12/04/2007 MEMSIC Inc. has filed a statement with the U.S. Securities and Exchange Commission setting its planned initial public offering at 6 million shares, with an estimated price range of $11 to $13 a share.
12/04/2007 As I waited my turn at the grocery checkout recently, I passed the time scanning magazines for juicy tabloid gossip. Much to my surprise, tucked between covers revealing the truth about Britney's drug problem and Brad and Angelina's most recent tiff, was a cover line on Diabetic Living, a Better Homes and Gardens publication, about ultra-small insulin pumps, which reportedly rely on MEMS devices to achieve miniature size and increased functionality.
12/04/2007 Gerald Yin, CEO and co-founder of equipment startup Advanced Micro-Fabrication Equipment Inc. (AMEC), discusses his company's foray into thin-film deposition and etch tools for leading-edge IC manufacturing, and the business strategy behind forming as a global semiconductor OEM based in China.
12/04/2007 The FC300 high-force (4000N), high accuracy (0.5µm) device bonder for wafer diameters up to 300mm is the first step in a joint development program between CEA Leti and S.E.T.
12/04/2007 ; Tessera has announced that executives from Hewlett Packard, Intel, Nokia and Toshiba will be guest speakers at the fourth annual Tessera Technology Symposium in Tokyo, Japan, tomorrow. The theme of this year's conference is "Driving the Mobile Revolution."
12/04/2007 ; BPM Microsystems has announced that its newest flash memory programmer, the Flashstream, has dramatically reduced the programming time for the NAND Flash Large Page Family from chipmaker STMicroelectronics.
12/04/2007 December 3, 2007 - The Fabless Semiconductor Association is dropping the "fabless" from its name and going "global," claiming that it's met original goals to proliferate the fabless business model and now must expand its agenda to address challenges through the entire chipmaking supply chain.
12/03/2007 The Select Coat SL-940E high-speed, high-accuracy coating system provides high quality and increased productivity with advanced monitoring to keep the coating process in control.
12/03/2007 The AVIA 355-7 Q-switched, frequency-tripled, solid-state laser delivers over 7W of average power at 355 nm in a package designed to maximize reliability for a minimum cost of ownership.
12/03/2007 AlSiC (aluminum silicon carbide) is a metal-matrix composite suited for base plates material for insulated gate bipolar transistors (IGBT) used in high-power traction, power control, hybrid electric vehicle power systems, and fly-by-wire applications.
12/03/2007 The IBIS-Versalea is a new bump inspection system aimed at silicon wafer bump inspection. IBIS uses conventional interferometry combined with massive parallel data processing to give a production scale inspection tool capable of inspecting and reporting on 3000 bumps/sec.
12/03/2007 The HDL (hardware description language) Designer series has been extended to provide a platform for implementing SystemVerilog. The HDL Designer Series with SystemVerilog provides a unified environment for all HDLs, while taming the complexity of object-oriented programming.
12/03/2007 The HR65D-VI series of machine micro lenses (MMLs) has been designed for high-resolution discrete part inspection in semiconductor manufacturing operations including die bonding, flip chip bonding, chip on glass and chip on film machining.
12/03/2007 December 3, 2007 - Rohm and Haas and SKC Co. Ltd. have officially opened their joint venture to make advanced optical and functional films for flat-panel displays, three months after announcing their partnership. Meoung-Han Kim will lead the business, having most recently served as managing director of SKC's display division.
12/03/2007 December 3, 2007 - Global semiconductor sales inched up 2.1% in October to $23.07B, keeping in line with projections of about 4% growth for the year, and a strong "Black Friday" suggests that despite macroeconomic concerns US consumers are still hungry for digital devices, according to data from the Semiconductor Industry Association (SIA).
12/03/2007 December 3, 2007 - Samsung Electronics and Toshiba have agreed to cross-license their respective OneNAND and LBA-NAND NAND flash memory technologies, to both spur overall growth of, and gain footholds in, the burgeoning market for "fusion" flash technologies.
12/03/2007 Altair Nanotechnologies Inc., a provider of advanced nanomaterial-based products and technology used in energy for transportation and stationary power, industrial and life science applications, has completed a $40 million private placement of its common stock to Al Yousuf LLC.
12/03/2007 December 3, 2007 - Tessera Technologies says it has licensed its OptiML Focus image-enhancement technology to Toshiba, for use in camera modules for next-generation mobile phones and PDAs.
12/03/2007 Spectroscopic ellipsometers (SE) have been used for decades to provide thickness and composition information for thin dielectric films. Most broadband SEs have been limited by optics hardware to resolving as low as 190nm wavelengths, but a lot of interesting information regarding dielectrics can be found down below 190nm. With this in mind, KLA-Tencor has modified its broadband SE tool to push the wavelength limit down to 150nm.
