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EVG Integrates Probing Solutions

07/11/2007  EV Group (EVG) signed a distribution agreement to globally provide SemiProbe's manual, semi-automatic, and automatic probing systems to bonding and alignment system customers. The partnership with a wafer-level probe supplier allows EVG users to test wafers pre- and post-bond with stand-alone or integrated SemiProbe tools.

Piezosystem jena GmbH debuts nanopositioner

07/11/2007  The German firm piezosystem jena has introduced nanoMIPOS400 CAP, which complements the company's MIPOS 500 lens positioning system for microscopes. It provides nano-scale positioning and targets biology, medicine, and laser technology.

Industry Update 2007

07/10/2007  Interview with Dave Seeger, IBM

As we reach the midpoint of 2007, Advanced Packaging interviewed Dave Seeger at IBM Research to discuss an updated perspective on the current industry, future developments, and challenges advanced technologies face. Seeger explored the merits of being environmentally friendly and pursuing a competitive advantage; new technologies, materials, modeling techniques, and processes that will further Moore's law; lead-free reliability; and more.

Final score: Half-Pitchers 0.00000035, Red Brick Walls 0.000000022

07/10/2007  Looks like the US has a lot to learn from European soccer superiority, even in the nanoscale world. ETH Zurich took home three top prizes in last weekend's nanogram demonstration at the RoboCup games, placing first in all three skills tests -- a goal-to-goal "2mm dash" (316ms), slalom around fixed polymer photoresist posts patterned onto the "field" (583ms), and ball handling drill (3 goals in 3 minutes).

IMEC looks to the future as SEMICON West opens

07/10/2007  As another SEMICON West opens, IMEC's experts discussed with WaferNEWS what they see are they major keys to the future of semiconductor industry: exploring new markets, bringing finFETs into manufacturing, mastering 3D integration, and addressing sub-32nm low-k deposition challenges.

PACKAGING BEAT: SEMICON West Preview: More assembly and test than ever

07/10/2007  As usual, the challenge for SEMICON West attendees is prioritizing among the many options to make the best use of your time. SEMICON West seems to have more "extras" than ever, and this year many of them are focused on assembly and test.

SEMICON WEST TiS PREVIEW: Quantum modeling software, diamond films, and nanoimprint tools start to go mainstream in semiconductors

07/10/2007  Despite the fact that it's done much of its manufacturing in nanoscale dimensions for years, the semiconductor industry hasn't yet had much use for the unique nanoscale properties of the nanoparticles, nanowires, quantum dots, etc. usually considered nanotechnology, nor found much use for the nanoscale patterning processes developed by the chipmakers. But that may be starting to change, judging by the crop of emerging technologies selected for SEMICON West's Technology Innovation Showcase.

Takumi showcases automatic repair of litho hot spots

07/10/2007  As the industry marches from 90nm to 65nm and 45nm, it has become increasingly difficult to achieve fast yield ramp due to random defects, process variations, and other design-for-manufacturing (DFM) issues localized in layout hot spots. Hoping to become the leading company bridging the gap between IC design and manufacturing is Takumi Technology with its automatic layout repair/optimization software.

SEMI, SIA join hands to thwart counterfeiting of electronics components

07/10/2007  Companies faced with the widespread problem of counterfeit electronics components often find themselves in a double bind -- not only do they lose money when counterfeit components enter the supply chain, but their brand equity can suffer if the fraud becomes public knowledge. In an exclusive pre-SEMICON West interview, industry groups SIA and SEMI spoke with WaferNEWS about their new joint efforts to develop authentication standards to help fight the growing counterfeiting conundrum.

EU research group reports working 32nm CMOS SRAM

07/10/2007  July 10, 2007 - PULLNANO, a European Commission-sponsored research project, says it has developed a functional demo of a CMOS SRAM built with 32nm design rules.

FormFactor, Elpida partner for "holistic" test ROI

07/10/2007  July 10, 2007 - FormFactor Inc. and Elpida Memory have formed a strategic partnership to help Elpida reduce its annual test costs by creating a "test solution roadmap" that takes "a holistic view that examines the entire test function and its place in the manufacturing process," the companies said.

NXP buys micro line from Sharp

07/10/2007  July 10, 2007 - NXP Semiconductors (n

Microchip Orders Teradyne Test Platforms

07/10/2007  Teradyne, Inc., will ship a volume order of J750 family and FLEX test platforms to Microchip Technology, Inc., for microcontroller testing. The follow-on order extends through 2009. Microchip will test high-performance dsPIC digital signal controllers (DSCs) and other products in its microcontroller lines.

Nantero, HP join to explore flex-electronics apps

07/10/2007  Nantero, Inc. says it is working with HP to explore the use of HP inkjet technology and Nantero's carbon nanotube formulation to create flexible electronics products and develop low-cost printable memory applications.

SMTAI Highlights New Technologies, Programs

07/10/2007  The SMTA plans to debut several programs — from tutorials to an exhibition — at SMTA International (SMTAI) in Orlando, October 7–11, 2007. The program includes a keynote from Andrew Alduino, panel discussions, an informal "chat" program on the show floor, and other events designed to help attendees gather and share information, and network with constructive industry partners.

Grandis awarded NSF grant for electron-spin memory

07/10/2007  Grandis, Inc. has received a Small Business Innovation Research (SBIR) Phase I grant from the National Science Foundation (NSF) to develop and commercialize spin-transfer torque random-access memory (STT-RAM). STT-RAM is a next-generation non-volatile technology designed to enable excellent scalability and unlimited endurance with low power and fast read/write capability.

Rohm and Haas invests $60M in 193 nm immersion litho system

07/09/2007  June 26, 2007 -- /PRNewswire-FirstCall/ -- MARLBOROUGH, MA -- Rohm and Haas Electronic Materials will invest $60 million in leading-edge lithography equipment to support its extensive research and development of advanced 193 nm photoresist and anti-reflective coatings used in the manufacture of semiconductor devices.

Delphon Industries acquires cleanroom tape manufacturer

07/09/2007  June 26, 2007 -- /PRNewswire/ -- HAYWARD, CA -- Today, Delphon Industries announced its acquisition of UltraTape Industries of Salem, OR. UltraTape is a manufacturer of adhesive tapes used in cleanroom environments.

MKS' LIQUOZON(R) LoopO3 selected by SEZ AG

07/09/2007  June 26, 2007 -- /PRNewswire-FirstCall/ -- WILMINGTON, MA -- MKS Instruments, Inc. has announced that SEZ AG has selected MKS' LIQUOZON(R) LoopO3 dissolved ozone systems for its next-generation single wafer processors.

Ampac Fine Chemicals automates regulatory compliance with Oracle(R) applications

07/09/2007  June 20, 2007 -- /PRNewswire-FirstCall/ -- REDWOOD SHORES, CA -- Oracle today announced that Ampac Fine Chemicals (AFC) has deployed Oracle(R) E-Business Suite financial, procurement, and manufacturing capabilities to help facilitate regulatory compliance, improve operational efficiency.