12/15/2017 More materials for electronic applications could be identified, thanks to the discovery of a new metal-organic framework (MOF) that displays electrical semiconduction with a record high photoresponsivity, by a global research collaboration.
12/15/2017 North America-based manufacturers of semiconductor equipment posted $2.05 billion in billings worldwide in November 2017 (three-month average basis), according to the November Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.
12/14/2017 As part of this agreement, TMC and Western Digital will participate jointly in future rounds of investment in Fab 6, the memory fabrication facility now under construction at Yokkaichi, including the upcoming investment round announced by Toshiba in October 2017.
12/14/2017 Fabricated using a charge compensation principle and IXYS' own process technology, these new MOSFETs exhibit the lowest on-state resistances in the industry.
12/14/2017 Leti, a research institute of CEA Tech, will demonstrate at CES 2018 its new wristband that measures physical indicators of a range of conditions, including sleep apnea, dehydration and dialysis-treatment response.
12/14/2017 QuickLogic Corporation, a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, display bridge and programmable logic solutions, announced that it has collaborated with Mentor, a Siemens business, to provide a seamless design and development environment for its embedded FPGA (eFPGA) technology.
12/13/2017 Accelerometers and gyroscopes are fueling the robotic revolution, especially the dronesÂ’ market segment. However, these MEMS devices are not the only ones on the market place anymore, with environmental sensors penetrating this industry too.
12/13/2017 Researchers at Aalto University have developed a biosensor that enables creating a range of new easy-to-use health tests similar to home pregnancy tests. The plasmonic biosensor can detect diseased exosomes even by the naked eye. A rapid analysis by biosensors helps recognize inflammatory bowel diseases, cancer and other diseases rapidly and start relevant treatments in time. In addition to using discovery in biomedicine, industry may use advanced applications in energy.
12/12/2017 aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, today announced it has obtained results that strongly support the continued use of copper in the back end of line (BEOL) for advanced interconnects, at and beyond the 5nm technology node.
12/12/2017 In a major step toward making a quantum computer using everyday materials, a team led by researchers at Princeton University has constructed a key piece of silicon hardware capable of controlling quantum behavior between two electrons with extremely high precision.
12/12/2017 ProPlus Design Solutions Inc. and MPI Corporation today announced a strategic partnership agreement and immediate availability of a characterization and modeling solution that integrates ProPlus' SPICE modeling and noise characterization solution with MPI's advanced probing technologies.
12/12/2017 Dr. Yu selected for significant contributions to semiconductor-based devices, nanotechnology research after being awarded more than 300 U.S. patents.
12/12/2017 EVG 810LT system enables low-temperature direct wafer bonding of III-V compound semiconductor materials and germanium-on-silicon wafers with field-proven high-quality plasma surface preparation.
12/11/2017 Heating a mixture of gases to furnace temperatures is one way to make a diamond film, nature's hardest substance. Adding boron to the gas mixture may create new materials.
07/10/2014 Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.