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UMC execs acquitted in He Jian case

10/29/2007  October 29, 2007 - After two years of legal battles, a district court in Hsinchu, Taiwan, has ruled that three former execs of foundry UMC broke no laws in their roles helping to set up Chinese chip company He Jian Technology (Suzhou) Co.

Freescale Challenges Designers Worldwide to 'Go Green'

10/29/2007  ; In response to increasing demand for energy efficient and green products, Freescale Semiconductor is kicking off a challenge that encourages designing for the environment. The Americas Challenge, announced today, is open to engineers and students in the US, Canada, and Mexico who can create innovative, green electronic designs using a select group of solutions from the company's product portfolio.

AMAT opens solar R&D site in Germany

10/29/2007  October 29, 2007 - Applied Materials Inc. has opened its SunFab Technology Center in Alzenau, Germany, to serve as the company's principal solar R&D center, focusing on boosting module conversion efficiency and lowering production costs.

NanoBusiness Alliance: Patent reform act overreaches

10/29/2007  The NanoBusiness Alliance has announced that more than 75 nanotechnology companies have voiced "significant and continuing concern" about the Patent Reform Act of 2007.

Analog Devices calls latest MEMS tilt sensor the industry's most accurate

10/29/2007  The ADIS16209 programmable, dual-mode inclinometer is suited to a variety of industrial applications including surveying equipment, factory machine tools, and satellite antenna stabilization systems, says Analog Devices. The company adds that typically, functionally equivalent sensors are 100 times larger.

New partnership promotes tray sealers and quality control systems

10/28/2007  October 19, 2007 -- KANSAS CITY, MO -- Heat and Control, Inc., Ishida Scales Mfg., Co. and Multivac, Inc. have entered into a strategic partnership to effectively market Ishida tray sealers in the United States, Canada, and Mexico.

MRSA infection eradicated for 14 months With SDC disinfectant in Tulsa County Jail

10/28/2007  October 18, 2007 -- SAN DIEGO, CA -- Recent news items report that the number of severe infections caused by MRSA is higher than previously believed and the bacteria now kills more Americans than AIDS.

Air Products Shanfeng becomes wholly owned subsidiary of Air Products in China

10/28/2007  October 18, 2007 -- /PRNewswire/ -- LEHIGH VALLEY, PA -- Air Products today announced that it has acquired all outstanding shares in Air Products Shanfeng, making the venture a wholly owned Air Products subsidiary in China.

Applied Robotics announces new distributor

10/28/2007  October 18, 2007 -- GLENVILLE, NY -- Applied Robotics Inc., a leading provider of automation end-of-arm tooling and connectivity solutions has recently added a new distributor to its line-up of partners.

IEST publishes contamination control Recommended Practice on gas-Phase adsorber cells

10/28/2007  October 18, 2007 -- /IEST News/ -- ARLINGTON HEIGHTS, IL -- A newly revised Recommended Practice (RP) from the IEST covers the design and testing of modular gas-phase adsorber cells in single pass or recirculating air-cleaning systems where the need for high-efficiency removal of gaseous contaminants is a requirement.

Merger establishes new tier packaging engineering firm

10/28/2007  October 16, 2007 -- EDISON, NJ -- TCP Reliable, a thermal packaging solutions manufacturer and DDL, the leading package testing services firm have announced a merger, making the combined company the leading packaging engineering group specializing in the medical device and biopharmaceutical industries.

Toshiba validates imprint litho for 22-nm node CMOS device fabrication

10/28/2007  October 16, 2007 -- /PRNewswire/ -- AUSTIN, TX -- Molecular Imprints, Inc. (MII) today announced that Toshiba Semiconductor Company has validated the use of MII's imprint lithography technology in developing 22-nm node CMOS devices.

IMEC to acquire EUV pre-production tool from ASML

10/28/2007  October 16, 2007 -- LEUVEN, BELGIUM -- IMEC has reached an agreement with ASML to install an ASML EUV pre-production tool in IMEC's 300 mm facility in 2010.

Water-cooled chiller proposal represents energy savings for 90.1

10/28/2007  October 16, 2007 -- /ASHRAE News/ -- ATLANTA, GA -- An estimated annual energy savings of 13 percent relative to ASHRAE/IESNA Standard 90.1-2004 should result from a proposed addendum regarding air- and water-cooled chillers.

MKS names John T.C. Lee to lead business unit

10/28/2007  October 17, 2007 -- WILMINGTON, MA -- MKS Instruments, Inc. has announced that John T.C. Lee, PhD, has joined the company as group vice president, responsible for control and information technology and electrostatic discharge products.

QuantumClean announces webinar on satisfaction gap in outsourced parts cleaning (OPC) market

10/28/2007  October 17, 2007 -- /PRWEB/ -- DUBLIN, PA -- QuantumClean(R) today announced that the firm will host a webinar discussing the satisfaction gap in the outsourced parts cleaning (OPC) marketplace.

Purdue to break ground on Hockmeyer Hall of Structural Biology

10/28/2007  October 18, 2007 -- WEST LAFAYETTE, IN -- Purdue University will break ground on the new Wayne T. and Mary T. Hockmeyer Hall of Structural Biology at 2:30 p.m. Friday (Oct. 19).

MEPTEC Finalizes Program for Substrates Symposium

10/26/2007  ; MEPTEC, the MicroElectronics Packaging and Test Engineering Council, has finalized the program for its upcoming technical symposium titled, "Substrates: The Foundation of Semiconductor Packaging," at the Holiday Inn San Jose in San Jose, CA on Thursday, Nov 8th.

SST November 2007: Intel's evolution: Strained silicon to high-k and metal gate

10/26/2007  EXECUTIVE OVERVIEW As we head toward Intel's announced 45nm launch this month, Dick James looks at the changes from the company's 90nm node transistor, through the 65nm node, and take a few guesses about what we might see in the upcoming 45nm part.

Emerging High-Tech Industry at German Electronics Show

10/26/2007  ; Leaders in the emerging printed electronics sector will be showcasing technological advances at the 3rd Global Plastic Electronics Conference from October 29-30th in Frankfurt, Germany. Printed electronics technology enables new products or significant improvements, in applications such as handheld devices, flexible displays, or printed sensors and batteries.