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SEMI reports record quarterly billings of $14.3B

12/05/2017  Quarterly billings of US$14.3 billion set an all-time record for quarterly billings, exceeding the record level set in the second quarter of this year.

SEMI-FlexTech Committee in China kicks off to drive global exchange and collaboration

12/04/2017  On October 27, SEMI China held a kickoff meeting for a new FlexTech Committee in Suzhou. FlexTech, a SEMI Strategic Association Partner, is devoted to fostering the growth, profitability and success of the flexible and printed electronics supply chain, and enabling the many smart products enabled by this new class of electronic intelligence.

Clear leads to fully transparent devices

12/04/2017  See-through electronic devices, such as transparent displays, smart windows and concealed circuits require completely translucent components if users are to digitally interact with their perceived surroundings and manipulate this information in real time. Now, KAUST researchers have devised a strategy that helps to integrate transparent conducting metal-oxide contacts with two-dimensional (2D) semiconductors into these devices.

GLOBALFOUNDRIES and Ayar Labs establish strategic collaboration to speed up data center applications 

12/04/2017  GLOBALFOUNDRIES and Ayar Labs, a startup bringing optical input/output (I/O) to silicon chips, today announced a strategic collaboration to co-develop and commercialize differentiated silicon photonic technology solutions.

ISS Europe 2018: Strategies and innovations to compete globally

12/01/2017  Electronics manufacturing executives will attend EuropeÂ’s SEMI Industry Strategy Symposium (ISS Europe) in Dublin, Ireland on 4-6 March.

Flat panel demand to grow 7.2% in 2018, biggest gain since 2014

12/01/2017  Global demand for flat panel displays by area is forecast to grow 7.2 percent to 210 million square meters in 2018 compared to 2017, according to IHS Markit.

TI's new automotive LED lighting controller puts the power in designers' hands

12/01/2017  Texas Instruments introduced the first 3-channel high-side linear automotive light-emitting diode (LED) controller without internal MOSFETs which gives designers greater flexibility for their lighting designs.

'Magnetoelectric' material shows promise as memory for electronics

12/01/2017  Smartphones and computers wouldn't be nearly as useful without room for lots of apps, music and videos. Devices tend to store that information in two ways: through electric fields (think of a flash drive) or through magnetic fields (like a computer's spinning hard disk). Each method has advantages and disadvantages. However, in the future, our electronics could benefit from the best of each.

Discovery points the way to better and cheaper transparent conductors

11/30/2017  Researchers at the University of Liverpool have made a discovery that could improve the conductivity of a type of glass coating which is used on items such as touch screens, solar cells and energy efficient windows.

A transistor of graphene nanoribbons

11/30/2017  Empa researchers in collaboration with the Max Planck Institute for Polymer Research in Mainz and the University of California at Berkeley have now succeeded in growing ribbons exactly nine atoms wide with a regular armchair edge from precursor molecules.

Micron appoints Derek Dicker as Storage Business Unit vice president and general manager

11/30/2017  Micron Technology Inc. (Nasdaq:MU) today announced that the company has appointed Derek Dicker as vice president and general manager of the Storage Business Unit.

Atomistic calculations predict that boron incorporation increases the efficiency of LEDs

11/29/2017  Using predictive atomistic calculations and high-performance supercomputers at the NERSC computing facility, researchers Logan Williams and Emmanouil Kioupakis at the University of Michigan found that incorporating the element boron into the widely used InGaN (indium-gallium nitride) material can keep electrons from becoming too crowded in LEDs, making the material more efficient at producing light.

Transphorm secures investment from Yaskawa Electric

11/29/2017  Transphorm Inc. announced it received a $15 million investment from Yaskawa Electric Corporation.

Advantest launches automated IC handler with thermal control for use in semiconductor engineering labs

11/29/2017  Semiconductor test equipment supplier Advantest Corporation has developed the M4171 handler to meet the mobile electronics market's needs for cost-efficient thermal control testing of ICs with high power dissipation during device characterization and pre-production bring up.

SiFive joins FDXcelerator Program

11/29/2017  SiFive announced today that it has joined GLOBALFOUNDRIES' FDXcelerator Partner Program, and will be making RISC-V CPU IP including SiFive's E31 and E51 RISC-V cores available on GF's 22FDX process technology.

Kateeva introduces the YIELDjet EXPLORE product family for OLED RGB pixel deposition

11/28/2017  Suite of inkjet deposition systems to enable R&D and pilot production of large-size OLED displays

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors

Development of Silicon Photonics Devices Discussed in Forum

07/09/2014  Six speakers discussed developments in designing and manufacturing silicon photonics devices in a TechXPOT North session on Wednesday morning.