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Reports: Taiwan gov seeks jail for UMC execs

08/14/2007  August 14, 2007 - Taiwanese prosecutors are pushing for jail time for former UMC chairman Robert Tsao for his company's alleged illegal technology involvement with a Chinese partner, even though a lower court recently threw out fines levied against him, according to local media reports in Taiwan.

WCJTG report: Spike RTA+ms annealing could delay introduction of complex metal gates

08/14/2007  Results shared at the recent West Coast Junction Technology Group meeting indicated a spike rapid thermal anneal followed by a millisecond laser anneal improves polysilicon gate depletion to the extent that it opens up the possibility of being able to delay the introduction of complex metal gates until the 32nm node for most applications. Also notable was the finding that a medium-power laser anneal gave much better overall results for NMOS and PMOS devices than a high-power laser anneal.

New AlwaysReady CEO Fred Allen to lead MEMS/nano commercialization

08/14/2007  AlwaysReady, Inc. has named Dr. Fred Allen as Chief Executive Officer. AlwaysReady, Inc. was created in April 2007 to create shareholder value in mPhase's leading-edge nanotechnology battery and MEMS based products.

Ametek acquires Cameca to strengthen nano analysis

08/14/2007  Ametek Inc. has acquired Cameca SAS, a manufacturer of high-end elemental analysis systems used in advanced laboratory research, semiconductor, and nanotechnology applications.

JV Installs SUSS Coater/Developer

08/14/2007  SUSS MicroTec delivered a 200-mm Gamma production coating and developer cluster to HD MicroSystems, LLC (Wilmington, DE), to support the company's polyimide and PBO material technologies. HD MicroSystems is a joint venture (JV) of Hitachi Chemical Co. Ltd. and DuPont Electronic Technologies. It will use the production cluster to support expansion into advanced packaging markets, said John Malloy, U.S. marketing and sales manager, HD MicroSystems.

Rohm & Haas, SKC forming FPD films JV

08/14/2007  August 14, 2007 - Rohm and Haas Co. and SKC Inc. are forming a joint venture to develop, manufacture and market advanced optical and functional films for use with liquid crystal and plasma flat-panel displays.

Thermo's UltraDry helps electron microscopes detect low-energy X-rays

08/14/2007  Thermo Scientific's large-area silicon drift detector now enables electron microscopes to sense very low energy X-rays down to Beryllium -- and produces clear peak separations for more confident analysis.

Atom Probe Microscope

08/13/2007  The LEAP HR microscope family enables materials science research, particularly metallurgical applications. With high (mass) resolution, researchers can examine individual atoms with compositional accuracy in voltage-pulse mode. The design is said to increase throughput and suit mechanical, electrical, and magnetic observations.

AOI Programming Software

08/13/2007  EasyPro3D hosts simplified parameterizing; an IPC-compliant, 1,600 component library, LIB2007; and updated repair station. The shortened parameter list reportedly speeds high-quality inspection with low false calls, while automatic parameter optimization (APO) allows use with all LIB2007 algorithms.

Wafer-bump, LED Cluster

08/13/2007  An advanced coating cluster, the Gamma XPress suits gold bump coating, under bump metallization or redistribution coating, high-volume LED coating, and other film-development applications based on chosen configuration. It is said to shorten lead times with flexible production setup.

High-tensile TIM

08/13/2007  Targeting long-term use and reworkable assemblies, the Keratherm 86/82 high-tensile-strength thermal interface material (TIM) is thermally conductive and electrically isolating, comprising silicone film with a fiberglass layer.

Green Materials for Flex Circuits

08/13/2007  A halogen-free, RoHS-compliant transparent epoxy polyimide laminate product line, R/flex JADE A targets flexible circuit needs in portable electronics, computing, packages, and other applications.

Advanced SEMs

08/13/2007  Nova NanoSEM 30 series of field-emission scanning-electron microscopes (SEMs) are designed to analyze and characterize a range of materials, perform lithography and deposition prototyping, and host in-situ experimentation and testing.

EC gives nod to Intel/ST flash JV

08/13/2007  August 13, 2007 - The European Commission has given its approval for the proposed new JV entity combining flash memory assets of STMicroelectronics and Intel's NOR assets and resources, saying the transaction "would not significantly impede effective competition."

August 2007 Exclusive Feature #1: METROLOGY
Separating systematic from random defects in inspection


08/13/2007  By Allen Park, KLA-Tencor Corp., Milpitas, CA, United States

EXECUTIVE OVERVIEW A powerful new method can identify systematic defects within a large defect sample, prior to SEM review. By integrating design data with defect data, this method enables accurate binning of randomly distributed structural systematic defects. Instead of relying on inefficient random review sampling to identify defects of interest (DOI), this technique applies a pattern search engine...

Report: ST eyeing Infineon bid

08/13/2007  August 13, 2007 - German chipmaker Infineon reportedly could be the target of a takeover bid from STMicroelectronics, with a potential price of 12.50 euros/share, about a 16% premium above Friday's closing price.

August 2007 Exclusive Feature #2
VLSI SYMPOSIUM REPORT: Chipmakers, consortia reveal HK+MG integration


08/13/2007  By John Borland, contributing editor, Solid State Technology

The VLSI Symposium meeting this year (June 12–14, Kyoto, Japan) revealed there will be not one, but many different solutions for the production implementation of hafnium-based oxides at the 45nm node and beyond, with Hf-based dielectric k values varying from a "medium"-k (8–12) up to a true high k of 22–24. The gate electrode for some companies will remain poly ...

Hynix picks ISi's ZRAM for DRAMs

08/13/2007  August 13, 2007 - Hynix Semiconductor Inc. will use Innovative Silicon Inc.'s (ISi) ZRAM high-density memory IP for its ZRAM chips, the first company to license the technology for DRAMs (AMD is using it for microprocessors).

Verdant Names Advisory Board

08/13/2007  Verdant Electronics named more than 15 members from packaging, interconnect, PCB, and related industries to its board of advisors, including Happy Holden, Werner Engelmaier, and others. These contributors helped frame the Occam package-first assembly method Verdant introduced, and will bring the process from concept to development, said Joe Fjelstad, president, Verdant.

Consortium Undertakes MEMS, Advanced Electronics

08/13/2007  Scotland-based R&D-focused institutions and companies founded a consortium to engage emerging technology companies in MEMS, biomedical, control electronics, remote sensing, and advanced technology sectors. The Institute for System-level Integration (iSLI), the Scottish Microelectronics Centre (SMC), Optocap, and Photonix Limited plan to provide R&D, commercial scaling, and higher-value services to U.K.-based and global industry members.