10/29/2007 October 29, 2007 - After two years of legal battles, a district court in Hsinchu, Taiwan, has ruled that three former execs of foundry UMC broke no laws in their roles helping to set up Chinese chip company He Jian Technology (Suzhou) Co.
10/29/2007 ; In response to increasing demand for energy efficient and green products, Freescale Semiconductor is kicking off a challenge that encourages designing for the environment. The Americas Challenge, announced today, is open to engineers and students in the US, Canada, and Mexico who can create innovative, green electronic designs using a select group of solutions from the company's product portfolio.
10/29/2007 October 29, 2007 - Applied Materials Inc. has opened its SunFab Technology Center in Alzenau, Germany, to serve as the company's principal solar R&D center, focusing on boosting module conversion efficiency and lowering production costs.
10/29/2007 The NanoBusiness Alliance has announced that more than 75 nanotechnology companies have voiced "significant and continuing concern" about the Patent Reform Act of 2007.
10/29/2007 The ADIS16209 programmable, dual-mode inclinometer is suited to a variety of industrial applications including surveying equipment, factory machine tools, and satellite antenna stabilization systems, says Analog Devices. The company adds that typically, functionally equivalent sensors are 100 times larger.
10/28/2007 October 19, 2007 -- KANSAS CITY, MO -- Heat and Control, Inc., Ishida Scales Mfg., Co. and Multivac, Inc. have entered into a strategic partnership to effectively market Ishida tray sealers in the United States, Canada, and Mexico.
10/28/2007 October 18, 2007 -- SAN DIEGO, CA -- Recent news items report that the number of severe infections caused by MRSA is higher than previously believed and the bacteria now kills more Americans than AIDS.
10/28/2007 October 18, 2007 -- /PRNewswire/ -- LEHIGH VALLEY, PA -- Air Products today announced that it has acquired all outstanding shares in Air Products Shanfeng, making the venture a wholly owned Air Products subsidiary in China.
10/28/2007 October 18, 2007 -- GLENVILLE, NY -- Applied Robotics Inc., a leading provider of automation end-of-arm tooling and connectivity solutions has recently added a new distributor to its line-up of partners.
10/28/2007 October 18, 2007 -- /IEST News/ -- ARLINGTON HEIGHTS, IL -- A newly revised Recommended Practice (RP) from the IEST covers the design and testing of modular gas-phase adsorber cells in single pass or recirculating air-cleaning systems where the need for high-efficiency removal of gaseous contaminants is a requirement.
10/28/2007 October 16, 2007 -- EDISON, NJ -- TCP Reliable, a thermal packaging solutions manufacturer and DDL, the leading package testing services firm have announced a merger, making the combined company the leading packaging engineering group specializing in the medical device and biopharmaceutical industries.
10/28/2007 October 16, 2007 -- /PRNewswire/ -- AUSTIN, TX -- Molecular Imprints, Inc. (MII) today announced that Toshiba Semiconductor Company has validated the use of MII's imprint lithography technology in developing 22-nm node CMOS devices.
10/28/2007 October 16, 2007 -- LEUVEN, BELGIUM -- IMEC has reached an agreement with ASML to install an ASML EUV pre-production tool in IMEC's 300 mm facility in 2010.
10/28/2007 October 16, 2007 -- /ASHRAE News/ -- ATLANTA, GA -- An estimated annual energy savings of 13 percent relative to ASHRAE/IESNA Standard 90.1-2004 should result from a proposed addendum regarding air- and water-cooled chillers.
10/28/2007 October 17, 2007 -- WILMINGTON, MA -- MKS Instruments, Inc. has announced that John T.C. Lee, PhD, has joined the company as group vice president, responsible for control and information technology and electrostatic discharge products.
10/28/2007 October 17, 2007 -- /PRWEB/ -- DUBLIN, PA -- QuantumClean(R) today announced that the firm will host a webinar discussing the satisfaction gap in the outsourced parts cleaning (OPC) marketplace.
10/28/2007 October 18, 2007 -- WEST LAFAYETTE, IN -- Purdue University will break ground on the new Wayne T. and Mary T. Hockmeyer Hall of Structural Biology at 2:30 p.m. Friday (Oct. 19).
10/26/2007 ; MEPTEC, the MicroElectronics Packaging and Test Engineering Council, has finalized the program for its upcoming technical symposium titled, "Substrates: The Foundation of Semiconductor Packaging," at the Holiday Inn San Jose in San Jose, CA on Thursday, Nov 8th.
10/26/2007 EXECUTIVE OVERVIEWAs we head toward Intel's announced 45nm launch this month, Dick James looks at the changes from the company's 90nm node transistor, through the 65nm node, and take a few guesses about what we might see in the upcoming 45nm part.
10/26/2007 ; Leaders in the emerging printed electronics sector will be showcasing technological advances at the 3rd Global Plastic Electronics Conference from October 29-30th in Frankfurt, Germany. Printed electronics technology enables new products or significant improvements, in applications such as handheld devices, flexible displays, or printed sensors and batteries.