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Fraunhofer-led EU solar R&D adds Synova as partner

02/26/2008  Feb. 26, 2008 - Synova says it has joined a research alliance led by the Fraunhofer Institute for Solar Energy Systems to explore how its water jet-guided laser technology could be used as a manufacturing method to speed processing and improve performance of solar cells.

NEWS ANALYSIS: Toshiba expands MCMs

02/25/2008  Feb. 25, 2008 - Toshiba America Electronic Components says it has expanded its family of power multi-chip modules (MCM) with a synchronous step-down converter switching module, targeting applications such as mobile computers, servers, and network equipment.

Molecular Imprints announces 4WPH step-and-flash imprint tool

02/25/2008  by M. David Levenson, Editor-in-Chief, Microlithography World
Feb. 25, 2008 - Molecular Imprints CEO Mark Melliar-Smith tells WaferNEWS why its Imprio 300 imprint lithography tool is the "only game in town" for semiconductor prototyping and process development in the <30nm realm, capable of printing 32nm, 28nm and 22nm features at 4WPH with 35nm overlay.

Dow Corning taking collaborative route to photoresist goals

02/25/2008  by James Montgomery, News Editor, Solid State Technology
Feb. 25, 2008 - Dow Corning exec Jeff Bremmer talks with WaferNEWS about how his company has turned to a new business model, development partnerships with litho materials suppliers, for its push into the world of photoresist resins.

NEWS ANALYSIS: Wanna buy a semi implant biz?

02/25/2008  Feb. 25, 2008 - In a move to narrow its focus to homeland security applications, Implant Sciences is putting its semiconductor subsidiary, Core Systems up for sale.

Synova teams with Fraunhofer ISE and photovoltaic manufacturers in European solar research alliance

02/25/2008  February 25, 2008 -- /PRNewswire/ -- LAUSANNE, SWITZERLAND -- Synova, the world pioneer and patent holder of water jet-guided laser technology, today announced it has joined a research alliance led by Europe's largest solar research organization, the Fraunhofer Institute for Solar Energy Systems, to explore new manufacturing methods that will both speed processing and improve the performance of solar cells.

Heraeus Opens Upgraded Manufacturing Facility for Assembly Materials

02/25/2008  ; Heraeus has opened an 80,000 sq.-ft. upgraded, consolidated manufacturing facility at its Pennsylvania headquarters that includes manufacturing, research and development, quality control labs, and shipping. The upgraded facility includes a 5000 sq.-ft. cleanroom, which will enable Heraeus to continue to produce materials at double the previous capacity.

Foster Wheeler acquires leading U.S. biopharmaceutical process design company

02/25/2008  February 25, 2008 -- /BUSINESS WIRE/ --HAMILTON, BERMUDA -- Foster Wheeler Ltd. announced today that it has significantly strengthened its position in the biotech and pharmaceutical markets by completing the acquisition of 100 percent of the stock of privately held Biokinetics Inc. from MPA Holdings LP.

Microsoft introduces patient safety screening tool to stop spread of in-hospital infections

02/25/2008  February 25, 2008 -- /PRNewswire/ -- ORLANDO, FL -- Today at the Healthcare Information and Management Systems Society (HIMSS) 2008 Annual Conference & Exhibition, Microsoft Corp. announced the release of its patient safety screening tool (PSST), a software-based solution designed to help healthcare organizations identify potential adverse events that occur during hospitalization.

AirInSpace receives FDA clearance for advanced device that captures and inactivates biological particles

02/25/2008  February 25, 2008 -- /WASHINGTON/ -- AirInSpace announced today that it has received FDA clearance to market its PlasmairT2006 by AirInSpace mobile system as a medical device.

Aquest and Gores release letter expressing interest in acquiring Asyst

02/25/2008  February 25, 2008 -- /PRNewswire/ -- LOS ANGELES AND SUNNYVALE, CA -- Aquest Systems Corp. and The Gores Group, LLC are jointly releasing a letter that describes their proposal to explore the acquisition of Asyst Technologies, Inc. at a significant premium to the company's current share price.

Brion powers up to meet DPT challenges at 32nm-22nm

02/25/2008  by Debra Vogler, Senior Technical Editor, Solid State Technology
Feb. 25, 2008 - At the opening of this week's SPIE Advanced Lithography Symposium, Brion Technologies unveiled a more powerful version of its Tachyon Computational Lithography platform, and the release of Tachyon DPT, software that allows chipmakers to meet the low k1 requirements for memory and logic devices at 32nm and below.

Steinmeyer's new manipulator stage targets nano, micro

02/25/2008  Steinmeyer Inc.'s new high precision micro manipulator stage, MT 130-50-DC is geared to nanotechnology, metrology, biomedical, and robotics applications.

Colybris orders MEMS production systems from EV Group

02/25/2008  EV Group, which supplies MEMS and nanotech manufacturing equipment has received a multiple system order from Colibrys, a Swiss MEMS sensor supplier.

Credence sells diagnostics biz to former GM

02/25/2008  Feb. 24, 2008 - Credence Systems has sold its diagnostics and characterization business to DCG Systems, an independent company led by Israel Niv, former GM of the business from 2003-2005 and founder of Optonics, an emission-based optical diagnostics and failure analysis supplier bought by Credence in late 2002.

SEMI: Chip equipment demand still soft, but balance improving

02/23/2008  Feb. 22, 2008 - Demand for semiconductor manufacturing equipment is still below levels from early 2007, reflecting what chipmakers have been saying about a soft investment environment, but the numbers are showing slow improvement from their lowest points in 2007, according to data from SEMI.

Antares Advanced Test, IC Test Lab Partner on DUT-level Qual Burn-in

02/22/2008  ; Antares Advanced Test Technologies and an undisclosed IC test lab in the Silicon Valley have partnered to configure a burn-in chamber at the test lab with Antares' iSocket thermal-management technology to allow semiconductor engineers in the region to conduct off-site qualification burn-in of 50W devices and below with individual DUT-level temperature controls.

NEC's coating process helps develop carbon nanotube transistor

02/22/2008  NEC Corp. has developed a carbon nanotube transistor using a coating process

NanoGram's new silicon nanomaterials target electronics, energy apps

02/22/2008  NanoGram Corp., has created what it is calling a new class of silicon nanoscale materials applicable to electronics materials, energy, display and solid-state lighting.

EV Group Secures Multiple System Order for MEMS-based Motion Sensors

02/22/2008  ; EV Group (EVG) has announced that it has received a multiple system order from Colibrys for one EVG520 semi-automated wafer bonding system and two EVG620 fully automated mask/bond aligners. One bonder and aligner tool set was installed at the Colibrys Inc. manufacturing facility in Stafford, TX, last month, while the other will be installed at the company's headquarters in Neuchatel, Switzerland before the end of 1Q08.