10/08/2007 Altair Nanotechnologies and its technologies have received no small endorsement from the U.S. Senate, which has approved $5 million funding for a 2.5 megawatt stationary power supply for the U.S. Navy, and $2 million for development of nanosensors to detect explosives and chemical warfare agents.
10/08/2007 ; EV Group (EVG) announced the selection and installation of its EVG850TB fully automated temporary wafer bonding system by an Austrian semiconductor manufacturer. They system, designed for high-volume processing of thin- and ultra-thin device wafers, reportedly allows secure and reliable handling of high-value wafers while contributing to higher yield.
10/05/2007 Cepheid Inc. says it has received two Veterans Affairs Federal Supply Service Schedule contracts for the company's GeneXpert System and the Xpert MRSA test for the rapid detection of Methicillin-resistant Staphylococcus aureus, a type of bacteria that is resistant to the most-common antibiotics used in hospitals.
10/05/2007 The Netherlands and the U.S. provide complementary strengths that can nurture nanotechnology startups and bring new technologies into reality, reports Small Times' Richard Gaughan.
10/05/2007 October 5, 2007 - SunPower and Korean energy company EnE System plan to build a 2MW solar electric power plant in Jeonju, Korea's Jeolla province, on landfill property owned by Jeonju Solar Energy. Construction is expected to be completed in January, with the Korea Energy Management Corp. providing part of the project's funding.
10/05/2007 October 5, 2007 - NEC says it has developed technology that allocates performance from multicore processors and let embedded devices coordinate via the Internet, saying it will offer more scalability and security for embedded systems.
10/05/2007 ; According to a customer satisfaction survey on chip making equipment conducted by VLSI Research, Inc., Taiwan chip makers have rated Kulicke & Soffa as the best supplier of assembly equipment.
10/05/2007 ; The International Electronics Manufacturing Initiative (iNEMI) is gearing up for the 2009 Roadmap with a series of meetings being held at industry conferences this fall.
10/05/2007 October 5, 2007 - AmberWave Systems and the U. of California/Santa Barbara (UCSB) have agreed to collaborate on and fund materials science research targeting mesoporous materials, in a move to open non-semiconductor business doors for the company.
10/04/2007 October 4, 2007 - Applied Materials is on track to recognize its first revenues for thin-film solar modules by the April quarter, earlier than many analysts have been expecting, and a first customer thumbs-up could set off a "domino effect" that generates a wave of solar business and a push toward end-market grid parity, according to one analyst's report.
10/04/2007 October 4, 2007 - Researchers from Johns Hopkins U. have created a CMOS-based thumb-size microincubator to culture living cells for lab tests, offering a mobile yet still protected and relatively low-cost advancement over traditional biology lab equipment.
10/04/2007 ; Alcatel Micro Machining Systems, a supplier of deep silicon etching equipment (DRIE) for MEMS and 3D semiconductors, has received an order for its AMS 4200 DRIE multi-chamber production tool from Boehringer Ingelheim microParts GmbH to increase volume production of MEMS micro-nozzles for Respimat inhaler.
10/04/2007 October 4, 2007 - Winbond Electronics Corp. says it has formed a task force to evaluate formation of a new subsidiary to take over the company's logic IC business next year, a move that would vault the company into the dedicated memory chipmaking ranks of Taiwan's PowerChip, Nanya, ProMos, and Inotera, and mark the end of the island's last IDM to do both memory and logic work.
10/04/2007 Experts at the recent daylong International Wafer-Level Packaging Conference in San Jose expressed confidence that technology integration can create a manufacturable fab flow using through-silicon vias. But while 3D-WLP is already commercially viable, wire-bonding already can handle up to 16 chips, and two-level connections can be easily flip-chipped. So let's acknowledge the elephant in the room: besides MEMS and optoelectronics, does anyone really need TSVs for commercial ICs?
10/04/2007 ; Integrated Sensing Systems, Inc. (ISSYS) was awarded a Phase II Small Business Innovation Research contract from the National Science Foundation (NSF). The 2-year project, "Wafer-Scale, Hermetic, Packaging of MEMS-Based Systems," is aimed towards development of a novel packaging method to simplify the packaging of MEMS and their associated electronics.
10/04/2007 With an exhibit hall sold out months in advance and markets growing at double-digit rates, the recent Solar Power 2007 event attracted 12,000 attendees -- and 210 exhibitors representing most of the solar-PV value chain, including nano-enabled end products. Small Times' Tom Cheyney reports.
10/04/2007 Integrated Sensing Systems Inc. (ISSYS) has received a Phase II Small Business Innovation Research contract from the National Science Foundation. The two-year project, Wafer-Scale, Hermetic Packaging of MEMS-Based Systems," is aimed toward development of a novel packaging method that will greatly simplify the packaging of MEMS and their associated electronics
10/04/2007 Veratag LLC, an Albany, N.Y., company commercializing a security protocol for use in MEMS-based RFID devices, has announced it will license its IP to Cornell Research Foundation Inc.
10/03/2007 October 3, 2007 - Capital spending should rise about 5% next year, an "optimistic" projection driven heavily by a surge from flash manufacturers, who will surpass their DRAM counterparts in terms of capacity, according to data from Strategic Marketing Associates.
Altair Nanotechnologies and its technologies have received no small endorsement from the U.S. Senate, which has approved $5 million funding for a 2.5 megawatt stationary power supply for the U.S. Navy, and $2 million for development of nanosensors to detect explosives and chemical warfare agents.