01/22/2008 The ultra-high packing fraction (UPF) OptoCooler module addresses the latest cooling and temperature control requirements for optoelectronics, electronics, medical, military and aerospace applications.
01/22/2008 The schematic-based MEMS design environment ARCHITECT features a 3D visualization tool called Scene3D, which allows users to create 3D views of an ARCHITECT schematic and visualize simulation results with fully contoured 3D animations.
01/22/2008 The GEMINI platform is a production manufacturing solution for high-volume wafer bonding applications for MEMS, 3D integration, and advanced packaging, as well as compound semiconductor applications.
01/22/2008 Suited to inspection of MEMS devices, the AW200 Series C-SAM acoustic micro imaging system from Sonoscan performs automated inspection, analysis and sorting of bonded wafers up to 200-mm in diameter.
01/22/2008 The model AL2000 automated photonic devices assembly system is a versatile system for diverse device assembly requirements and applications. The platform consists of 6-degree of independence axes for submicron precision alignment that addresses all possible degree of optical (and mechanical) axes, and almost equally accurate pick-and-place positioning capability.
01/22/2008 The FEMTO is the newest bonder in the FINEPLACER family, capable of handling the assembly and bonding of laser bars and diodes, flip chips, VCSELs, MEMs, sensors, micro-optics, surface mount photonics, as well as simple die attach.
01/22/2008 Jan. 21, 2008 - Panasonic Factory Solutions Co. says it has developed a new wafer dicer that is 30x faster than a typical diamond cutter to separate individual semiconductor devices on a silicon wafer, targeting a market niche in thinner (<100μm) wafers with smaller chips such as those used in portable digital products, notes the Nikkei Business Daily.
01/22/2008 Jan. 21, 2008 - National Semiconductor says it will close certain chipmaking toolsets and cut its workforce by approximately 200, mostly at two wafer fabrication facilities in the US and Scotland, in an effort to "modernize facilities and rationalize capacity."
01/21/2008 By George A. Riley, contributing editor
The year 2008 threatens further restrictions on lead solders in electronics equipment. Worldwide, the European Union 2002 Restriction of Hazardous Substances (RoHS) regulations took effect in July, 2006. In 2007, China introduced its own version of RoHS, with detailed product catalogs still being developed. Korea will impose its RoHS version in 2008.
This article, the first in a series of three on 3D packaging technology, summarizes information presented during a November 2007 webcast produced by Advanced Packaging magazine. Participants were Jean-Christophe "J.C." Eloy, founder and GM of Yole D
01/21/2008 FEI Co. has opened its latest "NanoPort" in Shanghai, China. FEI NanoPorts are centers of technical and applications excellence where customers and partners can collaborate with FEI specialists on nanoscale technology.
01/21/2008 Jan. 21, 2008 - Fujifilm says its electronics materials subsidiary has purchased an advanced argon fluoride (ArF) immersion scanner to help accelerate the push to bring its new family of ArF immersion photoresists to high-volume manufacturing.
01/21/2008 January 21, 2008 -- /LIVERPOOL, NY/ -- R. Vijayakumar, PhD, has announced the formation of AERFIL, LLC, a new consulting services company offering services in aerosol science, filtration, and contamination control.
01/21/2008 Jan. 21, 2008 - STMicroelectronics has made its 45nm CMOS process available for prototyping via French brokerage service CMP to academia, R&D labs, and companies for multiproject wafer services, and has added its 65nm CMOS SOI process for academia.
01/21/2008 January 21, 2008 -- /PRWEB/ WILSON, NC -- Precision Stability Storage, LLC has just increased its pharmaceutical stability storage capacity by 120 percent with the addition of new parameter generation and control rooms and conditioners.
01/21/2008 January 19, 2008 -- /PARSIPPANY/ -- DSM Pharmaceuticals Inc. and the FDA have recently signed an agreement to collaborate on a project involving statistical quality by design methodology during pharmaceutical manufacturing.
01/21/2008 Jan. 21, 2008 - The two leading R&D centers for EUV lithography, IMEC in Europe and the U. of Albany's College of Nanoscale Science and Engineering (CSNE), say they will jointly perform experiments for EUV in order to "demonstrate the practical feasibility of EUVL and build confidence in the technology for the 32nm half-pitch device node and below."
