11/14/2007 AMD, Carl Zeiss SMT, and Qimonda are working together on new analytical and characterization methods required for the development of next-generation microchips. The work is being conducted within the framework of the Nanoanalysis Project, which the German Federal Ministry of Education and Research has backed with 12 million Euros.
11/14/2007 Actel Corp. has announced it is offering its low-power 5mW IGLOO field-programmable gate arrays (FPGAs) in a 4-mm package with a 0.4-mm ball pitch, reportedly the smallest package for any programmable logic device on the market.
11/13/2007 The new CATRENE (Cluster for Application and Technology Research in Europe on NanoElectronics) public-private partnership aims to ensure the continued development of European expertise in semiconductor technology and applications.
11/13/2007 Based on talks at Intel's Research Day in June, it appeared the company's proprietary pixelated mask technology would not be required at 32nm, but it would be ready for 22nm in case EUV and double-patterning are not. Fast-forward to this week's celebrated launch of 17 new Intel products, all based on 45nm node technology, and a few clues are emerging as to what's next on the company's lithography roadmap -- but it's still not clear if the pixelated mask technology will be used at 32nm.
11/13/2007 ; Advanced Semiconductor Engineering Inc. (ASE) and Infineon Technologies have developed a new packaging technology using embedded wafer-level ball grid arrays (eWLB) that reportedly offer an almost infinite number of contact elements in a 30% smaller package form vs. conventional lead-frame laminate packages.
11/13/2007 ; STATS ChipPAC Ltd., an independent semiconductor test and advanced packaging service provider, has announced its intention to voluntarily delist its American Depositary Shares (ADS) from the Nasdaq Global Select Market (Nasdaq).
11/12/2007 October 30, 2007 -- /PRNewswire/ -- NEW YORK, NY and MONTREAL, QUEBEC, CANADA -- ICBS Limited today announced the acquisition of 30 percent interest in Bacteria Bank Ltd.
11/12/2007 October 30, 2007 -- WARNER ROBINS, GA -- Clean Control Corp. has announced that significant orders were taken at the annual ISSA/ Interclean North America Show held in Orlando, FL, last week for its Germ Control 24(TM) product, a revolutionary disinfectant containing PURE Bioscience's patented silver dihydrogen citrate (SDC).
11/12/2007 October 30, 2007 -- /PRNewswire/ -- DENVER, CO -- Electric H2O, Inc. announced today it has received new orders for its patented ED 2000 energy and water saving system from the pharmaceutical and HVAC industries in the United States.
11/12/2007 November 12, 2007 - Toppan Chunghwa Electronics is readying mass production of photomasks for 45nm chip production to be ready by mid-2008, following the lead of parent company Toppan Printing, according to a Digitimes report.
11/12/2007 November 12, 2007 - Analog Devices has sold its central processing unit (CPU) voltage regulation and PC thermal monitoring product line to ON Semiconductor, plus a one-year manufacturing supply deal, for $185M in cash.
11/12/2007 October 29, 2007 -- /PRNewswire/ -- LEHIGH VALLEY, PA -- Air Products, through its subsidiary Air Products San Fu Co. Ltd. in Taiwan, has signed a long-term contract with Rexchip Semiconductor Corp., a joint venture company between Powerchip Semiconductor Corp. and Elpida Memory Inc., for the supply of nitrogen and bulk gases.
11/12/2007 October 29, 2007 -- /PRNewswire/ ATLANTA, GA -- Public facilities, from schools and hospitals to sports facilities and health clubs, can now turn to Zep Inc. for help in combating the spread of methicillin-resistant Staphylococcus aureus (MRSA) infections.
11/12/2007 November 12, 2007 - Korean memory chipmaker Hynix Semiconductor and Taiwan partner ProMOS aim to ramp up production of 66nm DRAMs in 1Q08 to annual capacity of 20,000-30,000 wafers -- a decision that has raised eyebrows in Korea, suggesting Hynix may not have been authorized to export the technology under current restrictions, according to local reports.
11/12/2007 November 12, 2007 - Infineon Technologies says it has developed a new packaging technology in collaboration with Advanced Semiconductor Engineering Inc. (ASE) that offers "an almost infinite number of contact elements" in a 30% smaller package form vs. conventional lead-frame laminate packages.
11/12/2007 Advanced technology design was a major topic at this year's Common Platform Tech Forum (Nov. 6, Santa Clara, CA). The good news/bad news is that there are no new major design concerns at 45nm, but the hurdles the industry faced at 65nm are even more challenging at 45nm, and EDA tools need to be improved to overcome them.
11/12/2007 IMEC has become one of the world's leading R&D centers for advanced semiconductor manufacturing. But there's more to the research group than the relentless pursuit of the Moore's Law CMOS scaling path: MEMS and nanotechnology play an increasingly important role. Small Times' Tom Cheyney reports.
11/12/2007 Tokyo Electron Ltd. (TEL) has joined SEMATECH's 3D Interconnect Program, the first supplier in the group launched in 2005 to evolve traditional copper/low-k interconnect technology to 3D chip stacking.
The new CATRENE (Cluster for Application and Technology Research in Europe on NanoElectronics) public-private partnership aims to ensure the continued development of European expertise in semiconductor technology and applications.