09/06/2007 Olympus Integrated Technologies America (Olympus-ITA), a subsidiary of Olympus Corporation of Japan, completed sale of its Model AL3300 wafer inspection and defect review system to a U.S.-based integrated device manufacturer (IDM). The company will use the AL3300 to inspect tops, edges, and back-sides of 300-mm wafers for bad coats, hot spots, scratches, and contamination.
09/06/2007 September 6, 2007 - Both litigants in an ongoing patent dispute involving probe card technology say a new ruling by the Korean Supreme Court lands in their favor.
09/06/2007 September 6, 2007 - Advanced Semiconductor Engineering Inc. and Mitsui High-tec Inc. have signed a multiyear (minimum five years) cross-licensing agreement to design and make hybrid manufacturing technologies (HMT), with each side sharing IP rights and technical expertise.
09/06/2007 September 6, 2007 - XMOS Semiconductor, a UK startup developing a type of programmable semiconductor technology dubbed "software defined silicon," has closed a $16 million Series A round of VC funding with support from Foundation capital, Amadeus Capital Partners, and DFJ Esprit.
09/06/2007 September 6, 2007 - Hynix Semiconductor and STMicroelectronics jointly owned chipmaking facility in Wuxi, China, has sold its 200mm line "C1" to Chinese conglomerate China Resources (Holdings) Co. Ltd. for an undisclosed amount. It's part of Hynix's plan to shift more business to its 300mm capacity, by upgrading some efficient 200mm sites and selling off others.
09/06/2007 Ling Electronics (West Haven, CT), wholly owned subsidiary of Qualmark Corporation, received military orders for electro-dynamic testing equipment, totaling more than $300,000. Ling will install the systems at a test facility serving the U.S. military and the Department of Defense (DoD), along with military-certified suppliers.
09/06/2007 September 6, 2007 - Singapore foundry Chartered Semiconductor Manufacturing Ltd. says its 3Q07 outlook is still the same as projected: breakeven profits (plus or minus $5 million), wiping out a $24.7 million loss in 2Q07, and sales of $322-$344 million, which would be flat to up about 4% from 2Q.
09/06/2007 Antares Advanced Test Technologies will detail wafer-level testing possibilities with small-pitch spring pins at the 2007 KGD Packaging & Test Workshop on September 11. The workshop will take place September 9–12 in Napa, CA.
09/06/2007 Oerlikon Solar has introduced micromorph tandem technology for conversion efficiencies of 10% and higher, and has named industry veteran Jeannine Sargent to its newly created CEO position.
09/06/2007 The Texas Enterprise Fund (TEF) has granted Authentix Inc. $1 million as part of state and local efforts to secure expansion and relocation of the company's research and development facility from Douglassville, Penn., to Addison, Texas. This investment is projected to generate $6.5 million in capital investment and will create approximately 120 jobs in Texas during the next five years.
09/05/2007 DEK and BTU International formed a strategic partnership to combine skill sets and global footprints in the photovoltaic manufacturing sector. The combined screen printing and drying systems offering will meet cost, throughput, and reliability requirements to bring solar-cell manufacturing to a commercially viable level, according to company representatives.
09/05/2007 September 5, 2007 - Synova SA and Manz Automation say they've created a hybrid tool combining their technologies: an inline laser edge isolation system for photovoltaic manufacturing of solar cells.
09/05/2007 September 5, 2007 - Kulicke & Soffa Industries Inc. says revenues for its September quarter will be about 6.6% higher than initially thought, to $226 million, primarily due to more orders for its wire bonding equipment from large subcons.
09/05/2007 September 4, 2007 - Kovio Inc. says it has raised $19.5 million in the first closing of a Series D round of funding, to help develop and commercialize products that use its proprietary printed silicon technology.
09/05/2007 September 5, 2007 - TSMC's wafer shipments are now on pace for about 18% growth in 3Q07 and another 5% in 4Q, and sales should be on the rise as well, as customers in the computing/consumer sector start to pull in shipments, according to one analyst's take.
09/05/2007 Presto Engineering Inc., a provider of product engineering services to the semiconductor industry, has announced a partnership with NanoLab Technologies Inc. to offer turn-key nanoscale engineering, test, and analytical services and thus help customers improve speed and efficiency and minimize the cost of bringing new products to market.
09/05/2007 Hynix Semiconductor reportedly developed a multichip package (MCP) with 24 stacked NAND flash memory chips, improving on its existing design, according to Korea Times.
09/05/2007 September 5, 2007 - Hynix Semiconductor reportedly has developed a multichip package with 24 stacked NAND flash memory chips, improving on its existing design, according to the Korea Times.
09/05/2007 September 5, 2007 - ChipMOS Technologies' Taiwan division has filed suit against domestic firm Walton Advanced Engineering Inc. alleging infringement of ball-grid array package-related patents used in DDR2 SDRAM devices.
09/05/2007 A new company in Austin, Texas, Nanotailor, has licensed a NASA single-walled carbon nanotube (SWCNT) fabrication process and plans to market SWCNTs by year end. "We're lowering the cost per gram while greatly improving the integrity of the nanotubes," the company says.
A new company in Austin, Texas, Nanotailor, has licensed a NASA single-walled carbon nanotube (SWCNT) fabrication process and plans to market SWCNTs by year end. "We're lowering the cost per gram while greatly improving the integrity of the nanotubes," the company says.