06/20/2007 May 30, 2007 /PRNewswire/ -- LAWRENCE, KS -- IdentiGEN, a leading provider of DNA-based solutions to the agriculture and food industries, today announced the official opening of its North American laboratories and facilities in Kansas in the heart of America's meat industry.
06/20/2007 May 30, 2007 -- /PRNewswire/ -- NEW YORK, NY -- Secure Symbology, Inc. (SSI) today announced the details of an exclusive collaboration agreement with the former Pharmaceutical Technology & Services (PTS) group of Cardinal Health.
06/20/2007 May 24, 2007 -- /PRNewswire-FirstCall/ -- WASHINGTON, DC -- Danaher Corporation announced today that it has signed a definitive agreement to acquire ChemTreat Inc.
06/20/2007 May 24, 2007 -- /PRNewswire/ -- IRVINE, CA -- Inscent, Inc. has received a Small Business Innovative Research grant from the U.S. National Science Foundation to develop a novel biosensor that will protect public health and national security.
06/20/2007 May 25, 2007 -- ROLLING MEADOWS, IL -- IEST continues to offer valuable online education classes in the ongoing Access the Experts series. "Cleanroom Housekeeping" will be presented Thursday, August 30, 2007.
06/20/2007 June 20, 2007 - North American-based manufacturers of semiconductor manufacturing equipment saw sales and orders not quite as good in May as they were in April, but one bright spot is a continued slight uptick in demand for their tools, according to the latest monthly data from SEMI.
06/20/2007 Veeco Instruments has released its new Innova Scanning Probe Microscope (SPM) for physical, materials, and life science applications. The unit promises atomic resolution equal to that of systems costing many thousands more, and offers a range of modes.
06/20/2007 North America-based semiconductor equipment manufacturers posted $1.67 billion in bookings and billings in May, based on a three-month average, bringing the book-to-bill to 1.00 for the month, according to SEMI's report. Values in both segments are up from May of 2006 and from April 2007.
06/20/2007 Nominations for this year's Foresight Nanotech Institute Feynman Prizes for Nanotechnology -- as well as related Communications and Student prizes -- are being accepted now until June 30.
06/20/2007 IMEC, the independent nanoelectronics research center in Leuven, Belgium, has ordered Akrion Inc.'s 300mm single-wafer surface preparation system, Velocity. IMEC will use the 4-chamber Velocity to develop and test new back- and front-end-of-line process recipes for IC device manufacturing at the 32 nm technology cycle.
06/20/2007 In an exclusive interview with WaferNEWS, Mukesh Khare, project manager for IBM's high-k/metal-gate development, discusses details of the company's new high-k/metal-gate (HK+MG) transistor technology, a "gate first" approach that keeps the same processing sequence used by traditional SiON gates, allowing for both technologies to be run on the same line and minimizing integration costs. "We picked the approach that is simple, scalable, and also migrate-able," he explained.
06/19/2007 By Terence Q. Collier, contributing editor
If you want to know the latest and greatest on how to test complete packages, the BiTS Workshop provides an opportunity to interact with peers, suppliers, and other renegades. However, if die- and wafer-level testing is your niche, the complementary equivalent is an exciting show held annually at Paradise Point (yes, it is as great as it sounds) in San Diego: IEEE's SWTest Workshop, held June 36, 2007.
06/19/2007 Freescale Semiconductor named Lisa Su, Ph.D., as senior vice president and chief technology officer (CTO), leading the company's global technical R&D activities. Su served previously as VP of semiconductor R&D at IBM, and received her electrical engineering education at Massachusetts Institute of Technology (MIT).
06/19/2007 ASM International released its MEMS Materials Database: Packaging Module, a licensed database containing mechanical, physical, processing, and component data for materials selection in MEMS packaging. The database targets improvements to time-to-market, reliability, and design and manufacturing of MEMS devices.
06/19/2007 This year's VLSI Symposium (June 12-14, Kyoto, Japan) revealed there will be not one, but many different solutions for the production implementation of hafnium-based oxides at the 45nm node and beyond -- e.g., poly or MIPS gate electrodes, single- or dual-metal, and various gate process flow integration approaches, from gate-first to gate-last and even a hybrid. The question is, how long can the industry support these multiple approaches? Will they converge beyond the 32nm node -- if at all?
06/19/2007 June 19, 2007 - Klaus Schruefer, chief scientist for Infineon's multigate FET technology project, tells WaferNEWS why mugFETs are being pushed out beyond 32nm, and what's highest on the to-do list to get the technology ready for chip manufacturing, even by the 22nm node.
06/19/2007 Laser system provider XSiL completed a relocation and renovation project, moving its headquarters to a larger, more modern facility in Dublin's Sandyford enterprise center.
06/19/2007 Our series of product and event previews leading up to SEMICON West 2007, July 1620 in San Francisco, continues with summaries of exhibits from Micro Control Company, Hyphenated Systems, Siemens, Ultratech, DfR Solutions, JPSA, Synopsys, and more.
06/19/2007 IT service provider Dimension Data Germany is now the exclusive German distributor of Nanoident multimodal biometric security solutions for corporate home offices.
06/19/2007 June 19, 2007 - Matsushita Electric Industrial Co. says it has begun the "world['s] first" mass production of 45nm LSI chips at its factory in Uozu, central Japan, using ArF immersion lithography (NA>1) with "proprietary super-resolution enhancement technology" and multilayer wiring using low-k dielectrics.