05/17/2007 The U.K. Department for Environment, Food, and Rural Affairs (DEFRA) has published the results of a study that explored how nanotechnologies could cut the use of non-renewable energy sources and reduce greenhouse gas emissions. The study investigated the opportunities and potential obstacles to adoption of a number of environmentally beneficial nanotechnologies.
05/17/2007 The Semiconductor Industry Research Center of CCID Consulting reports that mobile phone production in China experienced typically slow growth in Q'01 2007 from Q'04 2006, but overall grew 45.7% in 2006. The mobile phone chip market did not slow as much as mobile phone production, due in part to the increasing prevalence of smart phones.
05/17/2007 May 16, 2007 - A pair of Texas-based substrate equipment providers, NexTech Solutions (inspection/handling) and FAS Technologies LLC (coating), have agreed to merge into a single legal entity.
05/17/2007 May 16, 2007 - Applied Materials was the biggest supplier of equipment to flat-panel display manufacturers in 2006 with just under $1 billion in sales, after seeing its business grow 24%-30% each of the last two years, according to recent rankings from VLSI Research Inc.
05/16/2007 May 4, 2007 -- /PRNewswire/ -- OXFORD, UNITED KINGDOM -- Midatech Group Ltd. has announced the opening of its specialist design and manufacturing facility for cGMP grade nanoparticles in Bilbao, Spain.
05/16/2007 May 4, 2007 -- VALENCIA, CA -- UltraViolet Devices, Inc. (UVDI), a leading manufacturer of products for air and water treatment, is pleased to announce being awarded a multi-million dollar contract from a Fortune 500 worldwide leader in innovative operating room products.
05/16/2007 May 3, 2007 -- /PRWEB/ -- Union, NJ -- The FDA has again gone public with a press release, this time regarding a formal request to Shelhigh, Inc. to voluntarily recall all of its medical devices remaining in the marketplace, including hospital inventories, ostensibly due to sterility concerns.
05/16/2007 May 3, 2007 -- /FDA News/ -- PLYMOUTH, MA -- On 5/02/07, SmartPak Canine executed a voluntary nationwide recall on all lots of LiveSmart Adult Lamb and Brown Rice food.
05/16/2007 May 3, 2007 -- WALTHAM, MA -- PerkinElmer, Inc. has announced new online curriculum to support customers in the pharmaceutical, clinical and other heavily regulated industries with training on regulatory compliance topics.
05/16/2007 May 3, 2007 -- /MARKET WIRE/ -- SAN DIEGO, CA -- Althea Technologies, Inc. announced today it has completed the initial phase of construction on its new 30,000 sq. ft. cGMP manufacturing facility.
05/16/2007 It looks like cotton candy as its being synthesized, but has the strength of carbon steel. It is as electrically conductive as copper at 50MHz and is thermally conductive. It has application possibilities across military, aerospace, and semiconductor markets. Is it any wonder that Nanocomp Technologies, the company that manufactures this carbon nanotube (CNT) textile, received the New Hampshire High Tech Council's "Product of the Year" in 2006?
05/16/2007 May 16, 2007 - Extending 193nm lithography through the 45nm and 32nm nodes while EUV litho struggles to gain traction will require performance improvements such as multilayer patterning and multiple exposure schemes, driving more use of spin-on patterning materials (aka resists), according to a report from Linx Consulting. Analyst Mark Thirsk reviews his firm's outlook for the resist market, indicating which areas will see the most growth and where are the best chances for market opportunities.
05/16/2007 SAES Getters Group and STMicroelectronics have agreed to incorporate SAES' PageWafer technology into ST's multi-axis gyroscopes, with a goal of delivering higher sensitivity and stability for angular-speed measurement.
05/16/2007 STATS ChipPAC Ltd. will establish a Singapore R&D facility for through-silicon via (TSV), microbumping, die embedding, and advanced substrate technologies to create advanced packages. Core operations will focus on wafer-level processing and advanced wafer integration.
05/15/2007 Amkor Technology, Inc. (Chandler), and United Test and Assembly Center Ltd. (UTAC Singapore) entered a multi-year cross-licensing agreement wherein UTAC will adopt Amkor's MLF technology and Amkor will use UTAC's QFN patents. The deal covers intellectual property rights (IPR) and transfer of associated packaging technologies.
05/15/2007 AMD Penang ordered its first Datacon 8800 FC Quantum flip chip bonder, and is expected to add more in the coming months, to began producing single- and multi-flip chip assemblies for high-end processors. This marks Datacon's first order for flip chip equipment from an integrated device manufacturer (IDM).
05/15/2007 SEMX Corporation, the parent company of Semiconductor Packaging Materials (SPM), appointed Paul Nikac and Vito Tanzi as executive vice presidents of the corporation, following Kenneth J. Huth's retirement.
05/15/2007 Keynoters, workshops, tutorials, and panel discussions covering wild-and-wacky to practical will highlight this year's DAC, June 48 in San Diego. The conference will host 161 papers, eight special sessions, seven full-day tutorials, eight panels, 18 pavilion panels, and seven hand-on tutorials in its 44th year. Technical presentations, submitted from 25 countries, cover electronics design from design for manufacture (DfM) to low-power design and a range of other topics.
05/15/2007 International SEMATECH, the consortium of nanoelectronics manufacturers, will expand its existing R&D program at the Center of Excellence in Nanoelectronics and Nanotechnology at the University at Albany in New York. The expansion is the largest in the history of the consortium.