Featured Content




CogniTek, BASF to develop high-efficiency heat exchange

08/02/2007  BASF and CogniTek believe that the unique properties of supercritical carbon dioxide and ionic liquids could transform low-temperature heat (e.g., solar) into high-value power. And so the two will partner to examine the prospect. The result would be an efficient power-generation system with integral heating and cooling.

ICE Executes Counterfeit Components Raid

08/02/2007  U.S. Immigration and Customs Enforcement (ICE) agents, assisted by electronics industry representatives, executed a large-scale raid on businesses and residences suspected of imports, sales and distribution, and installation of illegal modification chips (mods) and other IP violations. The investigation, comprising 32 federal search warrants in 16 states, and 22 ICE offices, targeted illegal chip and software manufacture for gaming consoles.

IBM Streamlines VT Package-and-test Facility

08/02/2007  IBM reportedly will lay off up to 450 employees, mostly from its systems and technologies group in upstate NY, amid cost-cutting efforts. About 90 layoffs will come from the company's site in Essex Junction, VT, notes the Associated Press (AP).

Cnano scores $6 million to develop low-cost carbon nanotube production

08/02/2007  Cnano Technology Ltd. has received $6 million in venture funding co-led by CMEA Ventures and Pangaea Ventures that included WI Harper. Cnano is focused on manufacturing carbon nanotubes and the development of applications associated with the nanotubes.

OAI adds NIL module for mask aligners

08/01/2007  August 1, 2007 - Optical Associates Inc. (OAI) says it has added a nanoimprint lithography module as an option to its mask aligners, technology provided by HP spinoff Nanoimprintsolution Inc.

Reports: Taiwan's Vanguard pushes capacity limits, preps 200mm addition

08/01/2007  August 1, 2007 - Vanguard International Semiconductor Corp. has crossed the 100% capacity utilization mark thanks mainly to trailing-edge (0.18-micron) business from TSMC and a flurry of foundry orders for LCD driver ICs, and it's banking on newly-acquired 200mm fab capacity to carry the day, according to local media reports.

OSRAM giving up display OLED biz

08/01/2007  August 1, 2007 - OSRAM Opto Semiconductors says it will stop making its "Pictiva" organic LEDs (OLEDs) for passive matrix displays by year's end, instead focusing on its OLED activities for "market-ready" lighting solutions.

Photronics cuts outlook on FPD, photomask slowdowns

08/01/2007  August 1, 2007 - Photronics Inc. says 3Q07 sales will be 6%-14% below previous projections to a range of $101-$103 million, due to a shortfall in photomask orders from FPD and European semiconductor customers.

OAI adds nano imprint lithography option for mask aligners

08/01/2007  Working with HP licensee Nanolithosolution Inc., OAI (Optical Associates Inc.) is offering nano imprint lithography as an option for all of its mask aligners -- which can then be used as imprint systems or as standard mask aligners.

FEI reports record sales for Q2 2007

08/01/2007  FEI Company reported year-over-year increases in revenue, earnings, bookings and cash and investments for the second quarter of 2007. Net sales were the highest for any quarter in the company's history, and quarterly earnings were the second-highest ever and the largest second-quarter total ever.

Plans Are Nothing; Planning Is Everything

08/01/2007  This well-worn axiom from a top military planner, General Dwight D. Eisenhower, describes the mindset necessary to survive and prevail in the melee of business.

High-speed doors serve cleanroom applications

08/01/2007  Beginning about 35 years ago, manufacturers began to recognize that to achieve greater productivity, they would need faster, more efficient internal factory transportation and logistics systems.

Single Wafer Surface Conditioning

08/01/2007  The need for back-side metal adhesion and solder contact for ultra-thin, discrete, high-power semiconductor devices has increased significantly over the past several years.

Solutions and Solvents for Removing Silicone: A Practical Guide

08/01/2007  Silicone adhesives are becoming more widely used in microelectronic hybrid assemblies due to their inherently low elastic modulus, which relieves stress between substrates with different coefficients of thermal expansion (CTE) during thermal cycling.

Points to consider for developing a USP-797 compliant cleaning and sanitization program

08/01/2007  The obvious objective in effective cleaning is the removal of contamination acquired from daily activities in the cleanroom.

Molecular matters

08/01/2007  I had some very interesting conversations at this year’s “SEMICON West” conference and exhibition in San Francisco.

Cleaning the cleanroom

08/01/2007  New technologies, chemistries and value-adds notwithstanding, cleanroom consumables are driven by two tenets for suppliers and users alike: They have to function properly and consistently, and they have to do so cost-effectively.

Hunting contaminants: Choosing the right vacuum for your cleanroom

08/01/2007  From pharmaceuticals to semiconductors, cleanrooms are highly regulated environments. Under the International Organization for Standardization’s (ISO) strict criteria put forth in 2001, manufacturers across the board have fallen under a great amount of pressure to keep cleanrooms clean and have been forced to evaluate and improve their housekeeping regimens.

Using disposables to reduce cost and increase flexibility in bioreactor processes

08/01/2007  It’s no secret that biopharmaceutical companies are moving rapidly toward disposable products for the production of protein therapeutics and vaccines.

Garments

08/01/2007  Since human-generated contamination plays a large role in critical environments, special care must be taken to provide appropriate garments to minimize the human impact on the cleanroom.