07/24/2007 July 12, 2007 -- /PRNewswire-FirstCall/ -- HILLSBORO, OR -- FEI has introduced the next generation of its popular Vitrobot(TM) cryo sample preparation tool, the Vitrobot Mark IV.
07/23/2007 July 23, 2007 - The latest monthly data from SEMI indicates soft demand at the midpoint of 2007, days after the group joined the growing chorus of industry watchers in expressing pessimism that the equipment industry will se anything above a few percentage points of growth this year.
07/23/2007 July 23, 2007 - Solaria Corp. says it has closed a $50 million Series C round of funding led by Q-Cells AG, the world's No.2 solar cell manufacturer, and has secured access to 1.35GW of power over the next 10 years to produce >2.7GW of PV modules.
07/23/2007 Alcatel Micro Machining Systems will provide two 200-mm DRIE and LTPE CVD systems at CEO/Léti-Minatec R&D institute under a joint development agreement. The parties will collaborate to develop and demonstrate a suite of turnkey silicon microvia technologies for 3D integration at wafer and die levels.
07/23/2007 RF Micro Devices, Inc. (RFMD), will expand its Beijing, China, facility with increased capacity and new advanced packaging processes to enable flip chip, wire bond, test capabilities, and proprietary self-shielding RF assemblies.
07/23/2007 During the Semicon West trade show (July 16 - 19), Brewer Science and Nantero Inc. announced the availability of "the first microelectronics-grade carbon nanotube (CNT) coating."
07/23/2007 Rogue DNA Inc., a Canadian company focused on advanced document security technology, has partnered with Revell Group International (RGI) -- a global network of former senior FBI, law enforcement, security service, intelligence, diplomatic and military officials -- which will promote
Rogue DNA's document authentication products throughout the world.
07/23/2007 Unovis Solutions signed a strategic partnership with baumann Automation (Amberg, Germany) to expand its assembly solutions and global support to semiconductor, automotive, and telecommunications assembly customers.
07/20/2007 July 20, 2007 - IBM is now ramping pilot production of its first controlled collapse chip connection new process (C4NP) production line in East Fishkill, NY, just over a year after completing initial reliability testing for 300mm C4NP solder-bumped wafers.
07/20/2007 By Bob Haavind, editorial director, Solid State Technology
3D chip packaging with through-silicon vias (TSVs) will transform the industry over the next 3–5 years, say presentations and discussions at SEMICON West. Using TSVs could enable compact packaging with increased performance. Two approaches to TSV are leading the evolution.
07/20/2007 By Françoise von Trapp, managing editor, Advanced Packaging
Material science has a firm foothold in the future of advanced packaging. At SEMICON West's Wednesday, July 18, Packaging Materials Trends TechXPOT, sponsored by IMAPS, industry experts shared insights and developments in packaging materials, their applications, and how these innovations will help device packaging address functionality, form factor, and reliability challenges.
07/20/2007 A pair of Wednesday keynotes at SEMICON West described opportunities for semiconductor suppliers in the solar energy market, but cautioned that there are fundamentally different manufacturing requirements in the two industries.
07/20/2007 Lam Research Corp. has finally revealed some of the details of the technology inside its new linear atmospheric cleaner, more than a year after dropping hints at SEMICON China in March 2006. The system targets high-selectivity cleans with short contact times
07/20/2007 Paper abstract submissions for the SMTA's Pan Pacific Microelectronics Symposium (Pan Pac), January 22–24, 2008, in Kauai, are due by July 20, 2007, with title and author contact information attached. The full presentations, if selected, will be due on November 9.
07/20/2007 Universal Instruments will hold a free seminar August 10, 2007, at its Advanced Process Laboratory in Shanghai, focusing on flip chip assembly processes, materials, and requirements. The seminar is open to customers and all interested parties.
07/20/2007 July 20, 2007 - The proposed flash memory JV combining Intel and STMicroelectronics assets is still being hashed out in regulatory red tape, but it already has a new name: "Numonyx," a play on the word "mnemonics" (the art of assisting or improving memory), according to the companies.
07/20/2007 3D chip packaging with through-silicon vias (TSV) will sweep across the industry over the next 3-5 years, based on presentations and discussions at SEMICON West. Using TSVs will enable very compact packaging offering much better performance. Many chipmaker roadmaps include 3D as an interim step from the 45nm to the 32nm node, sources said.
07/20/2007 New kits from Concentris GmbH enable researchers entering into the field of nanomechanical-cantilever sensors to start work based on thoroughly described functionalization protocols and measurement procedures.
07/20/2007 Carl Zeiss MicroImaging's SteREO Discovery.V20 microscope is designed for R&D, QA, and other applications, and claims the industry's greatest field of view, zoom range, and resolution. It allows visualization of large specimens and their fine details without changing objectives or eyepieces.
Carl Zeiss MicroImaging's SteREO Discovery.V20 microscope is designed for R&D, QA, and other applications, and claims the industry's greatest field of view, zoom range, and resolution. It allows visualization of large specimens and their fine details without changing objectives or eyepieces.