SEMICON China and IMAPS Device Packaging Symposium

05/01/2008  The Advanced Packaging editors covered a lot of ground this spring as co-sponsors of the Burn-in and Test Socket (BiTS) Workshop in Mesa, AZ, attending SEMICON China in Shanghai, and the IMAPS Device Packaging Symposium in Scottsdale, AZ.

Diversity and Standards

05/01/2008  3D packaging has a bright future. It simply makes a lot of sense.

Creating Wireless SiP Solutions

05/01/2008  While CMOS SoC works well in low power applications, it doesn't meet requirements for future wireless products.

Cleaning High-power Electronics A closed-loop SOlvent-Based Approach

05/01/2008  Flux residues must be be removed from flip chip components prior to subsequent processes to prevent malfunctions in high-power electronics.

Flash Memory for Stacked PoP Technology Issues and Test Challenges

05/01/2008  Flash memory has become a fundamental building block in modern electronic systems.

Choosing the Best Bump for the Buck

05/01/2008  Flip chip interconnect offers the advantages of smaller footprint on the PCB, improved electrical performance, reduced manufacturing steps at assembly, and excellent long-term reliability.

NIST: NIL actually improves nanoporous layers

04/30/2008  Apr. 30, 2008 - NIST says its work has helped resolve whether nanoimprint lithography (NIL) can accurately stamp delicate insulating structures without damage -- and in fact makes them better.

Swiss retail group says its Nanotechnology Code of Conduct will have far-reaching effects

04/30/2008  The Swiss Retailer's Organization (IG DHS), representing some of Switzerland's top retailers, has introduced what it calls "the world's first code of conduct for consumer products containing applications of nanotechnology." It requires those creating and selling nano-enabled products to pass "decision-relevant data" along the value chain.

University of Michigan Team Receives Grant to Research Electronics Heat Management

04/30/2008  A team led by a University of Michigan mechanical engineer has received a five-year, $6.8-million grant from the Air Force to examine heat management issues in the spectrum of electronic devices from jet engines to personal electronics to nano-scale transistors.

Discera claims MEMS oscillator "industry first" with Digi-Key worldwide distribution

04/30/2008  Discera, Inc.'s MEMS resonators are now available to manufacturers in more than 140 countries through Digi-Key Corp., a leading electronics distributor. The wide availability of Discera's MEMS products, which replace traditional quartz crystal devices, is a milestone that the company was able to achieve through its relationship with OEM partner Abracon. Small Times' editor in chief Barbara Goode explains.

Collaboration is the Theme at the 2008 Global STC Conference

04/30/2008  "Collaborative Solutions Beyond 2010" is theme of this year's Global STC Conference, organized by the Semiconductor Test Consortium, Inc. (STC). This interactive global forum, open to both STC member and non-members, will be held on June 4-6, 2008 in San Diego, California.