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Infotonics' MEMS Facility Selects Eyelit's Integrated MES and QM Software Suite

11/08/2007  Infotonics Technology Center (ITC) in upstate New York has selected Eyelit's Enterprise Manufacturing Execution (MES) and Quality Management Software Suite for improving overall process control in Infotonics collaborative manufacturing facility. Eyelit Inc. is a manufacturing software provider for visibility, control and coordination of manufacturing operations.

SSMC to Establish Singapore R&D Center

11/08/2007  ; Systems on Silicon Manufacturing Co. Pte. Ltd. (SSMC), a manufacturer of advanced semiconductor wafers, has announced its plan to establish a Research and Development (R&D) center tasked with expanding the company's process technology portfolio. Investing S$65 million over the next four years, the development center will broaden the scope of SSMC's wafer engineering and manufacturing services.

OKI to Miniaturize Camera Modules for Mobile Phones

11/08/2007  ; Oki Electric Industry Co. Ltd. has started a contract assembly service for W-CSP (wafer-level chip sized package) semiconductors using through-hole technology. With this technology, sensor and camera module manufacturers can now obtain camera modules that are half the size of conventional modules.

Dage Qualifies CHAD as an EFEM Supplier

11/08/2007  ; CHAD Industries Inc., a supplier of factory automation solutions for the semiconductor, electronics, and life sciences industries, has been qualified by Dage, A Nordson Company, as an EFEM (equipment front-end module) supplier. Dage will use a CHAD automated wafer handling system seamlessly integrated into its 4300 wafer bump test system.

Sale of FIBRotools MEMS/nano equipment based on flexibility and value, says ECSI

11/07/2007  ElectroChemical Systems Inc. (ECSI), manufacturer of IKo Classic electroplating and electroforming tools for MEMS, nanostructures, and HDIs, says that its recent sales of FIBRotools equipment stem from flexibility, ease of use, and value. The company's recent installations include the Indian Institute of Technology in Mumbai, India; the Naval Research Laboratory in Washington, DC; and MIT's Lincoln Laboratory in Lexington, Mass., among others.

PI's new microscope-automation Piezo-Z-Stage promises speedy 3D imaging

11/07/2007  PI (Physik Instrumente) L.P., inventor of high-speed Piezo-Z objective steppers, has introduced the new P-737 PIFOC Piezo-Z Stage, which it says is the highest performance nanopositioning Z control system on the market.

October 2007 Exclusive Feature #2:
Functional scaling: A new paradigm in semiconductor technology


11/06/2007  By Raj Jammy, Director of Front End Processes, SEMATECH, and SST Editorial Advisory Board member

The success of semiconductor technology has been due to our choice of semiconductor material

October 2007 Exclusive Feature #1:
A mature technology? Hardly.


11/06/2007  By Bill Tobey, Consultant and SST Editorial Review Board member

Over the past 50 years in the semiconductor industry, applications have been continuously added and extended, ultimately driving necessary changes in our technology base

Report: TSMC, Hon Hai partnering in LEDs

11/06/2007  November 6, 2007 - TSMC and Hon Hai Group are reportedly teaming up in the LED industry, via a business deal involving two partners.

GSI Group announces $7M order, $10M Letter of Intent for wafer repair processing systems

11/06/2007  October 23, 2007 -- /PRNewswire/ BILLERICA, MA -- GSI Group Inc. today announced that an existing Taiwanese customer has issued a $7 million order and an additional $10 million letter of intent for multiple M550 IR advanced laser wafer repair processing systems.

Health-care associated infection (HAI) to be discussed at IEST Fall Conference

11/06/2007  October 23, 2007 -- /IEST News/ -- ARLINGTON HEIGHTS, IL -- News coverage of Staphylococcus aureus (staph) infections in hospitals and school locker rooms, including the death of a teenager in North Carolina, has put the spotlight on nosocomial infection, commonly referred to as health-care associated infection (HAI).

Aquest Systems receives patent on automated material handling system

11/06/2007  October 23, 2007 -- /PRNewswire/ -- SUNNYVALE, CA -- Aquest Systems today announced that the United States Patent and Trademark Office (USPTO) has issued a broad patent to protect Aquest's FabEX(TM) automated material handling system (AMHS).

ASHP offers CriticalPoint(TM) web-based sterile compounding training

11/06/2007  October 23, 2007 -- BETHESDA, MD -- ASHP has added an innovative educational tool to complement its current product line of sterile compounding training.

Environmental contractor decontaminates 'superbug,' other bio hazards

11/06/2007  October 22, 2007 -- MARCOR Remediation Inc., a national contractor with offices throughout the U.S., is on standby to work with school districts that are either affected by an outbreak or wish to clean as a preventive measure.

Trio creates Dresden center under "Nanoanalysis" R&D project

11/06/2007  November 6, 2007 - AMD, Carl Zeiss SMT, and Qimonda AG are forming a 12M euro (US ~$17.4M) "innovation center" in Dresden, Germany ("Silicon Saxony"), under a larger "Nanoanalysis" project to develop new analytical and characterization methods for next-gen chip development.

ZRAM, SoC firms extend VC funding

11/06/2007  November 6, 2007 - A pair of industry firms have each secured at least $20M in continued VC funding, to support their respective development of memory and system-on-chip design technology.

Varian's wind project gets local nod

11/06/2007  November 6, 2007 - After nearly three years of work and lobbying, Varian Semiconductor Equipment Associates Inc. says it has received approval from the Gloucester (MA) City Council to build two wind turbines, in a bid to dent one of its larger operating costs: the electric bill.

What's really behind the top foundries' 2008 capex cutbacks?

11/06/2007  After forecasting good to "lackluster" 4Q sales forecasts, the top pure-play foundries (TSMC, UMC, SMIC, and Chartered) say they will reduce spending in 2008, (10%-25% declines or more). Their stated reasons -- improve productivity in current production, migrate more mature processes down to 90nm and 65nm, and get ASPs back up and improve profitability -- send a great message to the investor community. But the real reason could be a much bigger shift in the leading-edge foundry business model.

STMicroelectronics Lays First Stone for China Back-End Plant

11/06/2007  STMicroelectronics has laid the first stone at the site of its future chip packaging and test facility in Longgang, Guangdong Province, China, in the presence of senior officials of the Shenzhen Municipal government.

Launch of Joint Nanoanalysis Project at Dresden

11/06/2007  ; The companies AMD, Carl Zeiss SMT, and Qimonda are cooperating to launch a 12M euro project within the framework of the joint Nanoanalysis project, funded by the German Federal Ministry of Education and Research. The partners are working together on new analytical and characterization methods required for the development of the next chip generation.