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Number of connected IoT devices will surge to 125 billion by 2030

10/27/2017  The number of connected Internet of Things (IoT) devices worldwide will jump 12 percent on average annually, from nearly 27 billion in 2017 to 125 billion in 2030, according to new analysis from IHS Markit.

Researchers look to patterns to envision new engineering field

10/27/2017  The phenomenon that forms interference patterns on television displays when a camera focuses on a pattern like a person wearing stripes has inspired a new way to conceptualize electronic devices. Researchers at the University of Illinois are showing how the atomic-scale version of this phenomenon may hold the secrets to help advance electronics design to the limits of size and speed.

New research explores the limits of nanomaterials and atomic effects for nanotechnology

10/26/2017  The stability of schottky and ohmic au nanocatalysts to zno nanowires.

Tiny chip-based methane spectrometer could help reduce greenhouse gas emissions

10/26/2017  New technology from IBM Research could be used to create an inexpensive sensor network that autonomously monitors for natural gas leaks.

China's first Gen6 flexible AMOLED production line put into mass production

10/26/2017  On October 26, China's first Gen6 flexible AMOLED line - BOE Chengdu Gen6 flexible AMOLED production line has put into mass production in advance.

NVIDIA, Taiwan's Ministry of Science and Technology to accelerate Taiwan AI revolution with NVIDIA AI computing platform

10/26/2017  NVIDIA today announced that it is collaborating with Taiwan's Ministry of Science and Technology (MOST) to accelerate the development of artificial intelligence across Taiwan's commercial sector in support of its recently announced AI Grand Plan to help foster domestic AI-related industries.

Bringing an additional layer of fortification to SoCs powering the next trillion connected devices

10/25/2017  ARM announces availability of new on-die technology to protect against attacks seeking to compromise sensitive information through IC power consumption (SPA/DPA) and electromagnetic emission (SEMA/DEMA).

Piezoelectrics stretch their potential with a method for flexible sticking

10/25/2017  Researchers see performance boost in novel method for connecting thin-film piezoelectric materials to flexible substrates, with potential applications for medical devices.

SEMICON Japan brings smart applications and IoT

10/25/2017  Over 30,000 attendees are expected to convene at SEMICON Japan at Tokyo Big Sight in Tokyo on December 13-15.

Power GaN: Everything is in place for volume production

10/25/2017  Yole projects the explosion of the market with 84% CAGR between 2017 and 2022. The market value will so reach US$ 450 million at the end of the period.

SiFive selects Synopsys Verification Continuum Platform for advanced RISC-V processor designs

10/24/2017  Synopsys, Inc. today announced that SiFive, the first fabless provider of customized, open-source-enabled semiconductors, has selected the Synopsys Verification Continuum platform as its verification solution.

Growth slows, but RF GaAs device revenue inches higher

10/24/2017  Strategy Analytics reports revenue for RF GaAs devices increased by slightly less than 1 percent in 2016.

STMicroelectronics announces class-leading water-resistant pressure sensor

10/24/2017  STMicroelectronics has taken underwater accuracy to new heights with its latest miniature pressure sensor, which is featured in the new Samsung Gear Fit 2 Pro.

Seoul Semiconductor's Horticultural Series LEDs deliver entire spectrum from UV-C to far-red

10/24/2017  The newly-introduced Horticultural Series LEDs from Seoul Semiconductor represent the only LED manufacturer to provide the entire spectrum of solid state lighting sources for the efficient growth and propagation of plants.

Nanotube fiber antennas as capable as copper

10/23/2017  Rice University researchers show their flexible fibers work well but weigh much less.

Researchers bring optical communication onto silicon chips

10/23/2017  Ultrathin films of a semiconductor that emits and detects light can be stacked on top of silicon wafers.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors

Development of Silicon Photonics Devices Discussed in Forum

07/09/2014  Six speakers discussed developments in designing and manufacturing silicon photonics devices in a TechXPOT North session on Wednesday morning.