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New mass calibration facility meets highest specifications

01/13/2008  December 20, 2007 -- /PRWEB/ -- COLUMBUS, OH -- METTLER TOLEDO is pleased to announce the addition of in-house weight calibration to its current product and service offering.

AM2 PAT recall of pre-filled Heparin lock flush solution

01/13/2008  December 21, 2007 -- ANGIER, NC -- AM2 PAT, Inc., Angier, NC, is initiating a nationwide recall of one lot of Pre-Filled Heparin Lock Flush Solution USP (5 mL in 12 mL Syringes), Lot #070926H.

New England Peptide opens production instrumentation lab

01/13/2008  December 12, 2007 -- /PRWEB/ -- GARDNER, MA -- New England Peptide, LLC (NEP), has opened a new production instrumentation laboratory at its Massachusetts facility.

Haemacure starts construction on state-of-the-art biologics facility

01/13/2008  December 14, 2007 -- /PRNewswire/ -- MONTREAL, QUEBEC, CANADA -- Haemacure Corp., a Montreal-based specialty bio-therapeutics company, announces the start of construction of its manufacturing facility, the production of laboratory samples of fibrin sealant, the hiring of two senior scientists, and shares purchases by insiders.

IBM, Japan's Central Glass to make new photoresists

01/11/2008  Jan. 11, 2008 - IBM and Central Glass have agreed to jointly explore use of fluoromaterials (materials that contain fluorine atoms) in developing photoresist materials for future semiconductors.

nCoat collaborates with solar energy companies

01/11/2008  Thermal absorption and transfer coatings used in solar energy production is a new market segment for nCoat. The company is supplying its nanotechnology coatings for use in a concentrated solar thermal power system.

Technitrol to acquire MEMS maker Sonion

01/11/2008  Technitrol Inc. has agreed to acquire the capital stock of Sonion A/S, a producer of microacoustic transducers and micromechanical components for manufacturers of hearing instruments, advanced acoustic devices, medical devices and mobile communication devices in addition to MEMS microphone technology.

Renesas Expands Back-end Facility, Establishes Design Company in Malaysia

01/11/2008  ; Renesas Technology Corp. has announced plans to expand its back-end process plant in Malaysia to further strengthen the company's analog and discrete semiconductor business. In addition, Renesas has established a new analog and discrete semiconductor design company in Malaysia to increase its design resources.

Winbond Selects ESI's 70 nm Link Processing System for Advanced-DRAM Production

01/11/2008  ; Electro Scientific Industries Inc. has announced that Winbond Electronics Corp. has adopted ultraviolet (UV) laser link processing to enable its move to 70 nm advanced DRAM production. In addition to purchasing a Model 9850UV dual beam semiconductor link-processing system, Winbond is planning to upgrade several of its existing ESI Model 9830 infrared (IR) laser memory repair tools to UV Model 9835HDE laser systems.

ZESTRON America Adds New Mexico Sales Manager

01/11/2008  ; ZESTRON America has announced the addition of Cesar Gazcon as Mexico sales manager. In his role, Gazcon will be responsible for growing ZESTRON's product and service business while expanding the current customer base in Mexico.

Sigma Designs Places Order for FC-CSP Substrates With Kinsus

01/11/2008  ; With the increasing popularity of DVB (digital video broadcasting) triggering huge demand for chips, Sigma Designs, the US-based, large-sized supplier of IC (integrated circuit) design, has already placed a sizable order for FC-CSP (flip-chip chip-scale-package) substrates with Taiwan`s Kinsus Interconnect Technology Corp in 2008, according to industry sources, said Taiwan Economic News.

STMicroelectronics's MEMS sensor in new Air Mouse and Music Remote

01/11/2008  Three-axis acceleration sensors made by MEMS device manufacturer STMicroelectronics are enabling motion control in the new Air Mouse and Music Remote from Gyration.

Nanophase issued new surface treatment patent

01/10/2008  Nanophase Technologies' new patent for a novel surface treatment promises to overcome problems with the use of nanoparticles in product formulations.

Cutting back: Nanometrics laying off 7%

01/10/2008  Jan. 10, 2008 - Coming off a year in which it significantly changed its focus and carved out multiple businesses, Nanometrics is starting the new year where it left off.

Samsung Selects Camtek's Falcon for Wafer Inspection at Electrical Text Facility

01/10/2008  ; Camtek Ltd. has announced that it has sold two Falcon wafer inspection systems to Samsung Electronics Co. The two systems were installed at Samsung's test facility in Korea during the fourth quarter of 2007, following a competitive evaluation.

STATS ChipPAC Ships 25 Millionth Package-in-Package Unit

01/10/2008  ; STATS ChipPAC Ltd. has announced it has achieved a milestone of over 25 million units manufactured for its package-in-package (PiP) solutions. PiP is a three dimensional (3D) package technology in which separately assembled and tested packages and bare chips are stacked together in a single chip scale package for exceptional integration flexibility and functional density in a smaller form factor.

Altairnano completes manufacture of battery packs

01/10/2008  Altair Nanotechnologies Inc. has completed the manufacture of battery packs to be used in a 2-megawatt energy storage system purchased by AES Corp.

Carbon Nanoprobes closes equity financing

01/10/2008  Carbon Nanoprobes Inc., a company specializing in devices that serve the nanotechnology and biotechnology industries, has closed an A-round of investment capital and has hired more managers.

Matsushita spending ¥95B to expand chip ops

01/09/2008  Jan. 9, 2008 - Matsushita Electric Industrial (aka Panasonic) says it will invest about ¥95B (US ~$869M) to boost capacity for chips used in digital home electronics with a new plant in the central Japanese city of Tonami, Toyama Prefecture, according to local reports.

Report: Chartered poised to break foundry "duopoly" in Japan

01/09/2008  Jan. 9, 2008 - Chartered Semiconductor may be poised to take away business with Japanese foundry customers from top Taiwan foundries TSMC and UMC, thanks to its ties to the IBM Common Platform alliance and Toshiba, a key partner in the group's next-gen chip development, speculates a report by the Taiwan Economic News.