07/20/2007 July 19, 2007 - Advanced Metrology Systems (AMS, formerly Philips AMS) has released three new metrology tools this week, offering model-based infrared (MBIR) metrology for 3D DRAM structures, and a surface wave system for multilayer measurements of copper/low-k films stacks.
07/20/2007 July 19, 2007 - Amid a batch of product rollouts this week, Entegris Inc. has unveiled a new line of high-flow liquid filters for sub-45nm contamination control, and an add-on to its 193nm litho reticle haze tool targeting deep-ultraviolet lithography.
07/20/2007 July 19, 2007 - Carl Zeiss SMT says more than 10 of its Starlith 1900i immersion lithography optical lenses have been qualified for integration into ASML's Twinscan XT:1900i wafer scanners, with one tool already shipped to an end user.
07/19/2007 July 19, 2007 - A handful of industry executives were recognized this week by SEMI for contributions to standards development for the semiconductor and related industries.
07/19/2007 July 10, 2007 -- /FDA News/ -- The European Food Safety Authority (EFSA) and the U.S. Food and Drug Administration (FDA) signed the first U.S./European agreement in the area of assessing food safety risk on July 2.
07/19/2007 At Wednesday's (July 18) Packaging Materials Trends TechXPOT, sponsored by IMAPS, industry experts shared insights and developments in packaging materials and applications, and how innovations will help device packaging address functionality, form factor, and reliability challenges.
07/19/2007 At SEMICON West, SEMATECH is discussing many of the themes from papers it presented at the VLSI Symposium, including its gate first/high-k metal-inserted poly stack (MIPS) electrode approach instead of FUSI or replacement gates. "We chose a path that was more manufacturable and fits in more easily with existing technologies in terms of scalability, contamination prevention, and integration," said Raj Jammy, director of frontend processes, in a pre-show interview with WaferNEWS.
07/19/2007 July 19, 2007 - SUSS MicroTec AG has introduced the iVista high-resolution digital microscope targeting wafer-level testing applications such as device characterization, reliability test and failure analysis.
07/19/2007 IBM installed its first controlled collapse chip connection new process (C4NP) production line in East Fishkill, ramping for lead-free solder bumps on cost-sensitive semiconductor packages. The manufacturing line, supplied by SUSS MicroTec (Munich, Germany) comprises mold-fill, inspection, and transfer steps. "C4NP offers lower-cost bumping with improved quality, and suits lead-free, cost-sensitive consumer products," said Barry Hochlowski.
07/19/2007 SUSS MicroTec has launched its new 300mm SOI wafer bonder, ELAN CBC300SOI. The system boasts significant throughput and cost-of-ownership improvements over other options.
07/19/2007 By Françoise von Trapp, managing editor
For the second consecutive year, Kulicke & Soffa and Advanced Packaging Magazine partnered to bring the Interconnect Symposium to SEMICON West. "Part of our obligation to you is to make everyone smarter by sharing knowledge," noted Scott Kulicke, CEO, Kulicke & Soffa, in his welcome address.
07/19/2007 SEMICON West, July 16–20 in San Francisco, is featuring next-generation semiconductor and package test technologies on the exhibit floor, in presentations, and during the show's TechXPOTS. Following are the probe-testing product announcements from Scanimetrics, Wentworth Labs, and SUSS.
07/19/2007 Advanced Packaging and Solid State Technology Magazines presented the Attendee's Choice Awards (ACAs) in six front-end and final manufacturing categories to exhibitors at SEMICON West. The awards were voted on by show attendees, and presented on the tradeshow floor.
07/19/2007 The main topics for discussion at Applied Materials' press event on Tuesday were about high-k/metal gate processes (HK+MG) and double patterning lithography, though much of the talks concentrated on the gate technology -- and how they created the delicately etched iceblocks serving as table centerpieces.
07/19/2007 Last night SST named the winners of our fifth annual Attendees Choice Awards at SEMICON West, spotlighting companies' technologies on both the wafer processing and final manufacturing sides of the fab that customers voted as the industry's best in terms of innovation, cost-of-ownership, and best solution to a problem. Congrats to our six winners: Olympus Micro-Imaging, FEI, Olympus Integrated Technologies America, SUSS MicroTec, Tessera, and FormFactor.
07/19/2007 In one of his famous tour-de-force portraits of the progression of semiconductor technology, Paolo Gargini, Intel Fellow and director of technology strategy, linked past developments to the future in a SEMICON West keynote talk. An overflow room with piped-in video was needed to accommodate attendees.
07/19/2007 Surrey NanoSystems has won a major order for its carbon nanotube growth tool from ITA, the advanced technologies research institute in Trapani, Sicily.
07/19/2007 July 18, 2007 - Jerry Coder, president emeritus of Dupont Electronic Technologies' semiconductor materials business, has been appointed as the new chairman of SEMI's board of directors, succeeding Hermes-Epitek CEM Archie Hwang.
