08/06/2007 Imago says its LEAP 3000 HR provides the best voltage pulse mass resolution ever offered on a commercial atom probe. The microscope also offers a large field of view and promises high data quality, microtip-based sample preparation, and rapid time-to-results rate.
08/06/2007 Several Silicon Valley companies invested as much as $200 million to launch a packaging plant in Hanoi, Vietnam. The company, Vietnam-Chipscale Advanced Packaging Services (V-Caps) will involve executives from the Silicon Valley region and the local industry in Vietnam, and could employ up to 1,500 workers initially.
08/03/2007 July 24, 2007 -- /PRWEB/ -- SAN JOSE, CA -- Modern distributed control systems (DCS) are distinguished by their model-based, business-centric approach that focuses on shared computing and unified work processes.
08/03/2007 July 24, 2007 -- /PRNewswire/ -- NEWARK, DE -- Strategic Diagnostics Inc. today announced the expansion of its product line to include hygiene monitoring, with the exclusive distribution of the Lumitester(R)PD- 10N/LuciPac(TM)W system from Kikkoman in the U.S. marketplace.
08/03/2007 July 25, 2007 -- /PRNewswire/ -- BASEL, SWITZERLAND -- Huntsman Corporation today announced that its Textiles Effects business has signed an agreement to acquire DuPont's global fluorochemical business for the nonwovens industry.
08/03/2007 Verdant Electronics will develop a PCB and PCB assembly (PCBA) technique, Occam, that eliminates soldering in favor of an encapsulation and plating process. The reverse-order interconnection process directly connects component terminations with circuit traces, and may eliminate issues with lead-free assembly.
08/03/2007 Henkel Corporation partnered with Production Automation Corporation (PAC), extending its distribution network in the U.S. and Mexico. PAC will market and support Henkel's Hysol, Loctite, and Multicore electronics assembly and semiconductor packaging materials.
08/03/2007 BCC Research finds, in "The Global Market for Advanced Electronic Packaging," the outsourced semiconductor packaging and test (OSPT) services sector outpacing conventional in-house package-and-test in growth, though outsourcing remains a $16.2B industry compared to $23.3B done in-house. The overall package-and-test market will grow from $38.5B in 2006 to $57.6B by 2011, according to the report.
08/03/2007 Oncor Electric Delivery, a business that provides power to more than three million homes and businesses in Texas, says it will implement nanotechnology this summer that will both discourage would-be criminals from stealing copper from the company's substations and switchyards and help law enforcement personnel find and prosecute thieves.
08/03/2007 First Nano, a division of CVD Equipment Corp., has shipped its first EasyTube 6000 chemical vapor deposition system. The unit is available with processes for research in the semiconductor, MEMS, nanotechnology, and solar cell markets.
08/02/2007 July 23, 2007 -- ROLLING MEADOWS, IL -- International Organization for Standardization (ISO) Standard 14644-6 Cleanrooms and controlled environments
08/02/2007 July 23, 2007 -- FAIR LAWN, NJ -- As of July 1st 2007, JDV Products Inc. is proud to announce the acquisition of Standard Pneumatic & Electronic Tool Company from the Hamilton Group located in Reno, NV.
08/02/2007 July 24, 2007 -- /PRNewswire/ -- MOORESVILLE, NC -- Anpath Group Inc. reported today that its wholly owned subsidiary, EnviroSystems, Inc. (ESI) has registered its new disinfectant, EnviroTru(TM) in 38 states.
08/02/2007 July 23, 2007 -- /PRWEB/ -- SAN JOSE, CA -- The industrial and institutional cleaning product market has come a long way from its conventional hallmark.
08/02/2007 August 2, 2007 - Qualcomm Inc. says it has taped out a chip fabricated on a low power-optimized 45nm CMOS process technology, using "very low-k" intermetal dielectrics and immersion lithography, and says it has started development work on a 40nm process.
08/02/2007 August 2, 2007 - The Semiconductor Technology Academic Research Center (STARC), which works with all of Japan's major chipmakers, will use Blaze DFM for lithography simulation and analysis in its STARCAD "certified engineering linkage" (described as "one step ahead of DFM") reference design flow, the companies announced.
08/02/2007 FormFactor Inc. says it has developed a breakthrough probing contact technology capable of full area wafer probing of high pin density, ultra fine-pitch devices. Compared to today's probing capabilities, FormFactor's new technology promises a 10x reduction in pitch (spacing between contacts), and potentially allow the probing of 1000x more contacts on a 300 mm wafer in a single touchdown.
08/02/2007 DEK will host SMTA members, customers and suppliers, and local government representatives at a grand opening for its Shenzhen, China, manufacturing facility on August 27, 2007. The facility will expand DEK's production capacity for entry-level and medium-range printer platforms, and support for Asia-Pacific customers.
08/02/2007 ISE has released a five-recipe temperature timer controller (TTC) is designed for use with virtually all process etch, strip, and develop wet-process baths.
Imago says its LEAP 3000 HR provides the best voltage pulse mass resolution ever offered on a commercial atom probe. The microscope also offers a large field of view and promises high data quality, microtip-based sample preparation, and rapid time-to-results rate.