Featured Content




EUV leads the next generation litho race

11/08/2017  As previously reported by Solid State Technology, the eBeam Initiative recently reported the results of its lithography perceptions and mask-makers' surveys. After the survey results were presented at the 2017 Photomask Technology Symposium, Aki Fujimura, CEO of D2S, the managing company sponsor of the eBeam Initiative, spoke with Solid State Technology about the survey results and current challenges in advanced lithography.

DARPA's new initiative

11/08/2017  Earlier this year, DARPA's Microsystems Technology Office (MTO) announced a new Electronics Resurgence Initiative (ERI) "to open pathways for far-reaching improvements in electronics performance well beyond the limits of traditional scaling."

Enabling the A.I. era

11/08/2017  ThereÂ’s a strongly held belief now that the way in which semiconductors will be designed and manufactured in the future will be largely determined by a variety of rapidly growing applications, including artificial intelligence/deep learning, virtual and augmented reality, 5G, automotive, the IoT and many other uses, such as bioelectronics and drones. The key question for most semiconductor manufacturers is how can they benefit from these trends?

Semiconductor super cycle: Market trends, drivers and forecasts

11/08/2017  2017 will be a record-breaking year. Semiconductor sales will exceed $400 billion for the first time and semiconductor equipment sales will finally shatter the historic high set in 2000. What is driving this growth?

Third quarter 2017 silicon wafer shipments hit another quarterly record

11/08/2017  Worldwide silicon wafer area shipments increased during the third quarter 2017 when compared to second quarter 2017 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Kyma demonstrates high quality 200mm diameter GaN on QST templates

11/07/2017  Kyma Technologies, Inc. announced it has used its new K200 hydride vapor phase epitaxy (HVPE) growth tool to produce high quality 200mm diameter HVPE GaN on QST (QROMIS Substrate Technology) templates.

2017 sees advances in connected devices, memory

11/07/2017  The technologies to watch identified by TechInsights analysts at the beginning of the year have not been disappointing.

Pixelligent Technologies appoints Alain Harrus and Gene Banucci to its Board of Directors

11/07/2017  Pixelligent Technologies announced today it has named Alain Harrus, Ph.D. and Gene Banucci, Ph.D. to the Pixelligent Board of Directors.

SEMI announces venue and program for Industry Strategy Symposium 2018

11/07/2017  SEMI announced today that the Industry Strategy Symposium (ISS) 2018, will take place January 15-18 at Half Moon Bay's Ritz-Carlton Hotel, with the theme "Smart, Intuitive & Connected: Semiconductor Devices Transforming the World."

Radiant Vision Systems announces new automated visual inspection system

11/06/2017  Radiant Vision Systems, a provider of high-resolution imaging solutions for automated visual analysis of devices and surfaces, announces the release of the INSPECT.assembly system, a new turnkey automated visual inspection station for in-line assembly verification.

MagnaChip offers 0.35 micron 700V ultra-high voltage process technology with process simplification

11/06/2017  MagnaChip Semiconductor Corporation announced today it now offers a 0.35 micron 700V Ultra-High Voltage process technology (UHV) that reduces mask counts, manufacturing time and cost for power-related AC-DC products.

Global shipments of oxide TFT LCD mobile PC panels to grow 200% this year

11/06/2017  Global shipments of large oxide TFT LCD panels of 9 inches or larger are expected to grow from 20 million units in 2016 to 55.6 million units in 2017.

Lightning-fast communications

11/06/2017  University of Utah researchers develop milestone for ultra-fast communications and computing.

MEMS & sensors safeguard autonomous cars, boost agricultural productivity and anticipate needs

11/03/2017  MEMS & Sensors Executive Congress speakers feature smart sensing components in new industrial, automotive, biomedical, agricultural applications.

Costs of 55-inch OLED TV display production catch up to LCD TV panels

11/03/2017  Unit cost for 55-inch UHD OLED TV panels recorded a 55 percent decline in second quarter of 2017 since its introduction in early 2015.

NXP and Chongqing establish center for automotive electronics applications development in China

11/03/2017  NXP has partnered with the Chongqing Economic and Information Technology Commission and the Chongqing Laingian New Area Administrative Committee to drive more automotive industry growth with the new applications development center.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors

Development of Silicon Photonics Devices Discussed in Forum

07/09/2014  Six speakers discussed developments in designing and manufacturing silicon photonics devices in a TechXPOT North session on Wednesday morning.