03/03/2008 ; In the semiconductor industry, device characterization or screening occurs through the use of two related tests: burn-in and elevated temperature device characterization, with both tests using temperatures >99°C: the first to accelerate device failure modes that could be related to those in the field, and the second to simulate functional device behavior while characterizing its performance level.
03/03/2008 ; This article is the third in a series on 3D packaging technology, and summarizes information presented during a January 2008 webcast hosted by Advanced Packaging magazine. Participants were: Fred Roozeboom, Research Fellow, NXP Semiconductors and professor at TU Eindhoven; Kai Zoschke, Research Engineer for Fraunhofer IZM; and Thorsten Matthias, Director of Technology North America, EV Group.
The SST Editorial Staff recaps SEMI's recent Industry Strategy Symposium (ISS), and the Strategic Materials Conference (SMC) that followed, with this special report series available only on our website.
03/03/2008 March 3, 2008 -- Stefan Wurm, program manager, EUV strategy at SEMATECH, updates Solid State Technology's Senior Technical Editor Debra Vogler on that group's progress in immersion lithography and EUV. Highlighted is progress on EUV mask defectivity and the first integrated chip with a layer made using EUV lithography. He also discusses the nanocomposite approach to high-index immersion lithography and the consortium's efforts to monitor non-optical lithography methods (e.g., NIL).
03/03/2008 ; At SEMICON China 2008, taking place March 18-20 at the Shanghai New International Expo Centre, two of the companies that will showcase new products are FINETECH Shanghai and Kyzen Corp. FINETECH Shanghai will present the FINEPLACER CR7.MD compact rework system at its Booth 2166 and Kyzen will feature its MICRONOX MX2302 engineered semi-aqueous solvent blend at two representatives' booths: WKK's Booth 2636 and Sigmatek's Booth 3725.
03/03/2008 ; Advanced Semiconductor Engineering Inc. has announced that it has entered into a syndicated loan agreement with a banking syndicate led by Citibank, N.A., Taipei Branch, for a NT$24,750 million term loan facility.
03/03/2008 February 29, 2008 --/PRNewswire/ -- DEERFIELD, IL -- Baxter International Inc. announced that the company is proceeding with the voluntary recall of all remaining lots and doses of its heparin sodium injection multi-dose, single-dose vials and HEP-LOCK heparin flush products.
03/03/2008 February 29, 2008 -- /PRNewswire/ -- FAIR LAWN, NJ -- Tasker Products Corp., a distributor and marketer of proprietary technology effective in inhibiting pathogenic bacteria, today reported that it has installed its equipment to dispense its poultry processing application, Tasker Blue, in plants of two new customers over the last seven days.
03/03/2008 ; Power Integrations today announced the availability of its TOPSwitch-HX series of AC-DC power conversion ICs in the new eSIP-7C eco-single-inline-package. This package exhibits the low thermal impedance of the traditional TO-220, yet stands less than 10mm above the PCB.
03/03/2008 ; Fujitsu Laboratories Ltd. today announced the successful formation of a new nano-scale carbon composite featuring a self-organizing structure by combining carbon nanotubes and graphene, which are both nano-scale carbon structures. The newly-discovered composite structure is synthesized at a temperature of 510°C.
03/03/2008 Fujitsu Laboratories Ltd. has combined carbon nanotubes and graphene to form a new nanoscale carbon composite. The self-organizing structure is synthesized at a relatively low temperature, paving the way for the feasible use of graphene in electronic devices.
03/01/2008 Today’s critical environments must not only adhere to strict contamination control standards but also meet the needs of individual industries and customers.
Fujitsu Laboratories Ltd. has combined carbon nanotubes and graphene to form a new nanoscale carbon composite. The self-organizing structure is synthesized at a relatively low temperature, paving the way for the feasible use of graphene in electronic devices.