02/20/2008 ; Semiconductor Research Corp. (SRC), a university-research consortium for semiconductors and related technologies, has announced that the College of Nanoscale Science and Engineering (CNSE) of the U. at Albany will serve as headquarters for a research effort aimed at enabling nanoelectronics advances that are critical for the development of smaller, faster and cheaper computer nanochips.
02/19/2008 February 19, 2008 -- /PRNewswire/ -- MINNEAPOLIS, MN -- Pace Analytical Services, Inc., is pleased to announce that, effective February 19, 2008, it has purchased the assets of Laucks Testing Laboratory, Inc. in Seattle, WA.
02/19/2008 by Katherine Derbyshire, Contributing Editor, Solid State Technology The vast majority of solar cells depend on p-n junctions in inorganic semiconductors, but their limitations have inspired investigation of a variety of alternate means for harnessing the sun's energy. One of the most successful alternative designs is dye-sensitized solar cells
02/19/2008 February 19, 2008 -- /ARLINGTON HEIGHTS, IL/ -- A newly revised Recommended Practice from the Institute of Environmental Sciences and Technology describes a method for characterizing organic compounds outgassed from materials or components exposed to air or gases in cleanrooms and other controlled environments.
02/19/2008 February 19, 2008 -- /PRNewswire/ MOORESVILLE, NC -- Anpath Group, Inc. reported today that its wholly owned subsidiary, EnviroSystems, Inc., announced completion of a development and marketing agreement with Foster-Miller, Inc., a wholly owned subsidiary of QinetiQ North America and part of its Technology Solutions Group, for the purpose of promoting the joint sales of ESI's disinfectant products and Foster-Miller's electrostatic charged aerosol decontamination systems.
02/19/2008 February 19, 2008 -- /PRNewswire/ -- SAN JOSE, CA -- GES, Inc. today announces it has been awarded a personnel service contract by Kokusai Electric Semiconductor Service, Inc., one of the subsidiaries of semiconductor equipment division of Hitachi Kokusai Electric, Inc.
02/19/2008 Feb. 19, 2008 - Toshiba and SanDisk have signed a nonbinding memorandum of understanding to form a new production JV and a new 300mm wafer fab for NAND flash memory, with a definitive agreement expected later this year. Separately, Toshiba indicated it will build another chip plant in Japan to boost in-house semiconductor capacity.
02/19/2008 ; Going to SEMICON West? PTI Seminars and SEMI have announced semiconductor courses at the San Francisco show in July. Some courses of interest include: Fundamentals of MEMS Design and Fabrication, Introduction to Chip and Wire Assembly in Microelectronics Packaging, and Low-cost Flip Chip, WLCSP, and Lead-free Technologies.
02/19/2008 Nanomaterials developer Ecology Coatings Inc. has been awarded its fifth patent, this one covering processes and technologies for producing environmentally friendly nanotechnology-enabled coatings.
02/19/2008 The African distributor for Industrial Nanotech Inc., Megaros Industrial Products, has signed an agreement with Copper Sunset Trading 440 Pty Ltd of Johannesburg to represent the company's patented Nansulate nanotechnology-enabled coatings in South Africa.
02/19/2008 Feb. 18, 2008 - Hitachi and Matsushita Electric Industrial (soon to be formally "Panasonic") have finalized their formal contract involving their proposed LCD panel business alliance, which also involves Canon.
02/19/2008 Feb. 18, 2008 - Powerchip Semiconductor, Renesas, and Sharp have formed a design house in Japan for small and medium-sized LCD panel driver chips.
02/18/2008 Deb. 18, 2008 - Israeli company Pythagoras Solar, claiming to have a play in the photovoltaic sector, says it has completed a $10M round of Series A funding for domestic R&D and global commercialization of its technology and products, which the firm boasts "have the potential to change the economics of solar power."
02/18/2008 Feb. 18, 2008 - Tokyo Electron has launched its entry into the solar equipment market to commercialize plasma CVD systems for thin-film silicon photovoltaics (PV), via a planned JV with Sharp.
02/18/2008 This custom version of the TLM-8 thermal limit monitor supports applications that have a need for higher accuracy temperature limits or specific limit settings not otherwise available. This version is a good fit for application in industries such as packaging, plastics injection molding and extrusion, and semiconductors requiring SEMI S2.
02/18/2008 The Wire Bonder 3200's new air bearing technology and rotary axis enable it to attain 22 wires/sec with very thin wires (for diameters down to 35 µm, or 35 thousandths of a millimeter). The wire bonder makes the electrical connections between the semiconductor and the terminals on the substrate. The control pulses generated in the chip reach the surrounding area via a gold wire that is thinner than a human hair.
02/18/2008 The "golden track" technology meets the challenges of electro-static stiction of small and thin devices in the tracks of the MT9928 platform. The tracks get a dedicated coating, which ensures a smooth handling of devices down to 2 × 2 mm size and a thickness down to 0.3 mm. The
02/18/2008 Eksigent's new proteomics system boasts gradient precision at up to 10,000 psi. Because its proprietary microfluidics technology eliminates flow splitting, the NanoLC-Ultra promises accurate and reproducible flow at more than 1 nl per minute.
02/18/2008 Ecliptek Corp.'s new IBIS (I/O-buffer-information-specification) models enable device designers to perform signal integrity simulations of MEMS clock oscillators. The model presents transient (voltage versus time) and DC (current versus time) data for the MEMS components.
