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AMEC wins injunction in patent infringement dispute with Veeco

12/11/2017  The injunction prohibits Veeco Shanghai from importing, manufacturing, selling or offering for sale to any third party any MOCVD systems and wafer carriers used in the MOCVD systems that would infringe AMECÂ’s patent CN 202492576 in China.

Leti develops world's first micro-coolers for CERN particle detectors

12/11/2017  Leti, a research institute of CEA Tech, today announced it has created the world's first microfluidic circuit for cooling a particle detector, perhaps paving the way to a revolutionary, new detector technique at the Large Hadron Collider.

CVD completes purchase of 180,000 sq. ft. facility

12/08/2017  This new facility will be the primary manufacturing center for the CompanyÂ’s wholly owned subsidiary, CVD Materials Corporation.

New power devices could drastically reduce energy waste

12/08/2017  New design could dramatically cut energy waste in electric vehicles, data centers, and the power grid.

Leti memory breakthrough point way to significant improvements in SoC memories

12/08/2017  Leti, a research institute of CEA Tech, demonstrated significant improvements in the field of memory systems at IEDM 2017 this week.

Gen 10 and larger flat panel display capacity to grow at 59% CAGR to 2022

12/08/2017  Gen 10 and larger fabs to account for 26 percent of large-area capacity by 2020 from 4 percent in 2017.

Cree launches industry's first extreme density LED

12/07/2017  The XLamp XD16 LED delivers a lumen density of more than 284 lumens per square-millimeter, which is the highest level achieved by a commercially available lighting-class LED.

IBM's Khare on A.I.

12/07/2017  Mukesh Khare, VP of IBM Research, talked about the impact artificial intelligence (AI) is going to have on the semiconductor industry during a recent panel session hosted by Applied Materials. He said that today most artificial intelligence is too complex.

3D acoustic images expand their usefulness

12/07/2017  3D acoustic imaging is useful for measuring the heights of bumps on BGAs, flip chips, and other devices. But it can also be used to image and quantify depth/height variation of features within a particular sample.

Smart management in the sub-fab improves safety, reliability, cost and yield

12/06/2017  With the prospects of large 450mm wafers going nowhere, IC manufacturers are increasing efforts to maximize fabrication plants using 300mm and 200mm diameter silicon substrates.

Automotive and IoT will drive IC growth through 2021

12/06/2017  IC InsightsÂ’ IC Market Drivers 2018 report also projects good increases in IC sales for medical electronics, wearable systems, cellphones, servers, and gov/mil applications.

The quantum waltz of electrons hints at the next generation of chips

12/06/2017  EPFL researchers have successfully measured some of the quantum properties of electrons in two-dimensional semiconductors. This work in the field of spintronics could one day lead to chips that are not only smaller but that also generate less heat.

Surface preparation technology provides pristine and stable hydrogen passivated semiconductor surfaces

12/06/2017  A new technology enables dramatically lower thermal budget capability that is enabling to thermal processes like epitaxy, CVD and diffusion, without any semiconductor material consumption.

Global semiconductor sales increase 21.9% year-to-year in October

12/05/2017  October marked the global industry's largest-ever monthly sales total.

Nambi Seshadri wins 2018 IEEE Alexander Graham Bell Medal

12/05/2017  Awarded for exceptional contributions to communications and networking sciences and engineering.

Researchers quantify factors for reducing power semiconductor resistance by two-thirds

12/05/2017  Discovery expected to lower energy consumption in electric power equipment.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors

Development of Silicon Photonics Devices Discussed in Forum

07/09/2014  Six speakers discussed developments in designing and manufacturing silicon photonics devices in a TechXPOT North session on Wednesday morning.