02/28/2008 February 28, 2008 -- /WEST LAFAYETTE, IN/ -- Researchers have developed a new technology that can simultaneously screen thousands of samples of food or water for several dangerous food-borne pathogens in one to two hours.
02/28/2008 Feb. 28, 2008 - In what is becoming a common sight on public newswires, another chip industry company is airing out some dirty laundry with an unusually public statement about internal affairs -- this time ASMI's rejection of a stakeholder's calls for replacing its board members.
02/28/2008 February 27, 2008 -- /PRNewswire/ -- LEHIGH VALLEY, PA -- Air Products, a pioneer of cryogenic food freezing and chilling technologies, announces the grand opening of its Asia Food Technology Center at the Thailand Science Park in Bangkok.
02/28/2008 PI (Physik Instrumente) L.P.'s newest PIHera flexure-guided nanopositioning stages offer "record" travel ranges to 1.8 mm, and thus enable scanning of areas more than 200 times larger than conventional piezo stages.
02/28/2008 SEMATECH, an association of semiconductor technology developers, has purchased Molecular Imprints' new Imprio nanoimprint lithography (NIL) tool, announced this week. SEMATECH will use the Imprio 300 to demonstrate the feasibility of for semiconductor production at 32nm and below.
02/28/2008 During his keynote today at the Global Electronics Forum in Osaka, Japan, Brian Halla, chairman and CEO of National Semiconductor Corp., discussed a number of key megatrends that will drive chip industry growth. The megatrends include personal mobile devices with enhanced video displays and on-board video projectors; portable medical equipment; and enhanced security and surveillance devices, including smart sensors for high-precision detectors.
02/28/2008 by M. David Levenson, Editor-in-Chief, Microlithography World
At about the 90nm node, circuit features so much smaller than the exposure wavelength led to increased circuit variability, lithography hotspots, and limited yields (and applying restrictive design rules had limited success). Now, startup Tela Innovations is proposing a radical step to solve the industry's layout problems: employing pre-defined linear topologies, workable with 32nm and double-patterning and down to 22nm.
02/27/2008 Feb. 27, 2008 - Rohm & Haas Electronic Materials/CMP Technologies and IBM are adding to their collaborative plate, with a pact to develop CMP processes for integrating copper and low-k dielectrics, in order to create copper CMP consumables for 32nm and 22nm device manufacturing.
02/27/2008 ; Members of Unovis Solutions' 2008 Advanced Research in Electronics Assembly Consortium are gathering for the last day of this two-day conference to review this year's research plan and to review results of recent investigations. Attendees from more than 30 companies and institutions are expected to congregate for an in-depth look at process and reliability-related research in electronics assembly.
02/27/2008 Feb. 27, 2008 - Startup Tela Innovations says it has raked in about $5M in funding over two rounds since mid-2006, including an infusion from Intel's VC arm.
02/27/2008 Feb. 27, 2008 - Eight new Fellows have been added to SPIE's roster to honor their scientific and technical contributions in optics/photonics/imaging, and to the group in particular. Also, receiving awards at this year's SPIE Advanced Lithography symposium were researchers from ASML, IBM, KLA-Tencor, and the U. of Wisconsin/Madison.
02/27/2008 Feb. 27, 2008 - SEMATECH has purchased Molecular Imprints new Imprio 300 tool to demonstrate the feasibility of nanoimprint lithography for 32nm and below semiconductor production. Initial work will focus on demonstrating and enhancing overlay performance, and identify development areas to accelerate the introduction of the technology into manufacturing. Delivery is scheduled for mid-2008.
02/27/2008 Feb. 27, 2008 - Presenting at the SPIE Advanced Lithography Symposium, Philips Extreme UV and XTREME Technologies offered proof-of-principle experiment results showing their gas-discharge plasma source can be scaled to 100kHz operation frequency, which translates to a record 500W EUV source power -- more than enough to meet requirements for high-volume semiconductor manufacturing.
02/27/2008 by Bob Haavind, Editorial Director, and James Montgomery, News Editor, Solid State Technology
Feb. 27, 2008 - AMD and IBM say they have produced a working 22mm x 33mm test chip built with 45nm process technologies using EUV lithography for the first critical layer of metal interconnects, pushing beyond previous EUV efforts that involved "narrow field" portions of the design.
02/27/2008 ; Microchip Technology Inc. has announced a new family of low-cost, 8-bit Flash PIC microcontrollers (MCUs). The 28- and 40-pin PIC16F722/3/4/6/7 (PIC16F72X) MCUs are capable of operation down to 1.8V and feature a 16 MHz internal oscillator; up to 14 ADC channels; communication (SPI, I2C, AUSART) and two capture, compare and PWM (CCP) modules; plus the mTouch Sensing Solution peripheral.
02/27/2008 ; Based on its commitment to success and ability to meet a set of challenging objectives, the Electronics and Industrial Groups of Henkel have been awarded Prime Source Awards from Atlanta-based EIS, an electrical/electronics industry distributor. EIS president and CEO, Bob Thomas, presented the awards to Henkel's Jim Sharp, Electronics Goup southeastern territory manager, and Ken Helfers, industrial group distribution account executive.
02/27/2008 ; Technological advances on the horizon and future industry demands: this is the focus of "Will You Be Ready?: An Endicott Technology Interchange," sponsored by IPC, the Association Connecting Electronics industries. On May 14, Endicott Interconnect Technologies Inc. will open up its headquarters in Endicott, NY, for a day of information exchange and networking in order to provide a vision of future direction and needs.
02/27/2008 With more and more optical network automation, one task has remained manual: fiber connections. But now, as the result of MEMS-related research conducted by Verizon, that is likely to change.
