Featured Content




Super-sensitive medical diagnostics

01/01/2008  Medical diagnostics account for just 1% of healthcare spending, yet it is the basis for 60% of all healthcare decision-making.

The state of standards: MEMS

01/01/2008  A survey of MEMS industry players reveals points of agreement and divergence on the ever-controversial topic of production standards.

Designing Modern 3D Packages with Mixed Technology Content

01/01/2008  Packaging technology has evolved over the years, transitioning into more of a revolution with the introduction of new packaging styles practically every month. Designers face designing extremely high-performance packages with mixed technology content such as high speed digital, analog, and RF.

A new view of materials

01/01/2008  A new AFM mode enables improved nanoscale characterization.

Changes

01/01/2008  During this election season, we’ve all heard a lot of talk about “change.”

IEST marches on to nanotech beat

01/01/2008  IEST sets goals for new nanotechnology Recommended Practice Working Group activities.

Cleanroom Garments

01/01/2008  Since human-generated contamination plays a large role in critical environments, special care must be taken to provide appropriate garments to minimize the human impact on the cleanroom.

FDA advisors declare ‘FDA science and mission at risk’

01/01/2008  According to a subcommittee of the U.S. Food and Drug Administration’s Science Board, the nation’s food supply is at risk, as are the regulatory systems that oversee the nation’s drug and device supplies. In a report presented in December, the subcommittee attributed the deficiencies to increased demands on FDA and resources that have not increased in proportion to those demands.

The Thermal CPB An Approach to Thermal and Power Management

01/01/2008  In electronics, heat and power issues are gating progress; especially in high-end, flip chip devices.

Wire Bonding Process Control Targeting 100% Yield

01/01/2008  Current methods of monitoring wire bond quality for both heavy and fine wire applications fall short of enabling the goal of 100% yield.

Quality Matters

01/01/2008  I always associate quality with building a house. Because my dad was a contractor, each of his children learned about reading blueprints, controlling construction costs, choosing compatible materials, and measuring more than once before doing anything.

Where the Back-end Begins

01/01/2008  From a device manufacturing perspective, where the front-end leaves off and where the back-end begins has become a subjective point of reference; it really depends on the complexity of the device being manufactured.

Elastic Interconnections for Stretchable Electronics

01/01/2008  Although most electronic appliances are rigid, or at most mechanically flexible, future applications will require them to be flexible, stretchable, and offer maximum user comfort.

Package-on-package (PoP) with Through-mold Vias

01/01/2008  Package on Package (PoP) stacking has become the preferred method for 3D integration of baseband ICs or ASICs with high-performance memory in mobile multimedia applications.

2008: Packaging Drives the Industry

01/01/2008  This year’s forecast points toward healthy, confident growth in packaging.

Unidym founder recognized by World Economic Forum

12/28/2007  George Gruner, founder of Unidym Inc., has been selected as a visionary Technology Pioneer for 2008 by the World Economic Forum and has been invited to speak at the upcoming WEF Technology Pioneers Conference in Davos, Switzerland, this January.

NanoFocus, Digital Surf announce new surface analysis software

12/28/2007  Surface analysis software, based on a new version of Digital Surf's Mountains technology, has been integrated into NanoFocus's micronsurf 3D topometers and micronscan profilometers.

Foresight Institute posts Productive Nanosystems documents

12/27/2007  According to the Foresight Nanotech Institute, an official announcement of the first version of the Technology Roadmap for Productive Nanosystems will be made in early January 2008. But for the time being, the organization has made available two documents, each weighing in at around 200 pages.

Sensors strip off packaging with VTI chip-on-MEMS

12/27/2007  VTI Technologies has developed manufacturing concepts that it says offer better ways of combining MEMS and ASIC technologies.

MEMSIC IPO raises $60 million

12/27/2007  MEMSIC Inc., an Andover, Mass., company that develops MEMS technology for sensors and accelerometers, has raised $60 million in its recent IPO in a transaction that values the firm at $226 million.