10/03/2017 Today, SEMI announced the lineup of keynotes coming to SEMICON Japan's "SuperTHEATER" -- focusing on the future of the electronics manufacturing supply chain.
10/02/2017 The SEMI International Standards Committee, at their SEMICON West 2017 meeting, approved the transformation of the existing 3D Stacked IC Committee and Assembly & Packaging Committee into a single, unified 3D Packaging and Integration Committee.
10/02/2017 Graphene is a sheet of carbon one atom thick, and it has drawn worldwide attention as a new material. A Japanese research group discovered that pressure is generated by simply stacking graphene oxide nanosheets. They also found that the pressure can be increased by reducing the interlayer distance through heat treatment. It is an innovative approach for applying high pressure without using an enormous amount of energy.
10/02/2017 Quantum dots are nanometre-sized semiconductor particles with potential applications in solar cells and electronics. Scientists from the University of Groningen and their colleagues from ETH Zürich have now discovered how to increase the efficiency of charge conductivity in lead-sulphur quantum dots.
Conventional planar flash memory technology is approaching critical scaling limitations that are driving the transition to 3D solutions. 3D NAND is expected to scale in height, from 16-bit-tall strings to string heights of more than 128 bits. Meanwhile NAND makers will find ways of placing these strings closer to each other through more aggressive lithography.
09/29/2017 The Semiconductor Industry Association (SIA) released the following statement today from SIA president & CEO John Neuffer in support of the corporate tax reform framework released today by leaders in the Trump Administration and Congress.
09/29/2017 EPFL scientists have now greatly improved the operational stability of PSCs, retaining more than 95% of their initial efficiencies of over 20 % under full sunlight illumination at 60oC for more than 1000 hours.
09/28/2017 OEM Group announced today a post-dice clean solution on the proven Cintillio Batch Spray platform following plasma and laser dicing methods.
09/28/2017 SK Hynix Inc. announced its board of directors yesterday approved its plan to participate in a Bain Capital-led consortium that plans to purchase Toshiba Corporation's memory chip unit, Toshiba Memory Corporation
09/28/2017 The patent, the first ever for a thin III-V layer on crystalline silicon thin-film, covers group III-V elements such as Gallium Arsenide (GaAs), and Indium Gallium Phosphide (InGaP), for the top layer, as well as all inorganic materials, including, silicon, germanium, etc., for the bottom layer.
09/28/2017 Silicon Mobility announced today the opening of an office in Burlingame, CA. The office is located close to San Francisco international airport at the gate entry of the Silicon Valley.
09/28/2017 The LED lighting module industry is showing the emergence of innovative functions and the introduction of new market segments including automotive, smart lighting and horticultural markets.
