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Sono-Tek assigned patent for its MediSonic technology

02/21/2008  February 21, 2008 -- /MILTON, NY/ -- Sono-Tek Corp., the world leader in the development and application of liquid ultrasonic atomization technology into precision and liquid conserving spraying and coating application systems, announces that it has recently been assigned a patent for MediSonic by the USPTO.

PharmaMedDeviceTM enhances educational value of 2008 conference

02/21/2008  February 21, 2008 -- /NORWALK, CT/ -- The producers of the PharmaMedDeviceTM Conference & Exhibition announced today that the 2008 conference program, March 26-28, 2008 in Philadelphia, will feature AdvaMed's world class Medical Technology Learning Institute (MTLI) workshop.

KLA-Tencor scoops up ICOS for backend, LCD/solar play

02/21/2008  Feb. 21, 2008 - The latest move in metrology industry consolidation has occurred with KLA-Tencor's proposed "friendly" acquisition of Belgium firm ICOS Vision Systems in a proposed €316.9M (US $465.8M) cash transaction.

Tracking the future of TSV

02/21/2008  by Ed Korczynski, Senior Technical Editor, Solid State Technology
A new report from TechSearch International forecasts millions of silicon wafers will be made with through-silicon vias (TSV) in the year 2014. With TSV technology now moving past the feasibility (R&D) phase and into the commercialization phase, the question isn't whether this 3D interconnect will be adopted, but how soon it will balance cost/performance vs. existing technologies to break into real mainstream use.

Rudolph Joins Leading Chipmakers in SEMATECH's Metrology Program

02/21/2008  ; Rudolph Technologies Inc. and SEMATECH, have announced that Rudolph has become the first semiconductor equipment supplier company to join SEMATECH's Metrology Program headquartered at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany.

MEPTEC Finalizes Program for 4th Thermal Management Symposium

02/21/2008  ; MEPTEC, the MicroElectronics Packaging and Test Engineering Council, has finalized the program for its 4th Annual Thermal Management symposium titled "The Heat Is On: Thermal Technology Solutions for Advanced Products." This one-day technical event will be held on February 28, 2008, at the Wyndham Hotel, San Jose, CA.

Indium Corp. Presents Award to Zen Voce

02/21/2008  ; Indium Corp.'s Semiconductor Packaging Materials team presented their Equipment Partner of the Year Award to Zen Voce. The award, presented in Singapore, was given to Zen Voce's GM, Jeffrey Mah, by Indium's managing director for Asia-Pacific operations, Pang Weng Fai.

Vectron Introduces GPS-Quality TCXO in a 3.2x2.5mm LCC Package

02/21/2008  ; Vectron International has announced its smallest temperature compensated crystal oscillator (TCXO) to date. The new VTM3 TCXO offers similar phase noise performance to Vectron's VTC4 and VTC1 TCXOs in a 50% smaller package (3.2mm x 2.5mm).

ISO 14644-6 vocabulary approved as an American national standard

02/21/2008  February 20, 2008 -- /ARLINGTON HEIGHTS, IL/ -- International Organization for Standardization (ISO) standard 14644-6, cleanrooms and controlled environments part 6, vocabulary has been approved as an American national standard.

Online audio series offers infection control solutions

02/21/2008  February 20, 2008 -- /Oak Brook, IL/ -- The statistics are well known; the CDC says nearly 2 million patients get an infection while hospitalized for other health problems each year, and nearly 90,000 die as a result, yet health care-associated infections continue to plague health care organizations.

Toshiba, Sony finalize chip JV details

02/20/2008  Feb. 20, 2008 - Sony and Toshiba are disclosing more details about their semiconductor JV, including PlayStation chips, following preliminary agreements last fall.

Updated: Nikon's double-patterning tool due by 4Q08

02/20/2008  Feb. 20, 2008 - Nikon Corp. says it will have an "enhanced" version of its NSR-S610C ArF immersion scanner, optimized for double-patterning lithography process, ready for customers by 4Q08, billing the upgrade as a "low-risk solution" for developing double-patterning technology for use at the 32nm node.

Rudolph, SEMATECH, Albany forge process characterization pact

02/20/2008  Feb. 20, 2008 - Rudolph Technologies and SEMATECH are establishing an international process characterization program to develop process, analysis, and characterization technology targeting 32nm and beyond semiconductor manufacturing. Work will be headquartered at the U. of Albany's College of Nanoscale Science and Engineering (CNSE). Rudolph says it is the first semiconductor equipment supplier to join SEMATECH's metrology program at Albany.

SEAJ: Chip tool demand slips in January

02/20/2008  Feb. 20, 2008 - New data from SEMI and the Semiconductor Equipment Association of Japan (SEAJ) fuels continued concerns of a soft investment climate among global chipmakers.

Biomedical applications using magnetic nanoparticles

02/20/2008  The ability to make magnetic particles the size of biological functional units, such as proteins, enzymes, and DNA, has opened up new ways to interact with the biological world. Activating these magnetic nanoparticles with biological molecules enables their unique nanoscale magnetic properties to be exploited for a wide variety of biomedical applications, such as separation, diagnosis, and therapy.

A new approach to dicing MEMS

02/20/2008  The delicacy of MEMS structures makes dicing these devices tricky business. Current approaches to overcoming these challenges involve additional manufacturing steps and processes. Novel approaches that call for adaptation to the dicing equipment rather than the devices themselves may be a better solution.

Nano needs the R&D Act

02/20/2008  The importance of the 21st Century R&D Act to America's nanotechnology industry cannot be overstated. Nor can its re-authorization.

MEMS packaging lab augments Infotonics' design and fabrication services

02/20/2008  With the recent investment of $5 million in MEMS packaging capabilities, Infotonics Technology Center (ITC) is positioning itself as a full-service partner for customers seeking to create new MEMS-based devices and microsystems.

Nanocomp produces 'largest' sheet of carbon nanotube material

02/20/2008  Nanocomp Technologies Inc. says it has successfully produced 3-foot by 6-foot sheets of carbon nanotube felted fabric. The highly conductive material is composed of Nanocomp's millimeter-long nanotubes.

Complex Integration Spurs Growth in Interconnect Materials Market

02/20/2008  ; Techcet Group LLC reports the market for interconnect metals and dielectric materials, totaling $350 million in 2007, is maintaining its lead as the highest growth area compared to other semiconductor process materials. The latest edition of the Techcet report "Advanced Interconnect Materials for the 65 through 32nm Nodes" discusses the materials used and likely to be used in subsequent technology generations for logic and memory products.