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Electronics Epoxy

07/16/2007  EP33 room-temperature-cure epoxy adhesive suits high-temperature bonding applications between similar and dissimilar surfaces, and withstands 205–235°C. The epoxy is said to offer good physical and dielectric properties for strong bonds and resists thermal cycling, chemical deterioration, and concentrated radiation.

SEMICON West Kicks Off

07/16/2007  SEMICON West celebrates achievements and future technologies in the industry, and networks equipment and materials suppliers with package developers, research institutes, press, and customers. Selma Uslaner has served Solid State Technology Magazine for the past 50 years, and as tribute, the magazine held a reception at the Ritz-Carlton, kicking off SEMICON. Following are event highlights, along with product previews and industry updates.

Around the Exhibits at SEMICON West

07/16/2007  The exhibition at SEMICON West, July 17–19 in San Francisco, hosts product introductions and demonstrations, technical talks, networking events, and other happenings. Following are the tradeshow offerings from IMEC, Antares, Cymer, NY Loves Nanotech, Kyzen, and X-tek.

Synopsys beefs up portfolio with Mosaid's DDR controller IP

07/16/2007  July 16, 2007 - Synopsys Inc. has agreed to purchase certain of Mosaid Technologies Inc.'s semiconductor IP assets, consisting mainly of DDR memory controllers and phase-locked loop product families, for $15 million in cash, to bolster its DesignWare IP portfolio of standards-based connectivity IP.

NY firm rolls out nanowire deposition tools

07/16/2007  July 16, 2007 - First Nano, a division of CVD Equipment Corp., has unveiled two solid source deposition systems specifically for producing semiconducting nanowires, saying that solid sources such as gallium and zinc powders are less expensive and safer than conventional metal organic sources used in metal organic vapor deposition chemical vapor deposition (MOCVD) methods for manufacturing LEDs.

TechXPOT at SEMICON West: MEMS

07/16/2007  Discera, Inc., chief technology officer (CTO) Wan-Thai Hsu will present "The New Heart Beat for Electronics — MEMS Oscillators," at the Emerging Technologies and Markets TechXPOT, July 18, during SEMICON West, July 16–20 in San Francisco.

ATDF and UMC to jointly evaluate and commercialize new technologies

07/16/2007  ATDF, a global R&D foundry for nanoelectronics, and the Taiwanese global semiconductor foundry and SoC solution provider UMC, have agreed to extend their existing collaboration to evaluate emerging technology products and bring to market those that are most promising.

FEI's next-gen cryo sample prep tool designed for ease of use

07/16/2007  FEI's high-throughput Vitrobot Mark IV is designed for applications where colloidal structures need to be characterized and analyzed. It enables fixation of structures within ultra-thin vitrified ice layers so that samples can withstand the high voltages of TEMs for imaging.

Samsung 2Q chip numbers soft, but 2007 capex may be higher

07/13/2007  July 13, 2007 - After posting a Samsung Electronics posted a six-year low in fiscal-year profits in 2Q07, but the company indicated it actually could exceed its 2007 capex plans, and maybe increase 2008 capex as well.

TIS at SEMICON: GE Sensing

07/13/2007  GE Sensing's HygroTrace moisture meter will be highlighted in the Technology Innovation Showcase (TIS) during SEMICON West, July 16–20 in San Francisco. The meter uses aluminum oxide sensors with a proprietary process technology, which allows the conventional sensors to make faster, more accurate measurements of moisture percentages in high-purity gases.

Consortia Update: Unovis

07/13/2007  The Unovis Solutions 2007 Area Array Consortium reviewed its research tracks, updating member companies and institutions on the progress of lead-free solder joint research, reliability in printed circuit materials, underfilling, and other topics.

Process control firm Tevet tacks on new funding

07/13/2007  July 13, 2007 - Days after appointing a new CEO and president, Israeli metrology firm Tevet Process Control Technologies Ltd. says it has received $2.75 million in new financing, including support from the VC arm of customer Intel Corp.

SEMICON West Preview

07/13/2007  SEMICON West, July 16–20 in San Francisco, will feature more than 1,250 exhibitors in the Moscone Center from the 17th, highlighting new products, processes, and materials. Following are products to look for at the show from Juki, FINETECH, CHAD Industries and Asymtek, Kester, and Wentworth Labs.

EPA releases Nanoscale Materials Stewardship Program drafts for comment

07/13/2007  The U.S. Environmental Protection Agency has just released several documents relating to its Nanoscale Materials Stewardship Program, and is inviting public comment on them. Tune in by attending a meeting on August 2, or signing on to the effort's email list.

InterCrossIP partners for thin film deposition commercialization

07/13/2007  Licensing and commercialization firm InterCrossIP Management LLC, which specializes in enabling materials for electronics, solar, MEMS, bioMEMS, and medical applications, has signed agreements with two organizations for commercialization of a thin film deposition technology that promises unique benefits.

Qimonda sampling 75nm ultralow-power mobile RAM

07/12/2007  July 12, 2007 - Qimonda AG says it has started sampling ultralow-power 512Mbit DRAM devices for mobile applications, using a 75nm low-power trench technology, that consume just 20% of power as equivalent-density standard DRAMs. Target end-devices include smart/feature phones, portable GPS, digital cameras, and MP3 players.

Cadence Extends SiP Design

07/12/2007  Cadence Design Systems will integrate its system-in-package (SiP) technology into Virtuoso custom design and Encounter digital-IC design platforms, to optimize automation, integration, reliability, and repeatability in package introduction. Additional features include logical co-design connectivity and authoring support, and multi-chip-design simulations.

DEK Names Business Manager

07/12/2007  DEK appointed Aram Kardjian as western regional business manger, promoting developing applications such as materials deposition in semiconductor packaging, medical electronics, fuel cells, and other markets. He will also be responsible for customer support, and implementing and supporting growth targets and corporate development in the western U.S.

FDA extends GRAS approval LISTEX(TM) to all food products

07/12/2007  July 3, 2007 -- /PRNewswire/ -- WAGENINGEN, THE NETHERLANDS -- The FDA and USDA announced today they have approved LISTEX(TM) P100, the natural bacteriophage product against listeria, as GRAS (Generally Recognized as Safe), for all food products.

Jacobs receives EPCM contract from Novartis

07/12/2007  July 3, 2007 -- /PRNewswire-FirstCall/ -- PASADENA, CA -- Jacobs Engineering Group Inc. announced today that it is providing engineering, procurement, and construction management services for Novartis' new manufacturing facility to be located in Holly Springs, NC.