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ThalesNano opens own representation in UK, signs new distro agreements for Europe and India

09/27/2007  September 24, 2007 -- /PR Newswire/ -- BUDAPEST, HUNGARY -- ThalesNano Inc. announced today that it had continued to expand globally by opening a subsidiary in the United Kingdom and by signing distributor agreements in Scandinavia, Italy, and India.

Dole Fresh Vegetables voluntarily recalls packaged salads

09/27/2007  September 18, 2007 -- /FDA News/ -- MONTEREY, CA -- Dole Fresh Vegetables has announced that it is voluntarily recalling all salad bearing the label "Dole Hearts Delight" sold in the U.S. and Canada with a "best if used by (BIUB)" date of Sept. 19, 2007, and a production code of "A24924A" or "A24924B" stamped on the package.

Attendees contribute to crucial industry guidelines

09/27/2007  September 19, 2007 -- /IEST News/ -- ARLINGTON HEIGHTS, IL -- The Institute of Environmental Sciences and Technology (IEST) Working Groups develop the standards and Recommended Practices that capture the best practices across industries and distill the experiences of leaders in these fields.

Quong Hop & Co. recalls tofu because of possible health risk

09/27/2007  September 19, 2007 -- /FDA News/ -- SAN FRANCISCO, CA -- Quong Hop & Co. of South San Francisco, CA, is recalling all SOY DELI brand tofu with code date DEC 17 2007 and certain varieties of SOY DELI and QUONG HOP brand tofu with code date SEP 23 2007.

FDA warns about risk of Cryptosporidium illness from Baby's Bliss Gripe Water

09/27/2007  September 20, 2007 -- /FDA News/ -- FDA is warning consumers not to consume Baby's Bliss Gripe Water, apple flavor, with a code of 26952V and expiration date of October 2008 (shown as "10/08" on the label), distributed by MOM Enterprises, Inc., of San Rafael, CA.

iSuppli's 2007 Semiconductor Forecast Remains Optimistic

09/27/2007  iSuppli Corp. has reduced its original revenue growth forecast for the global semiconductor industry from 6 to 3.5%, even as chip revenue is up, equipment markets are on the rise, and memory sales are improving. The research firm reportedly revised its original predictions because these stronger conditions are still insufficient to offset the impact of the first half of the year's results.

Why flash and DRAM rule the future of IC memory

09/27/2007  At a one-day technical symposium on Sept. 20 sponsored by the IEEE and Applied Materials, a standing-room-only crowd of technologists learned about the leading-edge of manufacturing the densest, fastest, cheapest IC memories. The take-away theme: the two trains of DRAM and flash memory technologies have long "left the station" and unless and until they stop, other promising technologies such as phase-change (PRAM) and magneto-resistance (MRAM) will be relegated to niche applications.

SUSS and partners plan 3-D MEMS packaging seminars

09/27/2007  SUSS MicroTec, NEXX Systems, and Surface Technology Systems (STS) will collaborate with Fraunhofer IZM in a series of seminars to demonstrate integrated processes for 3-D wafer level packaging.

Asymtek Opens Facilty in India

09/27/2007  Asymtek has opened a technical support and sales office in Chennai, India to support the area's expanding markets and offer local support to the company's existing customers. The new office is co-located with parent company Nordson Corporation, and provides on-site equipment service, training, and applications assistance.

DOE, FEI partnership produces world's most powerful microscope

09/27/2007  A new microscope has recorded the highest-resolution images ever seen -- 0.05 nanometer and below. The development will allow researchers to "study how atoms combine to form materials, how materials grow, and how they respond to a variety of external factors." Reporter Roland Piquepaille explains.

Nanobiosym awarded $2 million for gene detector

09/27/2007  Nanobiosym Inc. has been awarded a $2 million contract from the United States Defense Threat Reduction Agency (DTRA), a branch of the U.S. Department of Defense, to further develop a portable gene detector.

Green Technology Forum releases Nanotechnology for Green Building report

09/27/2007  The convergence of nanotechnology and "green" building is creating fresh economic opportunities, but "the nanotech and building sectors have to get to know each other a lot better in order to realize the dramatic benefits awaiting each of them," said the author of a new report analyzing the relationship.

FEI builds 'MySpace'-style online user community

09/26/2007  FEI Co. has launched a "MySpace"-style Web site aimed at enabling its electron microscopy customers to network online and build a user community around FEI's products.

Piezosystem jena's new amplifier enables sub-nm positioning

09/26/2007  Piezosystem jena's new compact piezo amplifier, the 12V40 CLE, is targeted to OEM customers. It features an integrated measurement system for low-voltage piezo actuators, and extremely low residual noise for sub-nm positioning.

NIST: Annealing process speeds up self-assembly for sub-30nm features

09/26/2007  September 26, 2007 - Researchers at the National Institute of Standards and Technology (NIST) say they've come up with a new "cold zone" annealing technique that processes block copolymers and other thin films to align into regular patterns of nanocylinder lines, which when chemically removed offer a pattern template for building advanced microstructures.

US court: TSMC owes $30M to UniRAM

09/26/2007  September 26, 2007 - A US District Court in Northern California has ruled that TSMC did in fact misuse trade secrets concerning embedded DRAM allegedly shared with it by UniRAM Technology, and ordered the Taiwan foundry giant to pay $30.5 million.

iSuppli: 2007 chip outlook dimmer, but rebound well underway

09/26/2007  September 26, 2007 - A current upswing in memory and electronic equipment can't offset what was a horrid performance in the first six months of the year, according to iSuppli Corp., which has again shaved its outlook for 2007 chip sales to just 3.5% growth, from expectations of 6% growth back in June. But the firm emphasizes that the worst is well behind the industry, and growth in 2008 should be a little better than anticipated.

FlipChip International Names VP Sales and Marketing for WLP and Bumping Business

09/25/2007  FlipChip International (FCI) announced the appointment of David McComb as global vice president, sales and marketing for its wafer level packaging (WLP) and bumping business. McComb, who joined FCI in 2005 as the director of European business and sales, will assume responsibilities for sales, marketing, and licensing for FCI's activities for international customers.

Seminar Series Targets Integrated Process Solutions for 3D Packaging

09/25/2007  SUSS Microtec, NEXX Systems, and Surface Technology Systems (STS), manufacturers of semiconductor process equipment, announced their collaboration with Fraunhofer IZM to demonstrate integrated process solutions for 3D wafer-level packaging (WLP).

McGee Joins Carl Zeiss SMT as North American VP of Sales

09/25/2007  Carl Zeiss SMT appointed Daniel McGee, former VP of IBM Global Alliance at KLA-Tencor, to the position of vice president of sales and service for North America. The company noted McGee's 28 years of management expertise as a key factor in their decision.