01/10/2019 SEMI met with Dr. Jose Pozo, director of Technology and Innovation at EPIC (European Photonics Industry Consortium), to discuss how 3D packaging applications and heterogeneous integration trends are shaping the European technology landscape.
01/09/2019 The SEMI Industry Strategy Symposium (ISS) opened this week with the theme "Golden Age of Semiconductor: Enabling the Next Industrial Revolution." The annual three-day conference of C-level executives gives the year's first comprehensive outlook of the global electronics manufacturing industry.
01/09/2019 SEMI, the global industry association serving the electronics manufacturing supply chain, today announced that Mike Russo has joined SEMI as vice president of Global Industry Advocacy.
01/08/2019 One quarter after release, the new Dragonfly platform achieves market recognition in advanced macro inspection with multiple deliveries to worldÂ’s largest OSAT.
01/08/2019 SEMI and imec are joining forces to drive innovation and deepen industry alignment on technology roadmaps and international standards while adding technology depth to SEMI's five vertical application platforms including Smart Transportation, Smart MedTech and Smart Data.
01/07/2019 Samsung Electronics Co., Ltd. today introduced its latest innovations in modular MicroLED display technology during its annual First Look CES event at the Aria Resort & Casino in Las Vegas.
01/07/2019 UNSW researchers at the Centre of Excellence for Quantum Computation and Communication Technology (CQC2T) have shown for the first time that they can build atomic precision qubits in a 3D device - another major step towards a universal quantum computer.
01/07/2019 Unwavering in its drive to build a strong, self-sufficient semiconductor supply chain, China plans more new fab projects than any other region in the world from 2017 to 2020, and its expansion of fab capacity recently picked up pace on the strength of new foundry and memory projects from both domestic and foreign companies.
01/01/2019 Tuesday, January 29, 2019 at 1:00 pm EST
In semiconductor manufacturing, traditional root cause analysis using FDC summary data is not always effective in solving complex issues, especially when the defect signals are too subtle to detect. Full trace analytics enables the discovery of these hidden signals. This allows fab engineers to accurately pinpoint the root causes of yield-impacting issues. This webcast will discuss several use cases to showcase how advanced full trace analytics can help not only in provide accurate results, but can also simplify the root cause analysis process and reducing time-to-root-cause, resulting in better yields, lower production costs and increased engineering productivity.
In this LIVE webcast, BISTel's Chief Product Management Officer, Gabe Villareal will discuss how BISTel is leading the industry with its new full trace analytics to simply root cause analysis, which enables fab engineers to pinpoint the issues than impact yield and productivity quicker than ever. Full trace analytics enables the comprehensive examination of process trace data to allow the detection of abnormalities and deviations to the finest details.
12/21/2018 Intevac, Inc. announced today it has received multiple new program awards that together increase Photonics backlog by over $35 million, to an expected five-year record level at year-end 2018.
12/21/2018 MagnaChip Semiconductor Corporation announced today it now offers foundry customers its third generation 0.18 micron Bipolar-CMOS-DMOS (BCD) process technology.
12/21/2018 Today, Mobile Semiconductor announced their new 22nm FDX ULP (Ultra Low Power) Memory Compiler complete with a comprehensive set of features that cement their leadership position in FDX Memory Compiler offerings.
12/20/2018 At SEMICON Japan 2019, SEMI recognized two industry veterans active in the Japan chapter for their longtime contributions to the SEMI International Standards program.
