03/13/2008 ; Palomar Technologies, provider of precision automation equipment and process development for microelectronic assembly, will discuss its microelectronic packaging services at the iMAPS International Conference and Exhibition on Device Packaging to be held in Scottsdale, AZ, on March 18 and 19. Palomar Technologies will be exhibiting in booth #66.
03/13/2008 Unidym Inc., a majority-owned subsidiary of Arrowhead Research, has entered into a joint development agreement with Nippon Kayaku, a Japanese chemical company, to integrate Unidym's printable transparent electrodes into Nippon Kayaku's thin film solar cells.
03/13/2008 Omron Electronics Components Business—Europe (OCB-E) is now offering to customize its D6F MEMS mass flow sensor products to suit individual customer requirements in terms of flow rate and non-corrosive gas type.
03/13/2008 Rosetta Biosoftware has announced that the most recent version of its Rosetta Resolver gene expression data analysis system, version 7.1, now supports Affymetrix GeneChip Gene 1.0 ST (Sense Target) arrays.
03/13/2008 March 12, 2008 -- /PRNewswire/ -- PHILADELPHIA, PA -- Isogen announced it will introduce new solutions to address the pharmaceutical industry's long-standing process, facility, and capacity problems associated with the low-volume clinical and early-stage commercial sterile filling market at INTERPHEX 2008.
03/13/2008 March 12, 2008 -- /PRWEB/ -- ROCHESTER, NY -- PKG Equipment, Inc. has just received exclusive authorization to use HY-PRO flame retardant clad polypropylene to manufacture process equipment.
03/12/2008 by M. David Levenson, Editor-in-Chief, Microlithography World Since high-volume EUV lithography is delayed, the first 32nm generation chips will have to be printed with double patterning technology (DPT) for critical layers and much of the conference focused on the various options, none of which seemed fully developed. (First in a four-part series)
03/12/2008 by M. David Levenson, Editor-in-Chief, Microlithography World
Progress continued in EUV lithography, but at a rate well below that needed for insertion at 32nm. AMD described the patterning of an entire metal-1 layer for a full exposure field chip and the integration of EUVL into the process flow. Sources remain an issue, though some think solid state lasers could help improve efficiency. Others are thinking ahead to 22nm. (Second in a four-part series)
03/12/2008 by M. David Levenson, Editor-in-Chief, Microlithography World Intel chose this SPIE conference to present five papers on pixelated masks, an apparently abandoned program on pixelated masks that had pre-occupied litho engineers for several years. Elsewhere, prospects for high-index immersion technology seem to be dimming, and progress remains sluggish on a promising medium-throughput e-beam direct write for imprint litho. (Third in a four-part series)
03/12/2008 by M. David Levenson, Editor-in-Chief, Microlithography World
Avoiding unprintable structures will be essential for manufacturing 45nm and smaller circuits, and that was reflected in a series of papers on design for manufacturing and design rule restrictions, some of them quite aggressive. (Fourth in a four-part series)
03/12/2008 Mar. 12, 2008 - A report from FBR Research says wafer sales to the semiconductor industry should decline about 6%-7% in 1Q08, but that will be cancelled out by strength in the spot market and by solar wafer demand, and that MEMC's strategy of signing long-term solar contracts over currently surging spot market prices is still an attractive model.
03/12/2008 The Project on Emerging Nanotechnologies (PEN) and National Science Foundation (NSF) will host the Washington, DC, premiere event for the television series "Nanotechnology: The Power of Small," on Wednesday evening, April 2.
03/12/2008 ; Advanced Analogic Technologies Inc. (AnalogicTech), a developer of power management semiconductors for mobile consumer electronic devices, has made available chip scale packages (CSPs) for its AAT1149 and AAT1171 DC/DC converters. Bond wires are eliminated, offering a reduction in footprint.
03/12/2008 ; 3D inspection technology company Koh Young announces the establishment and opening of a sales and service division in Chiba, Japan, called Japan Koh Young Company Ltd. The branch has been established to better serve the evolving needs of the company's Japanese customers.
03/12/2008 The Finland-based biotechnology company Mobidiag announced the new Prove-it Herpes test for the fast and reliable identification of herpes viruses. The microarray-based test takes fewer than three hours to complete and enables simultaneous identification of eight different human herpes viruses.
03/12/2008 EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, announced that Austrian technology-research company NanoTecCenter Weiz Forschungsgesellschaft mbH (NTC Weiz) has purchased an EVG620 precision alignment system for installation in its new R&D facility focused on organic/plastic electronics.
03/12/2008 Sensata Technologies has introduced a "rugged" version of its 8PP3 Silicon MEMS Strain Gauge pressure sensor designed for use on construction and earth-moving equipment operating in harsh work-site environments.
03/12/2008 ALine's newest family of ultra-low volume, disposable UV transparent microfluidic cuvettes for fluorescence, the FluoroVette, and for absorbance, the SpecVette, offer easy-fill pipette ports or hose barb adapters for flowing applications. ALine's microfluidics cuvettes work in standard laboratory instrumentation, such as a spectrometer, or sit on a microscope stage.
03/12/2008 ; Cadence Design Systems Inc. has acquired Chip Estimate Corp., a company that delivers IC planning and enterprise-level IP reuse management solutions. Founded in 2003, Chip Estimate products enable electronics design teams to predict the die size, yield, power consumption, performance, and cost of chips based on almost any design architecture, IP, and silicon process node options. Terms of the agreement were not disclosed.
