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Spansion/Saifun, SMIC extend NOR flash pact

10/24/2007  October 24, 2007 - Spansion Inc. and Chinese foundry SMIC are partnering to delve further into NOR flash, in a deal that utilizes SMIC's 65nm foundry work for Spansion's MirrorBit technologies, and extend into "selected segments" of flash memory to sell 90nm and 65nm and beyond MirrorBit Quad products in China.

Microchip Tech sells idle 200mm fab

10/24/2007  October 24, 2007 - Microchip Technology Inc. says it has sold its idle Fab 3 facility in Puyallup, WA, for $30M following an unsolicited offer received in September, saying it can increase capacity and sales through "nominal" investments in its other fabs and foundry partners.

AMI Semiconductor Implements Sarnoff Europe's ESD Protection Services

10/24/2007  Sarnoff Europe and AMI Semiconductor Inc. have announced the successful implementation of Sarnoff Europe's TakeCharge on-chip ESD protection solution in AMI Semiconductor's DSP-based systems for hearing and audio solutions.

European Semiconductor Company Adopts OptimalTest's Test Management Software

10/24/2007  ; OptimalTest, a provider of integrated enterprise-wide test management solutions, has sold its test management solution software to a major European semiconductor integrated device manufacturer (IDM) in a multimillion US dollar annual licensing deal. The name of the European IDM was not disclosed.

Motorola Invests in Siimpel

10/24/2007  ; Motorola Inc., through Motorola Ventures, its strategic venture capital arm, has made an equity investment in Siimpel Corp, a developer and manufacturer of silicon microelectromechanical system (MEMS)-based solutions for mobile imaging applications. Financial terms of the investment were not disclosed.

Rising Material Costs Force Chemical Company to Increase Prices

10/24/2007  ; Rohm and Haas Co. is seeking price increases for most of its chemical products, effective November 1, 2007 due to rising costs of key raw materials. Increases will range from 5 to 15 percent.

Microvision finds Asian partner for mobile phone projectors

10/24/2007  Microvision Inc. (Nasdaq: MVIS), a developer of MEMS-enabled light scanning technologies for display and imaging products, has entered into a development agreement with one of the world's largest consumer electronics manufacturers of mobile phones, digital cameras and personal media players.

Affymetrix launches 'university' for microarray data analysis training

10/24/2007  Affymetrix University courses will provide biologists with a better understanding of how to design their microarray experiments successfully with appropriate quality control, and how to apply statistical methods to interpret biological results more effectively.

A123Systems receives $30M to scale up nano-enabled batteries

10/24/2007  Lithium ion battery pioneer A123Systems has made news with its contract to supply nano-enabled batteries for General Motors' Volt electric vehicle. The company will use its new funds for hybrid electric, plug-in hybrid electric, and extended range electric vehicle designs with major automakers.

Samsung touts 30nm NAND flash using double-patterning

10/23/2007  October 23, 2007 - Samsung Electronics Co. Ltd. says it has developed 64Gb multilevel cell NAND flash memory chip using 30nm process technology, built using double-patterning lithography, with commercial chips ready in about a year.

Keys to pushing 450mm: productivity and "agility"

10/23/2007  Speaking at last week's ISSM, Lam Research's Nick Bright asked a point-blank question: why should equipment suppliers invest in 450mm when there are so many opportunities elsewhere (e.g. solar, FPDs, LEDs, and MEMS)? The answer may depend on whether enough equipment companies can find answers to IC manufacturers' calls to improve fab agility at a reasonable rate of return on investment.

Aquest offers a new way to address fab capacity

10/23/2007  As a number of presenters made clear at last week's ISSM conference (Oct. 15-17, Santa Clara, CA), there is a movement in the industry that favors the ability to utilize small-lot (<25 wafers) manufacturing as a way to provide fab agility and drive down cycle times. Aquest Systems believes its vehicle-free transport technology, FabEX Transporter, can change the way existing or new fabs implement automation, enabling not only small lots but also a possible wafer size transition.

Tronics says its sustained profitability validates pure-play custom MEMS model

10/23/2007  Tronics Microsystems says its fiscal quarter that ended September 30 marks its fifth consecutive quarter of net profit, and makes it the first pure-play contract manufacturer of advanced MEMS devices to achieve consistent profitability.

MEMSCAP reports profitability in Q3 2007

10/23/2007  MEMS technology provider MEMSCAP has announced its earnings for the third quarter ending September 30.

STATS ChipPAC Opens Second China Manufacturing Facility

10/23/2007  ; STATS ChipPAC Ltd., an independent semiconductor test and advanced packaging service provider, today announced the grand opening of a second 371,000 sq. ft. manufacturing facility in Shanghai, China.

Cadence and NXP Sign Multi-Year Strategic Agreement

10/23/2007  ; Cadence Design Systems Inc. and NXP Semiconductors have signed a multi-year strategic agreement that positions Cadence as NXP's primary electronic-design-automation (EDA) solutions partner.

Charlesson gets $2.35M to develop ocular nanoparticle drug delivery

10/23/2007  In contrast to typical gene therapy where viral vectors are used to deliver the gene of interest, Charlesson's program employs biodegradable nanoparticles. This approach eliminates many of the safety concerns in eliciting an immune response following gene therapy.

Silicon quantum dots promise solar cell efficiency boost

10/22/2007  Efficiency is one of the biggest challenges for solar cells: most of the sun's incoming light is dissipated as heat, not converted to electricity. Yet researchers think the strange behavior of tiny particles known as quantum dots may help break the efficiency barrier, using energy that might otherwise be lost to excite additional free carriers.

Report: Suntech, Sino-American deal highlights cross-strait PV chain

10/22/2007  October 22, 2007 - A reported deal between mainland Chinese solar module maker Suntech Power Holdings Co. and Taiwan firm Sino-American Silicon Products Inc. exemplifies a model of cooperation between front- and back-end providers in the photovoltaic industry between the two regions, notes a story in the Taiwan Economic News.

Fuji Electric expanding solar module site

10/22/2007  October 22, 2007 - Fuji Electric Holdings Co. plans add up to six new production lines over the next five years, at a cost of 37 billion yen (US $323.4M), to expand output of solar modules.