04/15/2008 SEMI is gearing up for the SEMICON Singapore, which takes place May 5-7, 2008 at the Suntec Singapore International Convention and Exhibition Centre. Southeast Asia is reportedly the leading region for test, assembly and packaging (TAP), so the event is expected to draw global semiconductor manufacturing executives from that sector of the industry.
04/15/2008 STMocroelectronics, a supplier of the MEMS devices found in many gaming and mobile multimedia applications, announced the addition of two accelerometers to its ultra-compact portfolio of devices in 4
04/15/2008 April 15, 2008 -- /PRWEB/ -- SAN JOSE, CA -- Glove boxes are sealed enclosures in which all items are handled through long, relatively impermeable gloves secured to ports in the walls of the enclosure.
04/14/2008 Global semiconductor assembly, test and packaging provider, ASAT Holdings, LTD. announced the appointment of Jeffrey Omun in the newly created position of president, effective immediately. In addition, Osmun will reportedly assume the title of executive V.P. of sales and marketing, assuming responsibility for the company's worldwide sales organization. Osmun will be based in the U.S. and report to Tung Lok Li, ASAT's acting CEO.
04/14/2008 TC-20SAS, a thermally conductive silicone double-sided adhesive tape is from Shin-Etsu Chemical Co., Ltd. provides thermal resistance and electrical insulation properties in addition to its thermal conductivity of 0.7 W/m
04/14/2008 Cascade Microtech's 20 GHz P30 Pyramid Probe for high-volume wafer testing of RF filters and switches uses unique membrane probe technology to reportedly achieve higher yields, lower maintenance and minimal down time. The P30's lithographic probes accuracy are said to alleviate uncontrolled impedance, which is characteristic of other probe types, and their compact size enables multi-site testing.
04/14/2008 By Gail Flower, editor-in-chief
On March 18-19 2008, a constant stream of visitors flowed in to SEMICON China, held in the Shanghai New International Expo Centre, to attend grand new product introductions and educational forums that addressed the latest in growth areas for electronics. What a clip of activity surrounded the conference. All of the familiar players were there doing business.
04/14/2008 By Josephus van Kuijk, Ph.D., Coventor, Inc.
For years now, companies that offer mechanical computer-aided design (CAD) solutions have emphasized the use of 3D CAD tools. While progress has been uneven, we can reasonably say that the transition has been accomplished in the mechanical area, first from paper-based technical drawings to 2D computer-based drawings, and now to 3D CAD systems.
04/14/2008 By Gail Flower, editor-in-chief
The ninth annual Burn-in and Test Socket Workshop (BiTS 2008) on March 9-12, 2008 in Mesa, AZ, presented an interactive, growing, and technical successful forum for experts dedicated to sharing knowledge. BiTS brought together 350 conference attendees and 60 exhibitors worldwide from users of sockets, boards, burn-in systems, handlers, packaging engineers, and suppliers to the industry.
04/14/2008 By Patrick Carrier, Mentor Graphics
In recent years, long-ignored thermal issues have been wreaking havoc on electronic systems' reliability. Anyone who has opened a computer case and seen the massive, often elaborate heatsinks attached to microprocessors knows how severe thermal issues can be. A more proactive approach, applying various methodologies, is the only solution for successfully designing complex electronic systems to meet thermal requirements.
04/14/2008 ASM Pacific Technology's latest generation large-area chip bonder, the MCM12, is said to address the growing market for MCM, SIP, and hybrid applications. It is a fully automatic multiple die, SMD, and flip chip bonding system with up to 300-mm wafer handling capability. Direct die, flip chip, stack die, and SMD bonding can all be integrated into this single platform tool.
04/14/2008 The Pegasus S200A automatic 200-mm prober from Wentworth Laboratories, Inc. is the latest addition to the company's wafer prober line. Intended for high-volume wafer probing of light emitting diodes (LEDs), it also tests discrete devices and wafers up to 200-mm. Pegasus S200A is integrated with production LED testers to bring a fully automatic test platform to the LED production test floor.
04/14/2008 April 14, 2008 -- /PRWEB/ -- Jupiter, FL -- In October 2007, the Occupational Safety and Health Administration (OSHA) had issued a new directive CPL 03-00-006 to address fires and dust explosion hazards that may exist at facilities handling combustible dust.
04/14/2008 April 14, 2008 -- /ENDICOTT, NY/ -- The Center for Advanced Microelectronics Manufacturing (CAMM) located at the Endicott Interconnect Technologies, Inc. facility was inaugurated on Monday, March 31 in a ceremony attended by business, political, and community leaders.
04/14/2008 by Debra Vogler, Senior Technical Editor, Solid State Technology
Apr. 14, 2008 - The major Japanese IDM was the beta customer for a via/contact etch model to satisfy the need for accurately modeled and corrected processes at 45nm and beyond. Ponte chief scientist Valeriy Sukharev discusses details of the new model with WaferNEWS.
04/14/2008 The former Michigan Nanofabrication Facility and Solid State Electronics Laboratory is now the University of Michigan's Robert H. Lurie Nanofabrication Facility -- and it sports a 37,500 square-foot addition. About $20 million in new nanotechnology and MEMS/microsystems R&D equipment will added.
04/14/2008 Ambios Technology, Inc. -- maker of surface measurement and visualization instruments for nanotechnology R&D -- has entered into a multi-year agreement to double the size of its Santa Cruz, CA headquarters.
04/11/2008 Apr. 11, 2008 - UK-based Oxford Instruments says it has acquired Silver Spring, MD-based Technologies and Devices International, a developer of hydride vapor phase epitaxy (HVPE) technology and processes, in a bid to expand its offerings for makers of high-brightness LEDs.
